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M74HC221AC1R

STMicroelectronics

M74HC221AC1R by STMicroelectronics

M74HC221AC1R by STMicroelectronics is a Prescaler & Multivibrator with 2 functions, operating at a supply voltage range of 2-6V. It features a propagation delay of 53ns and operates in industrial temperature grade. This chip carrier package is suitable for applications requiring complementary output polarity and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

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2,034

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-

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Vyrian

USA . 1,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,192

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Digiode

USA . 220 parts In-Stock

1+ parts

-

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220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$19.602

100+ parts

-

1k+ parts

$17.642

10k+ parts

-

999

$19.602

-

$17.642

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MKK Technologies

India . 1,820 parts In-Stock

1+ parts

$36.861

100+ parts

-

1k+ parts

-

10k+ parts

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1,820

$36.861

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DigiPath Technology Company

USA . 1,820 parts In-Stock

1+ parts

$36.861

100+ parts

-

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-

10k+ parts

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1,820

$36.861

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Corphita

USA . 2,916 parts In-Stock

1+ parts

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2,916

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Parana Technologies

USA . 449 parts In-Stock

1+ parts

-

100+ parts

$23.438

1k+ parts

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10k+ parts

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449

-

$23.438

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Overview

Unlock the power of precision with the M74HC221AC1R by STMicroelectronics. Crafted with excellence and expertise, this prescaler & multivibrator offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this versatile chip carrier delivers reliability and efficiency like no other. With a nominal supply voltage of 5V and a propagation delay of only 53 ns, this innovative product ensures seamless operation in any environment. Experience the superior quality and value that STMicroelectronics brings to every project with the M74HC221AC1R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material which helps in reducing overall weight of the product

Surface Mount: YES

Allows for easy and efficient installation on PCBs

No. of Functions: 2

Provides versatility and flexibility in circuit design

Nominal Supply Voltage / Vsup (V): 5

Standard voltage for many electronic applications

Propagation Delay (tpd): 53 ns

Fast response time for efficient operation

Technical Specifications

Prescaler & Multivibrators M74HC221AC1R attributes and parameters. Explore more Prescaler & Multivibrators devices from STMicroelectronics

Specs

Additional Features:

NON-RETRIGGERABLE; TRIGGERABLE FROM CLEAR INPUT ALSO

Family:

HC/UH

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

M74HC221AC1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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