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M24M01-HRMN6P

STMicroelectronics

M24M01-HRMN6P by STMicroelectronics

M24M01-HRMN6P by STMicroelectronics is a 256Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, supports up to 1 MHz clock frequency, and endures over 1 million write/erase cycles. Ideal for industrial applications requiring reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,137 parts In-Stock

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7,137

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Anansix

USA . 2,328 parts In-Stock

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2,328

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Digiode

USA . 1,598 parts In-Stock

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1,598

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Prism Electronics

USA . 9 parts In-Stock

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9

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IDEA Electronic Components Group

UK . 1,145 parts In-Stock

1+ parts

$5.179

100+ parts

-

1k+ parts

$4.661

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1,145

$5.179

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$4.661

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Microchip USA

USA . 269 parts In-Stock

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$6.897

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269

$6.897

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MKK Technologies

India . 106 parts In-Stock

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$9.738

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106

$9.738

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DigiPath Technology Company

USA . 106 parts In-Stock

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$9.738

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106

$9.738

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AZTECH Wire

Italy . 159 parts In-Stock

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$12.410

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159

$12.410

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Component Stockers USA

USA . 645 parts In-Stock

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$99.990

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645

$99.990

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Corphita

USA . 3,354 parts In-Stock

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3,354

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Parana Technologies

USA . 386 parts In-Stock

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$6.192

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386

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$6.192

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Kepictronics

USA . 200 parts In-Stock

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200

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Overview

Unlock the potential of your designs with the M24M01-HRMN6P EEPROM from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality memory device ensures reliability in demanding applications, offering impressive endurance and low power consumption. Engineered for versatility, it seamlessly integrates into diverse systems—from consumer electronics to industrial automation—delivering consistent performance and unmatched value that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient space utilization and easier integration into modern circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is ideal for compact designs, enabling effective placement on printed circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for higher speed data transfer, improving overall performance in data communications.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5V is energy-efficient, reducing power consumption and making it suitable for battery-operated devices.

Power Supplies: 2/5 V

The flexibility of operating between 2V to 5V makes it highly adaptable for a range of electronic devices.

No. of Terminals: 8

The 8 terminals facilitate a compact design, suitable for various applications without unnecessary complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for space-constrained applications, promoting efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM can function in a wide range of industrial applications with thermal stability.

Organization: 256KX8

The organization allows for organized data storage, optimizing access and retrieval processes in embedded systems.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliable operation in harsh environmental conditions, making it suitable for industrial usage.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality finish of nickel palladium gold enhances durability and provides excellent conductivity, ensuring reliable connections.

I2C Control Byte: 1010DDMR

The standardized I2C control byte allows for easy integration into existing systems using I2C protocol, simplifying design efforts.

Terminal Position: DUAL

Dual terminal positioning offers ease of soldering and handling during manufacturing, enhancing overall production efficiency.

Write Protection: HARDWARE

Hardware write protection provides an additional layer of security, preventing accidental data changes during critical operations.

Maximum Seated Height: 1.75 mm

The low seated height facilitates a sleek profile design, enabling more compact and low-profile electronic devices.

Maximum Clock Frequency (fCLK): 1 MHz

A clock frequency of 1 MHz supports fast operation, making it suitable for high-speed communication applications.

Width: 3.9 mm

The compact width means the device can fit in tighter spaces, ideal for modern compact electronics.

Minimum Supply Voltage (Vsup): 1.8 V

Operating down to 1.8V allows for compatibility with low-voltage applications, ensuring flexibility in power management.

Maximum Time At Peak Reflow Temperature: 40 s

A refined peak reflow time balances between successful soldering processes and component heat management, enhancing reliability.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature supports compatibility with various assembly processes, ensuring it can be efficiently manufactured.

Length: 4.9 mm

The short length allows for efficient PCB layouts while facilitating easier component placement and routing.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, it ensures reliable performance in extreme conditions, making it perfect for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-driven applications.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and reduces pin count, enhancing design simplicity for data transfers.

Terminal Form: GULL WING

The gull wing terminal form guarantees reliable connections and is well-suited for automated assembly processes.

Maximum Supply Current: 5 mA

Low maximum supply current helps in power-sensitive applications, ensuring longer battery life in portable devices.

No. of Words: 262144 words

This large word capacity provides ample storage for substantial application data, expanding design possibilities.

Memory Width: 8

An 8-bit memory width enables efficient data operation within common byte-oriented data structures.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability of stored information, making it ideal for critical applications requiring persistence.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch provides flexibility for PCB design while still accommodating high-density mounting configurations.

No. of Words Code: 256K

The noticeable capacity represented in words ensures users can store adequate amounts of data without sacrificing performance.

Maximum Supply Voltage (Vsup): 5.5 V

The capacity to operate up to 5.5V ensures compatibility with a broad range of devices and power configurations.

Endurance: 1000000 Write/Erase Cycles

High endurance of 1,000,000 cycles guarantees longevity and reliability, particularly in applications requiring frequent updates.

Serial Bus Type: I2C

The use of the I2C serial bus simplifies communication with microcontrollers, improving ease of integration and reducing design efforts.

Maximum Write Cycle Time (tWC): 5 ms

Fast maximum write cycle time of 5 ms ensures quick data updates, beneficial for real-time application needs.

Memory Density: 2097152 bit

The high memory density allows for extensive data storage in a compact footprint, catering to data-intensive applications.

Memory IC Type: EEPROM

The EEPROM type allows data to be erased and reprogrammed, making it ideal for applications that require frequent updates.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current ensures minimal power consumption during idle states, enhancing overall energy efficiency.

Technical Specifications

EEPROM M24M01-HRMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24M01-HRMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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