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M74HC4040TTR

STMicroelectronics

M74HC4040TTR by STMicroelectronics

M74HC4040TTR by STMicroelectronics is a 12-bit asynchronous digital counter with a max frequency of 20 MHz and operates b/w 2-6 V. It features a compact SOIC package, ideal for space-constrained applications. With a propagation delay of just 220 ns, it ensures fast counting operations.

Median Price

$27.222

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

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$27.222

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600

$27.222

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Vyrian

USA . 5,231 parts In-Stock

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Digiode

USA . 2,749 parts In-Stock

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Anansix

USA . 1,097 parts In-Stock

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1,097

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Global Solutions Electronics Company

USA . 500 parts In-Stock

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500

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ComSIT Distribution GmbH

Germany . 177 parts In-Stock

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Bristol Electronics

USA . 23 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 1,608 parts In-Stock

1+ parts

$8.114

100+ parts

-

1k+ parts

$7.790

10k+ parts

$7.790

1,608

$8.114

-

$7.790

$7.790

AZTECH Wire

Italy . 121 parts In-Stock

1+ parts

$8.250

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121

$8.250

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IDEA Electronic Components Group

UK . 686 parts In-Stock

1+ parts

$10.392

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$9.353

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686

$10.392

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$9.353

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MKK Technologies

India . 1,816 parts In-Stock

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$19.542

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1,816

$19.542

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$19.542

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1,816

$19.542

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Microchip USA

USA . 4,892 parts In-Stock

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Corphita

USA . 4,062 parts In-Stock

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4,062

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Assy Fe

Spain . 2,921 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,558 parts In-Stock

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2,558

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Parana Technologies

USA . 1,273 parts In-Stock

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$12.426

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1,273

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$12.426

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Overview

Elevate your designs with the M74HC4040TTR from STMicroelectronics, a top-tier digital counter renowned for its reliability and performance. Featuring robust construction and military-grade quality, this compact solution seamlessly integrates into various applications, from industrial automation to consumer electronics. Experience precision counting with low power consumption and exceptional speed, ensuring your projects thrive in demanding environments. Trust in STMicroelectronics for unmatched innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides durability and protection against environmental factors.

Surface Mount: YES

Being surface mount compatible allows for easy integration into compact circuit designs, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient use of PCB space and simplifies layout processes.

No. of Bits: 12

Having 12 bits enables counting capabilities of up to 4096, making it suitable for various digital counting applications.

Nominal Supply Voltage / Vsup: 4.5 V

The nominal supply voltage indicates a standard operating range, ensuring compatibility with common voltage systems.

Load Capacitance (CL): 50 pF

The low load capacitance enhances speed and performance, making it ideal for high-frequency applications.

Power Supplies (V): 2/6

The ability to operate between 2V to 6V allows for versatile use in various electronic designs, accommodating different power needs.

No. of Terminals: 16

Having 16 terminals facilitates connections for various functions and improves signal integrity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications, like portable devices.

Maximum I (ol): 4 Amp

A maximum output current of 4 Amps allows the device to drive larger loads, enhancing its application range.

Propagation Delay (tpd): 220 ns

The short propagation delay improves the device's responsiveness, making it suitable for high-speed operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates reliability and performance in challenging environments.

Trigger Type: NEGATIVE EDGE

Negative edge triggering helps in synchronizing with other digital circuits and reduces false triggering.

Minimum Operating Temperature: -55 °C

The ability to operate in low temperatures enhances the product's reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent solderability and long-term reliability in connections.

Terminal Position: DUAL

Dual terminal positions provide flexibility in design and layout, aiding in easier assembly.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact design, minimizing the overall height of the circuit.

Width: 4.4 mm

A narrow width means it can be used in tighter layouts, perfect for portable and miniaturized devices.

Minimum Supply Voltage (Vsup): 2 V

Running from a low minimum supply voltage allows it to be powered by batteries or low-power sources.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds indicates good thermal stability during the soldering process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates compatibility with modern soldering techniques, ensuring reliability.

Length: 5 mm

A compact length makes it easy to incorporate into various designs without significantly affecting overall dimensions.

Temperature Grade: MILITARY

A military temperature grade enhances the device’s reliability in demanding applications, making it suitable for defense technologies.

Maximum Frequency At Nominal Supply: 20 MHz

A high maximum frequency capability allows for fast counting and processing, supporting performance-driven applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing efficiency.

Packing Method: TR

TR packing method is suitable for automated assembly processes, enhancing production efficiency.

Operation Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible design implementations, meeting diverse application needs.

Terminal Pitch: 0.65 mm

A small terminal pitch enables a greater number of connections in a compact area, optimizing board layout.

Count Direction: UP

Counting in the UP direction is intuitive for various applications, ensuring ease of use.

Minimum fmax: 24 MHz

A minimum frequency of 24 MHz ensures the product can operate well in high-speed environments.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, guiding the user on proper handling and storage.

Maximum Supply Voltage (Vsup): 6 V

The product can function within a versatile voltage range, accommodating various power supply designs.

Technical Specifications

Digital Counters M74HC4040TTR attributes and parameters. Explore more Digital Counters devices from STMicroelectronics

Specs

Count Direction:

UP

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

NO

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Operation Mode:

ASYNCHRONOUS

Moisture Sensitivity Level (MSL):

3

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

NEGATIVE EDGE

Width:

4.4 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC4040TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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