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M24256-BWMW6G

STMicroelectronics

M24256-BWMW6G by STMicroelectronics

M24256-BWMW6G by STMicroelectronics is a 32Kx8 EEPROM with I2C interface, ideal for industrial applications. It operates at 3-5V, features hardware write protection, and endures up to 1M write/erase cycles. Its compact SOIC package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,960 parts In-Stock

1+ parts

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2,960

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Vyrian

USA . 2,499 parts In-Stock

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2,499

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Semi Source

USA . 2,217 parts In-Stock

1+ parts

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2,217

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Anansix

USA . 1,223 parts In-Stock

1+ parts

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1,223

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LWI Electronics Inc

India . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,307 parts In-Stock

1+ parts

$3.723

100+ parts

-

1k+ parts

$3.351

10k+ parts

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2,307

$3.723

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$3.351

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MKK Technologies

India . 1,255 parts In-Stock

1+ parts

$7.001

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1,255

$7.001

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DigiPath Technology Company

USA . 1,255 parts In-Stock

1+ parts

$7.001

100+ parts

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1,255

$7.001

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Microchip USA

USA . 288 parts In-Stock

1+ parts

$21.149

100+ parts

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288

$21.149

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AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$21.160

100+ parts

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584

$21.160

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Corphita

USA . 3,254 parts In-Stock

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3,254

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Parana Technologies

USA . 158 parts In-Stock

1+ parts

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100+ parts

$4.452

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158

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$4.452

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Overview

Unlock the potential of your projects with the M24256-BWMW6G EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This reliable memory solution offers exceptional data retention and endurance, perfect for diverse applications like industrial automation, smart sensors, and consumer electronics. With easy integration, robust performance, and proven quality, elevate your designs while ensuring lasting reliability and efficiency—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides reliable protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into various circuit boards.

Package Shape: SQUARE

The square shape facilitates efficient use of space on PCB layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates, improving overall system performance.

Nominal Supply Voltage / Vsup: 5V

Standard 5V operating voltage makes it compatible with a wide range of devices.

Power Supplies: 3/5V

Versatile power supply range accommodates different design requirements.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for efficient integration.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

85 °C maximum operating temperature ensures reliability in warm environments.

Organization: 32KX8

32Kx8 organization allows for effective data storage and retrieval mechanisms.

Minimum Operating Temperature: -40 °C

Suitable for industrial applications, as it can operate in extreme cold.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance.

I2C Control Byte: 1010DDDR

I2C control allows for easy communication with microcontrollers and other devices.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility and connection reliability.

Write Protection: HARDWARE

Hardware write protection adds an extra layer of security for the stored data.

Maximum Seated Height: 2.5 mm

Low height allows for integration into slim designs and reduces overall device bulk.

Maximum Clock Frequency (fCLK): 0.4 MHz

0.4 MHz clock frequency is sufficient for many applications, ensuring reliable performance.

Width: 5.62 mm

Compact width facilitates easy placement on circuit boards in dense designs.

Minimum Supply Voltage (Vsup): 2.5V

Supports lower operating voltages, extending compatibility with various devices.

Length: 5.62 mm

Short length contributes to a compact form factor suitable for miniaturized electronics.

Temperature Grade: INDUSTRIAL

Industrial-grade reliability ensures operation under harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: SERIAL

Serial communication simplifies connections and reduces pin counts.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ease of soldering.

Maximum Supply Current: 5 mA

Low supply current minimizes power consumption, enhancing battery life in portable applications.

No. of Words: 32768 words

Large capacity of 32K words enables storage of substantial amounts of data.

Memory Width: 8

8-bit memory width allows for efficient data handling and compatibility with common data buses.

Minimum Data Retention Time: 40 years

Long data retention ensures that information is preserved without power for extended periods.

Terminal Pitch: 1.27 mm

Standard terminal pitch supports compatibility with a wide variety of PCB layouts.

No. of Words Code: 32K

The specified 32K words offer versatility in applications requiring ample data storage.

Maximum Supply Voltage (Vsup): 5.5 V

Allows operation within widely accepted voltage ranges, accommodating various designs.

Endurance: 1000000 Write/Erase Cycles

High endurance makes it suitable for applications requiring frequent write and erase operations.

Serial Bus Type: I2C

I2C bus type allows easy interconnection with multiple devices, simplifying design.

Maximum Write Cycle Time (tWC): 5 ms

Quick write cycle time enhances performance in time-sensitive applications.

Memory Density: 262144 bit

High memory density accommodates various application needs, making it a flexible choice.

Memory IC Type: EEPROM

EEPROM type guarantees non-volatile storage, retaining data even when powered off.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current improves energy efficiency and battery life.

Technical Specifications

EEPROM M24256-BWMW6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.62 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24256-BWMW6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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