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MP23AB02B

STMicroelectronics

MP23AB02B by STMicroelectronics

STMicroelectronics' MP23AB02B is a 3-terminal analog circuit in a rectangular grid array package. It operates b/w -40 to 85 °C with Vsup ranging from 1.6V to 3.6V, suitable for industrial applications requiring precise signal processing in compact designs. The surface-mount plastic/epoxy package measures 3.35mm x 2.5mm with a low seated height of 1.08mm, making it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,855 parts In-Stock

1+ parts

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3,855

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Connector Distribution Corp

USA . 3,190 parts In-Stock

1+ parts

-

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3,190

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Right Parts Inc.

USA . 3,190 parts In-Stock

1+ parts

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3,190

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Vyrian

USA . 2,822 parts In-Stock

1+ parts

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2,822

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Anansix

USA . 885 parts In-Stock

1+ parts

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885

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,136 parts In-Stock

1+ parts

$20.393

100+ parts

-

1k+ parts

$18.353

10k+ parts

-

1,136

$20.393

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$18.353

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MKK Technologies

India . 1,920 parts In-Stock

1+ parts

$38.347

100+ parts

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1,920

$38.347

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DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

$38.347

100+ parts

-

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1,920

$38.347

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Corphita

USA . 2,705 parts In-Stock

1+ parts

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2,705

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Parana Technologies

USA . 1,154 parts In-Stock

1+ parts

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100+ parts

$24.383

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1,154

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$24.383

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Overview

Experience the cutting-edge technology and unmatched performance of the MP23AB02B by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality products that exceed customer expectations. The MP23AB02B falls under the category of Other Function Semiconductors, offering a wide range of applications for various industries. With its compact package body material and surface mount capabilities, this product provides convenience and versatility in design. Trust STMicroelectronics for reliable and innovative solutions that bring value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and insulation for the semiconductor, making it resistant to environmental factors and ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort in the manufacturing process.

Nominal Supply Voltage (Vsup): 1.8 V

Operating at a low nominal supply voltage of 1.8V can help reduce power consumption and heat dissipation, making the product more energy-efficient.

No. of Terminals: 3

Having a small number of terminals simplifies the connection process and reduces the chances of wiring errors, improving reliability and ease of use.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this semiconductor can withstand elevated temperatures without performance degradation, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at a low minimum temperature of -40 °C allows for reliable performance in cold environments, expanding the range of applications where this semiconductor can be used.

Width (mm): 2.5 mm

The compact width of 2.5mm makes this semiconductor suitable for applications where space is limited, offering flexibility in design and layout.

Minimum Supply Voltage (Vsup): 1.6 V

With a minimum supply voltage of 1.6V, this semiconductor can operate at lower power levels, enabling energy-efficient performance in various electronic systems.

Technical Specifications

Other Function Semiconductors MP23AB02B attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PBGA-B3

Length:

3.35 mm

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.08 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.6 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

MP23AB02B Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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