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SPEAR600-2

STMicroelectronics

SPEAR600-2 by STMicroelectronics

SPEAR600-2 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 30 MHz. It has 84 I/O lines and is suitable for industrial applications.

Median Price

$21.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$21.060

100+ parts

-

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37

$21.060

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Vyrian

USA . 7,604 parts In-Stock

1+ parts

-

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-

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-

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7,604

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Digiode

USA . 4,488 parts In-Stock

1+ parts

-

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4,488

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-

-

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Anansix

USA . 879 parts In-Stock

1+ parts

-

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879

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Sunrise Surplus Inc.

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Andel Nordic

Denmark . 4,679 parts In-Stock

1+ parts

$3.566

100+ parts

-

1k+ parts

$3.423

10k+ parts

$3.423

4,679

$3.566

-

$3.423

$3.423

Semicontronic

India . 1,336 parts In-Stock

1+ parts

$7.000

100+ parts

$6.825

1k+ parts

$6.790

10k+ parts

-

1,336

$7.000

$6.825

$6.790

-

AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$14.687

100+ parts

-

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895

$14.687

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Vigor

Singapore . 1,841 parts In-Stock

1+ parts

$20.170

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1,841

$20.170

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Continental Prestige Electronics

USA . 4,534 parts In-Stock

1+ parts

$21.060

100+ parts

-

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$20.639

4,534

$21.060

-

-

$20.639

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$21.060

100+ parts

-

1k+ parts

$20.007

10k+ parts

$19.586

2,000

$21.060

-

$20.007

$19.586

Ampacity Inc.

Singapore . 689 parts In-Stock

1+ parts

$26.000

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689

$26.000

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

1+ parts

$27.030

100+ parts

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$24.327

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1,284

$27.030

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$24.327

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$28.134

100+ parts

$26.728

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$26.728

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1,000

$28.134

$26.728

$26.728

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Aztec Data Supply Inc.

USA . 2,272 parts In-Stock

1+ parts

$40.300

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2,272

$40.300

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MKK Technologies

India . 344 parts In-Stock

1+ parts

$50.827

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344

$50.827

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DigiPath Technology Company

USA . 344 parts In-Stock

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$50.827

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344

$50.827

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Corohmni

South Africa . 238 parts In-Stock

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$56.981

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238

$56.981

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Lixinc

USA . 13,763 parts In-Stock

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13,763

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Microchip USA

USA . 5,720 parts In-Stock

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5,720

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QUARKTWIN TECHNOLOGY LTD

USA . 5,686 parts In-Stock

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5,686

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Corphita

USA . 3,114 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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RC Electronics

USA . 984 parts In-Stock

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984

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Metaverse IC Inc.

Canada . 187 parts In-Stock

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187

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Argo Parts USA

USA . 81 parts In-Stock

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81

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Parana Technologies

USA . 11 parts In-Stock

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$32.318

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11

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$32.318

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Overview

Discover the cutting-edge SPEAR600-2 microcontroller by STMicroelectronics, a true game-changer in the world of electronics. With its superior quality and advanced technology, this microcontroller offers unparalleled performance and reliability. Perfect for a wide range of applications, the SPEAR600-2 delivers exceptional value and benefits to customers. Say goodbye to limitations and hello to endless possibilities with this remarkable product. Experience the advantages of STMicroelectronics and unlock the full potential of your projects with the SPEAR600-2 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material choice provides a good balance of durability and cost-effectiveness for the microcontroller, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into electronic circuit boards, making it convenient for manufacturers and developers.

Maximum Supply Voltage: 1.1 V

With a maximum supply voltage of 1.1 V, this microcontroller ensures efficient power consumption, reducing the overall energy requirements of the system and increasing its energy efficiency.

Package Shape: SQUARE

The square package shape offers a compact form factor, allowing the microcontroller to be easily incorporated into space-constrained designs without compromising functionality.

Bit Size: 32

Boasting a 32-bit architecture, this microcontroller can handle complex computational tasks and process large amounts of data, making it suitable for high-performance applications.

