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M74HC4538TTR

STMicroelectronics

M74HC4538TTR by STMicroelectronics

M74HC4538TTR by STMicroelectronics is a CMOS dual-function prescaler/multivibrator with a 375 ns propagation delay. It operates b/w 2-6 V and features a compact 16-terminal package. Ideal for military applications, it withstands temperatures from -55 °C to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,682 parts In-Stock

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7,682

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J2 Sourcing AB

Sweden . 4,907 parts In-Stock

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Bristol Electronics

USA . 3,317 parts In-Stock

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3,317

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Dan-Mar Components

USA . 3,317 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Electronics Depot

USA . 2,206 parts In-Stock

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Anansix

USA . 1,570 parts In-Stock

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Digiode

USA . 562 parts In-Stock

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IDEA Electronic Components Group

UK . 133 parts In-Stock

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$17.066

100+ parts

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$15.359

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133

$17.066

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$15.359

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AZTECH Wire

Italy . 92 parts In-Stock

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$17.820

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92

$17.820

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MKK Technologies

India . 2,045 parts In-Stock

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$32.092

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$32.092

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DigiPath Technology Company

USA . 2,045 parts In-Stock

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$32.092

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$32.092

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Perfect Parts

USA . 35,372 parts In-Stock

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35,372

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,541 parts In-Stock

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Microchip USA

USA . 4,711 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,694 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,518 parts In-Stock

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Infinite Electronics LLP (Excess)

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Parana Technologies

USA . 1,131 parts In-Stock

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$20.405

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Corphita

USA . 303 parts In-Stock

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Kepictronics

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Overview

Unlock precision and efficiency with the M74HC4538TTR from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a versatile prescaler and multivibrator ideal for a wide range of applications, from timers to frequency dividers. This robust component ensures reliable performance across extreme temperatures, providing you with unmatched stability. Elevate your designs with superior functionality and durability—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and protection against environmental factors, ensuring the longevity of the device.

Surface Mount: YES

Surface mount technology offers smaller sizes and improved performance, making it ideal for compact designs.

No. of Functions: 2

Having two functions increases versatility, allowing for multifunctional applications in design and circuit integration.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, facilitating easier layout and routing of other components.

Nominal Supply Voltage / Vsup: 4.5 V

The nominal supply voltage is within the standard range for many electronic devices, ensuring compatibility with existing systems.

Power Supplies (V): 2/6

Supports a wide range of power supply voltages, enhancing flexibility in various applications and reducing design constraints.

No. of Terminals: 16

With 16 terminals, it offers plenty of connection points for comprehensive interfacing in sophisticated circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile minimize space usage on the PCB, making it suitable for high-density applications.

Propagation Delay (tpd): 375 ns

A propagation delay of 375 ns ensures fast operation, suitable for applications where timing is critical.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating allows for reliable performance in extreme conditions, ideal for military and industrial applications.

Minimum Operating Temperature: -55 °C

The ability to function at low temperatures widens the range of environments where this device can reliably operate.

No. of Data/Clock Inputs: 2

Two data/clock inputs provide more configuration options, supporting improved data handling for complex applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent conductivity and resistance to corrosion, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates better mounting options, making installation easier in various designs.

Maximum Seated Height: 1.2 mm

The low seated height supports designs that require a slim profile without sacrificing performance.

Width: 4.4 mm

The compact width allows for efficient use of space, especially in space-constrained applications.

Output Polarity: COMPLEMENTARY

Complementary output polarity increases circuit design options, enhancing versatility in output functional requirements.

Minimum Supply Voltage (Vsup): 2 V

Lower minimum supply voltage extends the range of compatible circuits, making it versatile for battery-operated devices.

Length: 5 mm

The short length contributes to its compact footprint, making it suitable for high-density configurations.

Temperature Grade: MILITARY

Designed to military specifications, ensuring high performance and reliability in critical applications.

Technology: CMOS

CMOS technology provides lower power consumption and higher speed, making this device energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and handling during assembly, improving manufacturability.

Packing Method: TR

Tray packing allows for easy handling and automated assembly processes, enhancing convenience for manufacturers.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for tighter spacing on PCBs, enabling more compact designs.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6 V provides flexibility for varied applications while ensuring stable operation.

Technical Specifications

Prescaler & Multivibrators M74HC4538TTR attributes and parameters. Explore more Prescaler & Multivibrators devices from STMicroelectronics

Specs

Additional Features:

RETRIGGERABLE

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

375 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

M74HC4538TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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