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PM8903

STMicroelectronics

PM8903 by STMicroelectronics

STMicroelectronics PM8903 is a VOLTAGE-MODE BUCK SWITCHING REGULATOR with 16 terminals in CHIP CARRIER package. It operates at 1100 kHz, suitable for applications requiring 2.8-6V input voltage and compact design with 1mm seated height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,987 parts In-Stock

1+ parts

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4,987

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Digiode

USA . 2,805 parts In-Stock

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2,805

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Anansix

USA . 297 parts In-Stock

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297

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,447 parts In-Stock

1+ parts

$1.267

100+ parts

-

1k+ parts

$1.140

10k+ parts

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1,447

$1.267

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$1.140

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MKK Technologies

India . 2,132 parts In-Stock

1+ parts

$2.382

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2,132

$2.382

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DigiPath Technology Company

USA . 2,132 parts In-Stock

1+ parts

$2.382

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2,132

$2.382

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AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$15.970

100+ parts

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821

$15.970

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Component Stockers USA

USA . 525 parts In-Stock

1+ parts

$99.990

100+ parts

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525

$99.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,425 parts In-Stock

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7,425

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Microchip USA

USA . 6,990 parts In-Stock

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6,990

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Corphita

USA . 4,896 parts In-Stock

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4,896

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Parana Technologies

USA . 549 parts In-Stock

1+ parts

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100+ parts

$1.515

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549

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$1.515

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Experience the superior quality and reliability of the PM8903 by STMicroelectronics, a leading manufacturer in the industry. This innovative switching regulator offers a wide range of applications in voltage-mode control, with a compact square package shape for easy surface mount installation. Providing a nominal input voltage of 3.3V, the PM8903 delivers exceptional performance with a maximum switching frequency of 1100 kHz. Customers can trust in the value and benefits this product brings, with its efficient pulse width modulation control technique and buck switcher configuration. Say goodbye to energy inefficiency and hello to optimized power management with the PM8903.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating automated assembly processes.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easier placement on PCBs.

No. of Terminals: 16

Provides ample connectivity options and versatility for various circuit configurations.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for precise regulation of output voltage, enhancing stability and performance.

Maximum Seated Height: 1 mm

Low profile design helps in compact and sleek device designs.

Maximum Switching Frequency: 1100 kHz

High switching frequency allows for efficient power conversion and reduced power losses.

Nominal Input Voltage: 3.3 V

Supports common input voltage levels, making it compatible with a wide range of applications.

Control Technique: PULSE WIDTH MODULATION

PWM control technique enables precise regulation of duty cycle, leading to stable and efficient power conversion.

Switcher Config: BUCK

Buck configuration is commonly used for step-down voltage conversion, making it suitable for various power supply applications.

Minimum Input Voltage: 2.8 V

Wide input voltage range provides flexibility and compatibility with different power sources.

Technical Specifications

Switching Regulators & Controllers PM8903 attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

ADJUSTABLE OUTPUT VOLTAGE DOWN TO 0.6 V, ALSO OPERATES FROM 2.9 VOLT TO 5.5 VOLT SUPPLY

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.8 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1100 kHz

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

PM8903 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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