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M74HC237RM13TR

STMicroelectronics

M74HC237RM13TR by STMicroelectronics

STMicroelectronics M74HC237RM13TR is a CMOS Decoder & Driver with 54ns propagation delay, 4.5V nominal voltage, and 16 terminals. It operates in a temperature range of -55 to 125 °C, suitable for military-grade applications requiring fast signal processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,645 parts In-Stock

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Vyrian

USA . 8,772 parts In-Stock

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Digiode

USA . 2,606 parts In-Stock

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Bristol Electronics

USA . 1,200 parts In-Stock

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1,200

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Anansix

USA . 634 parts In-Stock

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634

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Component Electronics Inc.

Canada . 74 parts In-Stock

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74

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Distributors (Availability)

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Microchip USA

USA . 488 parts In-Stock

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$7.471

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488

$7.471

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IDEA Electronic Components Group

UK . 1,820 parts In-Stock

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$18.487

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$16.639

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$18.487

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$16.639

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AZTECH Wire

Italy . 492 parts In-Stock

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$20.450

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492

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MKK Technologies

India . 1,494 parts In-Stock

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$34.764

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1,494

$34.764

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DigiPath Technology Company

USA . 1,494 parts In-Stock

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$34.764

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$34.764

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Kepictronics

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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Corphita

USA . 2,625 parts In-Stock

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Parana Technologies

USA . 1,622 parts In-Stock

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$22.104

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GreenTree Electronics

Israel . 1,200 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 1,200 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,200 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the M74HC237RM13TR by STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch performance and durability in every product. The M74HC237RM13TR falls under the Decoder & Drivers category, offering versatile applications and unmatched efficiency. With a nominal supply voltage of 4.5V and a maximum operating temperature of 125 °C, this decoder is perfect for a wide range of electronic projects. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations and provides exceptional value to customers looking for high-quality components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package of this product durable and ensures it can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 54 ns

The low propagation delay at nominal supply ensures efficient and fast processing of signals, making this product ideal for applications where timing is crucial.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of this product on a PCB, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for reliable operation of the decoder and drivers.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can operate effectively in harsh environments without compromising performance.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers M74HC237RM13TR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

ADDRESS LATCHES; 2 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

54 ns

Propagation Delay (tpd):

270 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

M74HC237RM13TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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