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M41T80M6E

STMicroelectronics

M41T80M6E by STMicroelectronics

M41T80M6E by STMicroelectronics is a CMOS real-time clock with I2C access, ideal for industrial applications. It operates b/w 2-5.5V and withstands temperatures from -40 °C to 85 °C. This compact 8-terminal device features interrupt capability and a max clock frequency of 0.032 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,804 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,800 parts In-Stock

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1,800

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Bristol Electronics

USA . 990 parts In-Stock

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990

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Atlantic Semiconductor

USA . 990 parts In-Stock

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990

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Anansix

USA . 335 parts In-Stock

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335

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Mil-Aero Solutions, Inc.

USA . 293 parts In-Stock

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Component Sense

UK . 66 parts In-Stock

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66

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Digiode

USA . 54 parts In-Stock

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54

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Distributors (Availability)

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Microchip USA

USA . 267 parts In-Stock

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$5.419

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267

$5.419

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AZTECH Wire

Italy . 115 parts In-Stock

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$14.170

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115

$14.170

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

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$29.019

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$26.117

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$29.019

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$26.117

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Ampacity Inc.

Singapore . 1,157 parts In-Stock

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$30.000

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$30.000

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MKK Technologies

India . 889 parts In-Stock

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$54.568

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889

$54.568

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DigiPath Technology Company

USA . 889 parts In-Stock

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$54.568

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889

$54.568

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Corohmni

South Africa . 2,415 parts In-Stock

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$76.032

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$76.032

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Component Stockers USA

USA . 480 parts In-Stock

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$99.990

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480

$99.990

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A-Z Elektronik GmbH

Germany . 7,262 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,841 parts In-Stock

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Corphita

USA . 3,289 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 850 parts In-Stock

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850

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Parana Technologies

USA . 522 parts In-Stock

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$34.696

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522

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Elevate your projects with the M41T80M6E from STMicroelectronics, a leader in innovation and reliability. This compact real-time clock offers precision timing for diverse applications like industrial automation and consumer electronics. With its robust design and I2C interface, it ensures seamless integration and exceptional performance. Experience unparalleled durability and efficiency tailored to meet your needs—transforming ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and resistance to environmental factors, making it suitable for various applications.

Information Access Method: I2C

The I2C access method allows for easy and efficient communication with other devices, enhancing integration capabilities.

Surface Mount: YES

Being surface mount compatible allows for compact PCB designs and automated assembly processes, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of board space and aligns with standard PCB layouts for easy integration.

Power Supplies (V): 2.5/5

Flexible power supply options of 2.5V to 5V make this product versatile for various applications.

No. of Terminals: 8

With 8 terminals, the product allows for sufficient input/output connections while maintaining a compact design.

Interrupt Capability: Y

Having interrupt capability enhances the product's responsiveness, enabling it to be used in real-time applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing a compact footprint.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2V allows for operation in low-power systems, extending battery life.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Functioning down to -40 °C makes it suitable for outdoor and extreme temperature applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position enhances ease of placement and soldering during manufacturing.

Maximum Seated Height: 1.75 mm

A low seated height enhances compatibility with low-profile applications, enabling slimmer designs.

Width: 3.9 mm

The compact width allows for efficient use of PCB real estate, making it easier to design compact circuits.

Maximum Clock Frequency: 0.032 MHz

A moderate clock frequency is sufficient for many real-time clock functions, making it energy-efficient.

Maximum Time At Peak Reflow Temperature (s): 40

Allows up to 40 seconds at peak reflow temperature, accommodating standard soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free solder processes.

Length: 4.9 mm

The compact length contributes to saving board space, fitting well in densely populated areas.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance in demanding environments.

Peripheral IC Type: TIMER, REAL TIME CLOCK

As a timer and real-time clock, it is ideal for applications requiring precise timekeeping.

Technology: CMOS

CMOS technology offers low power consumption, which is crucial for battery-operated devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and better mechanical stability.

Minimum Time: 1/100 SECOND

Supports high-resolution timing, which is essential for many precise applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V is standard and widely used in many consumer electronics.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for efficient layout in a variety of PCB designs.

Volatile: YES

Volatile memory is suitable for applications where data is temporary, allowing faster operations.

Technical Specifications

Timers & Real-Time Clocks M41T80M6E attributes and parameters. Explore more Timers & Real-Time Clocks devices from STMicroelectronics

Specs

Maximum Clock Frequency:

.032 MHz

Information Access Method:

I2C

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

1/100 SECOND

Maximum Time At Peak Reflow Temperature (s):

40

Volatile:

YES

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

M41T80M6E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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