Power Supplies (V): 1.1, 1.8/2.5, 3.3

This microcontroller supports a wide range of power supply options, providing flexibility for powering the device in different environments and voltage requirements.

No. of Terminals: 420

With 420 terminals, this microcontroller offers a high level of connectivity and expandability, enabling seamless integration with peripheral devices and additional components.

Package Style (Meter): GRID ARRAY

The grid array package style ensures secure and reliable connections, enhancing the microcontroller's durability and resistance to mechanical stress, making it suitable for harsh operating conditions.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95 V allows for operating in low-power environments, making it suitable for battery-powered applications or energy-efficient systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand relatively high temperatures, providing reliability and versatility in various industrial or outdoor environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can perform reliably in extreme cold conditions, expanding its usability in diverse applications.

Terminal Finish: TIN SILVER

The tin silver terminal finish enhances the microcontroller's solderability and corrosion resistance, ensuring reliable electrical connections and prolonged lifespan.

ADC Channels: YES

The presence of ADC (Analog-to-Digital Converter) channels allows the microcontroller to interface with analog sensors or signals, enabling accurate measurement and data acquisition for precise control and monitoring applications.

DMA Channels: YES

With built-in DMA (Direct Memory Access) channels, this microcontroller enables efficient data transfer between peripherals and memory, reducing the processor's workload and improving overall system performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and component placement, improving the overall manufacturability and making it user-friendly for assembly processes.

Maximum Seated Height: 2.06 mm

With a maximum seated height of 2.06 mm, this microcontroller offers a low-profile design, making it suitable for applications with strict height constraints or compact devices.

Width: 23 mm

The 23 mm width of the microcontroller ensures compatibility with standard PCB layouts, facilitating easy integration into existing designs and simplifying system development.

Maximum Clock Frequency: 30 MHz

The maximum clock frequency of 30 MHz enhances the microcontroller's processing speed and responsiveness, making it suitable for time-critical applications or demanding computational tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds that the microcontroller can withstand at peak reflow temperature ensures robustness during the soldering process, simplifying the manufacturing process and ensuring reliable connections.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can endure high-temperature soldering processes, ensuring proper solder joint formation and reliable performance.

Length: 23 mm

The 23 mm length of the microcontroller contributes to its compact design, allowing for space-efficient integration or installation in various electronic devices.

Temperature Grade: INDUSTRIAL

Designed and tested for industrial temperature ranges, this microcontroller guarantees reliable operation even in challenging environments, making it suitable for industrial automation or robust applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC (Reduced Instruction Set Computer) architecture, it offers simplified instruction sets, faster execution times, and efficient power utilization, making it advantageous for embedded systems and real-time applications.

Technology: CMOS

Based on CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microcontroller provides low power consumption, reduced noise interference, and compatibility with a wide range of digital components.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and mechanical stability, making it suitable for applications with high vibration or mechanical stress.

Nominal Supply Voltage: 1 V

With a nominal supply voltage of 1 V, this microcontroller achieves a balance between low power consumption and operational requirements, providing efficiency and flexibility for various applications.

ROM Programmability: FLASH

The ROM programmability of the microcontroller using flash memory allows for flexibility in storing program code or firmware, facilitating easy updates or modifications during the product lifecycle.

Terminal Pitch: 1 mm

The 1 mm terminal pitch provides a standard and widely used spacing, simplifying board-level interconnections and making it compatible with various socket or connector options.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller has a moderate level of moisture sensitivity, ensuring that it can withstand specific moisture exposure during storage or handling without compromising performance or reliability.

Speed: 30 rpm

With a speed rating of 30 revolutions per minute, this microcontroller is capable of precise control over motor or rotational applications, offering versatility in motion control systems.

No. of I/O Lines: 84

With 84 I/O lines, this microcontroller provides extensive input and output capabilities, enabling connectivity and communication with a wide range of external devices, sensors, or actuators.

Technical Specifications

Microcontrollers SPEAR600-2 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B420

JESD-609 Code:

e2

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

84

No. of Terminals:

420

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA420,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1,1.8/2.5,3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.06 mm

Speed:

30 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SPEAR600-2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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