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M24512-HRDW6TP

STMicroelectronics

M24512-HRDW6TP by STMicroelectronics

M24512-HRDW6TP by STMicroelectronics is a serial EEPROM with 64K x 8 organization, operating b/w -40 °C and 85 °C. It features a max clock frequency of 0.4 MHz and supports I2C communication. Ideal for industrial applications requiring reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,646 parts In-Stock

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8,646

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Digiode

USA . 1,704 parts In-Stock

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1,704

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Anansix

USA . 228 parts In-Stock

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228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$3.172

100+ parts

-

1k+ parts

$2.855

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450

$3.172

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$2.855

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MKK Technologies

India . 2,211 parts In-Stock

1+ parts

$5.965

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2,211

$5.965

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DigiPath Technology Company

USA . 2,211 parts In-Stock

1+ parts

$5.965

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2,211

$5.965

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AZTECH Wire

Italy . 1,002 parts In-Stock

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$8.870

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1,002

$8.870

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Component Stockers USA

USA . 259 parts In-Stock

1+ parts

$99.990

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259

$99.990

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Microchip USA

USA . 2,748 parts In-Stock

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2,748

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Corphita

USA . 1,756 parts In-Stock

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1,756

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Parana Technologies

USA . 337 parts In-Stock

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$3.793

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337

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$3.793

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Overview

Unlock limitless potential with the M24512-HRDW6TP EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality, industrial-grade memory chip delivers exceptional performance and reliability for diverse applications—from consumer electronics to industrial automation. Its compact design ensures seamless integration while providing robust data retention under extreme conditions. Choose STMicroelectronics for unmatched quality and elevate your projects with the trusted performance of the M24512-HRDW6TP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction enhances reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs and automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and facilitates efficient layout in electronic designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data processing and improved performance for high-speed applications.

No. of Terminals: 8

With 8 terminals, this EEPROM offers a balance of simplicity and functionality for versatile connectivity.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save valuable space on PCBs and are ideal for portable electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderate to high-temperature environments.

Organization: 64KX8

This organization format allows for efficient data storage and retrieval, maximizing memory usage.

Minimum Operating Temperature: -40 °C

Suitable for harsh environments, the -40 °C minimum operating temperature ensures reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning simplifies placement and allows for better routing on circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to a more compact design, making it ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

Support for a 0.4 MHz clock frequency balances speed with power consumption, suitable for a range of embedded applications.

Width: 3 mm

A compact width of 3 mm allows for flexibility in design layouts without sacrificing performance.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage of 1.8 V enhances power efficiency, making it suitable for battery-powered devices.

Length: 4.4 mm

A length of 4.4 mm makes this EEPROM easily integrable into various designs without consuming excessive space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures functionality and reliability in demanding applications such as automotive and industrial controls.

Technology: CMOS

Utilizing CMOS technology allows for lower power consumption and higher levels of integration, enhancing performance.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and reduces pin count, making it an ideal choice for space-limited designs.

Terminal Form: GULL WING

Gull wing terminal form facilitates easier soldering and improves mechanical stability during assembly.

No. of Words: 65536 words

This specification supports significant data storage, ideal for applications requiring substantial memory capacity.

Memory Width: 8

An 8-bit memory width ensures compatibility with a wide range of microcontrollers and systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm offers fine resolution for board layouts, enhancing design flexibility.

No. of Words Code: 64K

64K words provide ample storage for firmware and configuration data in embedded systems.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V allows for compatibility with a broad range of power supply designs.

Serial Bus Type: I2C

I2C serial bus type offers efficient communication in multi-master setups, simplifying system design.

Maximum Write Cycle Time (tWC): 5 ms

With a maximum write cycle time of 5 ms, this EEPROM provides decent write speeds for various applications.

Memory Density: 524288 bit

The memory density of 524288 bits provides substantial capacity for data storage, suitable for many embedded applications.

Memory IC Type: EEPROM

Being an EEPROM type, it allows for non-volatile storage, making it perfect for saving critical data even without power.

Technical Specifications

EEPROM M24512-HRDW6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24512-HRDW6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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