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M24512-HRMN6TP

STMicroelectronics

M24512-HRMN6TP by STMicroelectronics

M24512-HRMN6TP by STMicroelectronics is a 64Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, supports up to 1 MHz clock frequency, and endures 1M write/erase cycles. Ideal for industrial applications requiring reliable data retention in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,098 parts In-Stock

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Digiode

USA . 2,293 parts In-Stock

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2,293

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Anansix

USA . 710 parts In-Stock

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710

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,248 parts In-Stock

1+ parts

$4.351

100+ parts

-

1k+ parts

$3.916

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1,248

$4.351

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$3.916

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MKK Technologies

India . 224 parts In-Stock

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$8.181

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224

$8.181

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DigiPath Technology Company

USA . 224 parts In-Stock

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$8.181

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224

$8.181

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AZTECH Wire

Italy . 1,053 parts In-Stock

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$11.270

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1,053

$11.270

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Microchip USA

USA . 5,100 parts In-Stock

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5,100

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Corphita

USA . 3,787 parts In-Stock

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3,787

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QUARKTWIN TECHNOLOGY LTD

USA . 2,367 parts In-Stock

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2,367

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Metaverse IC Inc.

Canada . 2,295 parts In-Stock

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2,295

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Parana Technologies

USA . 1,515 parts In-Stock

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$5.202

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1,515

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$5.202

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the potential of your designs with the M24512-HRMN6TP EEPROM from STMicroelectronics, a leader renowned for innovation and quality. This compact powerhouse offers exceptional reliability across diverse applications—from automotive to industrial systems. With robust write protection and impressive endurance, it ensures data integrity even in challenging environments. Elevate your projects with this seamless, high-performance memory solution that delivers unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection from environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, ideal for modern electronics.

Package Shape: RECTANGULAR

A rectangular shape allows for easier integration into various circuit layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates and system performance, making it effective for high-speed applications.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a low nominal voltage helps to reduce power consumption, enhancing energy efficiency.

Power Supplies (V): 2/5

The flexibility of operating voltage between 2V to 5V offers versatility for compatibility with a wide range of devices.

No. of Terminals: 8

An 8-terminal configuration simplifies connections, making it easier to integrate into various designs.

Package Style (Meter): SMALL OUTLINE

The small outline package is space-efficient, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments.

Organization: 64KX8

This organization provides a substantial amount of memory, making it suitable for applications requiring significant data storage.

Minimum Operating Temperature: -40 °C

Operating in low temperatures down to -40 °C makes this EEPROM ideal for harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finishes enhance solderability and provide resistance to corrosion, ensuring long-term reliability.

I2C Control Byte: 1010DDDR

Using the I2C protocol allows for easier communication with multiple devices in a network, supporting efficient data exchange.

Terminal Position: DUAL

Dual terminal positions facilitate better orientation on PCBs and improve handling during assembly.

Write Protection: HARDWARE

Hardware write protection ensures data integrity, preventing accidental writing during operation.

Maximum Seated Height: 1.75 mm

A low seated height enhances compatibility with thin designs and contributes to a compact form factor.

Maximum Clock Frequency (fCLK): 1 MHz

A 1 MHz clock frequency allows for adequately performance in most applications without excessive energy consumption.

Width: 3.9 mm

A narrow width supports compact layouts while maintaining high performance, suitable for space-constrained designs.

Minimum Supply Voltage (Vsup): 1.8 V

Minimum supply voltage of 1.8V promotes energy efficiency, making it compatible with battery-operated or low-power applications.

Length: 4.9 mm

The short length provides flexibility in system design, ideal for fitting into tight spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade components are built for robustness and reliability, suitable for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high density, making it a preferred choice for memory applications.

Parallel or Serial: SERIAL

Serial communication simplifies the connection layout and supports easier integration into complex systems.

Terminal Form: GULL WING

Gull wing terminals promote better soldering quality and provide stronger connections to the PCB.

Maximum Supply Current: 5 mA

A maximum supply current of 5 mA ensures that the device can operate efficiently in energy-sensitive applications.

No. of Words: 65536 words

A word count of 65,536 indicates a substantial memory capacity, ideal for a variety of applications.

Memory Width: 8

An 8-bit memory width balances complexity and performance, making it suitable for most data storage tasks.

Minimum Data Retention Time: 40

With a minimum data retention time of 40 years, this EEPROM is reliable for long-term data storage.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, ensuring compatibility with existing PCB designs and manufacturing processes.

No. of Words Code: 64K

This indicates a solid storage capacity for code and data, supporting a variety of application needs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows flexibility and compatibility with other devices in electronic systems.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures longevity and reliability for applications that require frequent writing and erasing of data.

Serial Bus Type: I2C

Support for I2C allows for easy communication and integration into a wide variety of systems without complex wiring.

Maximum Write Cycle Time (tWC): 5 ms

A fast write cycle time ensures efficient data updating, improving overall system performance.

Memory Density: 524288 bit

With a density of 524288 bits, this EEPROM offers substantial storage for applications requiring significant data.

Memory IC Type: EEPROM

EEPROM technology allows for non-volatile storage of data, making it ideal for applications that require data retention.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current minimizes energy usage in idle states, making this device perfect for energy-conservative designs.

Technical Specifications

EEPROM M24512-HRMN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24512-HRMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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