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RHFLVDS2281K1

STMicroelectronics

RHFLVDS2281K1 by STMicroelectronics

RHFLVDS2281K1 by STMicroelectronics is a dual-function CMOS cross-point switch designed for military applications. It operates at a nominal voltage of 3.3 V, with max switch-on/off times of 2.5 ns and a wide temp range from -55 °C to 125 °C. Ideal for high-speed signal routing in harsh environments.

Median Price

$2,070.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 13 parts In-Stock

1+ parts

$2,070.720

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13

$2,070.720

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DigiKey

USA . 1 parts In-Stock

1+ parts

$2,070.730

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-

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1

$2,070.730

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Arrow

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$1,466.500

1k+ parts

$1,449.050

10k+ parts

-

5

-

$1,466.500

$1,449.050

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,052 parts In-Stock

1+ parts

$1,666.804

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4,052

$1,666.804

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Vyrian

USA . 5,568 parts In-Stock

1+ parts

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5,568

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Anansix

USA . 1,902 parts In-Stock

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1,902

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,266 parts In-Stock

1+ parts

$2.361

100+ parts

-

1k+ parts

$2.125

10k+ parts

-

1,266

$2.361

-

$2.125

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MKK Technologies

India . 1,216 parts In-Stock

1+ parts

$4.439

100+ parts

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1,216

$4.439

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DigiPath Technology Company

USA . 1,216 parts In-Stock

1+ parts

$4.439

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1,216

$4.439

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Corphita

USA . 866 parts In-Stock

1+ parts

$1,579.077

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866

$1,579.077

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Parana Technologies

USA . 1,717 parts In-Stock

1+ parts

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100+ parts

$2.823

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1,717

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$2.823

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Overview

Elevate your designs with the RHFLVDS2281K1 from STMicroelectronics, a leader in cutting-edge technology. This high-performance multiplexer delivers exceptional reliability and precision for mission-critical applications, boasting a robust military-grade design that withstands extreme conditions. With its compact flatpack form factor and rapid switching capabilities, it’s the ideal choice for aerospace, defense, and industrial systems, ensuring seamless operation and long-term value for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This robust package material provides excellent protection against environmental factors, making the product reliable in harsh conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, enabling integration into high-density circuits.

No. of Functions: 2

Having multiple functions in a single device reduces the need for multiple components, simplifying design and minimizing cost.

Package Shape: RECTANGULAR

The rectangular shape ensures easy placement on PCBs and helps in better space management within designs.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage is compatible with a wide range of applications, particularly in modern digital circuits.

No. of Terminals: 64

A high number of terminals allows for extensive connectivity options, making it suitable for intricate designs and configurations.

Package Style (Meter): FLATPACK

Flatpack style provides a low profile, facilitating compact designs and improving thermal performance.

Maximum Operating Temperature: 125 °C

This high operating temperature rating ensures reliable performance in demanding thermal environments.

Minimum Operating Temperature: -55 °C

Withstanding extreme low temperatures, this device is ideal for applications in aerospace and military environments.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout and connection, enhancing the design possibilities.

Maximum Seated Height: 2.92 mm

A low seated height facilitates integration into ultra-thin devices, catering to modern design trends.

Width: 8.76 mm

This compact width allows for efficient layout in space-constrained applications.

Other IC type: CROSS POINT SWITCH

The cross point switch functionality caters to a range of signal routing applications, adding versatility to the product.

Minimum Supply Voltage (Vsup): 3 V

Supports operation at lower voltages, contributing to lower overall power consumption and enhancing battery life in portable applications.

Maximum Switch-on Time: 2.5 ns

Fast switch-on time improves overall system performance, making it suitable for high-speed applications.

Length: 21.11 mm

The specific length is optimized for current PCB layouts and designs, ensuring compatibility across various implementations.

Maximum Switch-off Time: 2.5 ns

Quick switch-off time enhances the device's responsiveness, crucial for time-sensitive applications.

Temperature Grade: MILITARY

MILITARY grade specifications ensure reliability and performance in extreme conditions, ideal for defense and aerospace applications.

Total Dose (V): 300k Rad(Si)

High total dose tolerance makes this product suitable for radiation-prone environments, such as space applications.

No. of Channels: 8

Eight channels provide ample routing options, making it suitable for complex signal management tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall circuit efficiency.

Terminal Form: FLAT

Flat terminal form allows for better contact and ease of soldering, facilitating reliable connections.

Terminal Pitch: 0.635 mm

Standard terminal pitch ensures compatibility with common PCB layouts, simplifying PCB design and manufacturing.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage allows for flexibility in power supply design while maintaining optimal operational effectiveness.

Technical Specifications

Multiplexers & Switches RHFLVDS2281K1 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-CDFP-F64

Length:

21.11 mm

No. of Channels:

8

No. of Functions:

2

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.92 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

2.5 ns

Maximum Switch-on Time:

2.5 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

FLAT

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Width (mm):

8.76 mm

Trade Compliance

RHFLVDS2281K1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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