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M48T37V-10MH1E

STMicroelectronics

M48T37V-10MH1E by STMicroelectronics

M48T37V-10MH1E by STMicroelectronics is a CMOS real-time clock with an 8-bit data bus and operates at 3.3 V. It features interrupt capability, a max supply voltage of 3.6 V, and comes in a compact SOIC package. Ideal for timers in various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,003 parts In-Stock

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Digiode

USA . 525 parts In-Stock

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Anansix

USA . 308 parts In-Stock

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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Semi Source

USA . 3 parts In-Stock

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Connector Distribution Corp

USA . 3 parts In-Stock

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Right Parts Inc.

USA . 3 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 719 parts In-Stock

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$1.000

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719

$1.000

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AZTECH Wire

Italy . 895 parts In-Stock

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$8.140

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895

$8.140

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Microchip USA

USA . 285 parts In-Stock

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$22.024

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$22.024

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Corohmni

South Africa . 429 parts In-Stock

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$53.685

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$53.685

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$78.176

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$70.358

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MKK Technologies

India . 489 parts In-Stock

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$147.005

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$147.005

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DigiPath Technology Company

USA . 489 parts In-Stock

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$147.005

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Kepictronics

USA . 7,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,593 parts In-Stock

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Corphita

USA . 2,334 parts In-Stock

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Parana Technologies

USA . 1,046 parts In-Stock

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$93.471

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Perfect Parts

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Overview

Experience precision timing with the M48T37V-10MH1E from STMicroelectronics, a trusted leader in innovation and quality. This reliable real-time clock offers exceptional accuracy and low power consumption, making it ideal for a range of applications, from automotive systems to consumer electronics. With its robust design and user-friendly features, you gain not only superior performance but also peace of mind, ensuring your projects run smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environments, making the product well-suited for diverse applications.

Information Access Method: PARALLEL, DIRECT ADDRESS

This access method provides quick and efficient retrieval of data, enhancing performance in scenarios requiring rapid response times.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs, which is invaluable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V supports compatibility with a wide range of power systems while ensuring safety and efficiency.

Package Shape: RECTANGULAR

A rectangular package shape facilitates organized layout on PCBs, leading to improved design and assembly processes.

No. of Bits: 8

An 8-bit architecture offers a good balance of performance and resource utilization, making it suitable for various applications.

Power Supplies (V): 3.3

Designed for a nominal supply voltage of 3.3 V, it is optimized for modern low-power applications, ensuring energy efficiency.

No. of Terminals: 44

With 44 terminals, the product provides ample connectivity options for integrations across different systems and functionalities.

Interrupt Capability: Y

The interrupt capability allows the timer to respond promptly to events, enhancing its usability in time-sensitive applications.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This compact package style is perfect for high-density applications where space is at a premium.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows for flexibility in power supply selections, supporting a broader range of applications.

Maximum Operating Temperature: 70 °C

Rated for operation up to 70 °C, this timer can function reliably in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

Its ability to operate from 0 °C ensures functionality in various environmental conditions, enhancing its versatility.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and reduces corrosion, ensuring reliable operation over time.

Terminal Position: DUAL

The dual terminal position allows for improved electrical performance and ease of soldering during assembly.

Maximum Seated Height: 3.05 mm

A low profile ensures compatibility with various designs, making it easier to integrate into low-profile equipment.

Width: 8.56 mm

A narrow width helps in saving space on PCBs, enabling more compact device designs.

External Data Bus Width: 8

An 8-bit external data bus enables efficient data handling and simplifies communication with microcontrollers.

Maximum Clock Frequency: 0.032 MHz

While low, this clock frequency is adequate for many timing applications, ensuring effective performance without excessive power draw.

Length: 18.1 mm

A reasonable length aids in fitting the product into compact devices, maximizing design efficiency.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures that the product can be employed in standard operating environments effectively.

Peripheral IC Type: TIMER, REAL TIME CLOCK

As a dedicated timer and real-time clock IC, it provides focused functionalities necessary for precise timekeeping applications.

Technology: CMOS

CMOS technology enhances power efficiency, making this product ideal for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and improves the mechanical strength of connections.

Minimum Time: SECONDS

The ability to measure time in seconds provides flexibility, suitable for various timing applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V guarantees compatibility with a multitude of digital systems, enhancing its application range.

Terminal Pitch: 0.81 mm

A terminal pitch of 0.81 mm facilitates ease of handling and PCB design, striking a balance between spacing and integration density.

Technical Specifications

Timers & Real-Time Clocks M48T37V-10MH1E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3/e4

Length:

18.1 mm

No. of Bits:

8

No. of Terminals:

44

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP44,.5,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.81 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Volatile:

NO

Width:

8.56 mm

Peripheral IC Type:

Trade Compliance

M48T37V-10MH1E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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