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MP34DT02

STMicroelectronics

MP34DT02 by STMicroelectronics

MP34DT02 by STMicroelectronics is a compact consumer IC designed for industrial applications, featuring a -40 °C to 85 °C operating temp range. It operates on a supply voltage of 1.64V to 3.6V and has a no-lead design with a max height of just 1.16mm. Ideal for space-constrained environments, it ensures reliable performance in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,855 parts In-Stock

1+ parts

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3,855

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Anansix

USA . 1,098 parts In-Stock

1+ parts

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1,098

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Digiode

USA . 900 parts In-Stock

1+ parts

-

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$3.233

100+ parts

-

1k+ parts

$2.910

10k+ parts

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768

$3.233

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$2.910

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MKK Technologies

India . 1,190 parts In-Stock

1+ parts

$6.079

100+ parts

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10k+ parts

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1,190

$6.079

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DigiPath Technology Company

USA . 1,190 parts In-Stock

1+ parts

$6.079

100+ parts

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1,190

$6.079

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Corphita

USA . 2,017 parts In-Stock

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2,017

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Parana Technologies

USA . 593 parts In-Stock

1+ parts

-

100+ parts

$3.865

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10k+ parts

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593

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$3.865

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Overview

Experience unparalleled audio quality with the MP34DT02 from STMicroelectronics, a leader in innovative technology. This compact and reliable MEMS microphone excels in diverse applications, from consumer electronics to industrial devices, ensuring crystal-clear sound capture in any environment. With its robust temperature range and surface-mount design, the MP34DT02 enhances your products' performance while offering exceptional value and peace of mind. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for a compact design and is ideal for high-density circuit boards, making the product suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on the PCB, leading to more efficient layouts for electronic assemblies.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and performance in everyday electronic devices.

No. of Terminals: 4

With 4 terminals, the IC is easy to integrate into various circuits while maintaining simplicity in design and manufacturing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can function reliably in diverse environments, enhancing its applicability in consumer electronics.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this IC suitable for outdoor and extreme environment applications.

Terminal Position: BOTTOM

Bottom terminal positioning can improve thermal performance and allow for efficient PCB layout, enhancing overall device reliability.

Maximum Seated Height: 1.16 mm

A low seated height helps in creating thinner and more compact shadowing on circuit boards, facilitating slimmer device designs.

Width: 3 mm

The narrow width makes the IC an excellent choice for space-constrained applications, allowing for more efficient use of PCB real estate.

Minimum Supply Voltage (Vsup): 1.64 V

The low minimum supply voltage ensures compatibility with low-power applications, contributing to battery efficiency in portable devices.

Length: 4 mm

The short length allows for compact circuit designs and can fit easily into smaller electronic gadgets.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC is rugged and suitable for harsh operating conditions and long-term reliability.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making this IC a great choice for performance-sensitive consumer applications.

Terminal Form: NO LEAD

No lead terminal form reduces the footprint on the PCB, which is advantageous for miniaturized device designs.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage allows flexibility in power supply choices and compatibility with various electronic systems.

Technical Specifications

Other Function Consumer ICs MP34DT02 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-XBGA-N4

Length:

4 mm

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

LGA4,2X2(UNSPEC)

Package Shape:

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.64 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

MP34DT02 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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