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M24256-BRCS6TP/A

STMicroelectronics

M24256-BRCS6TP/A by STMicroelectronics

M24256-BRCS6TP/A by STMicroelectronics is a 32Kx8 EEPROM with a very thin profile, ideal for space-constrained applications. It operates in synchronous mode with a max clock frequency of 0.4 MHz and supports I2C communication. With an industrial temp range (-40 °C to 85°C) and hardware write protection, it's perfect for reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Prism Electronics

USA . 4,650 parts In-Stock

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4,650

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Vyrian

USA . 4,499 parts In-Stock

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4,499

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Digiode

USA . 3,216 parts In-Stock

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3,216

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Anansix

USA . 1,488 parts In-Stock

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1,488

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 702 parts In-Stock

1+ parts

$5.022

100+ parts

-

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$4.520

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702

$5.022

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$4.520

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Microchip USA

USA . 247 parts In-Stock

1+ parts

$6.281

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247

$6.281

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MKK Technologies

India . 424 parts In-Stock

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$9.444

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424

$9.444

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DigiPath Technology Company

USA . 424 parts In-Stock

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$9.444

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424

$9.444

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AZTECH Wire

Italy . 417 parts In-Stock

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$15.270

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417

$15.270

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Perfect Parts

USA . 5,208 parts In-Stock

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5,208

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QUARKTWIN TECHNOLOGY LTD

USA . 5,193 parts In-Stock

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5,193

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Corphita

USA . 3,667 parts In-Stock

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3,667

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Parana Technologies

USA . 1,303 parts In-Stock

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$6.005

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1,303

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$6.005

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Overview

Unlock the future of reliable data storage with the M24256-BRCS6TP/A EEPROM from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics delivers a robust memory solution perfect for industrial applications. With exceptional endurance and temperature resilience, this compact device ensures your critical data remains safe, while its versatile I2C communication streamlines integration. Experience unmatched performance and peace of mind in every byte!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable materials like plastic/epoxy contributes to the longevity and reliability of the EEPROM.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of manufacturing, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout, allowing for optimized space utilization.

Operating Mode: SYNCHRONOUS

Synchronous operation improves data transfer rates, enhancing overall performance in application.

Power Supplies (V): 2/5

Compatibility with a wide power supply range (2V to 5V) offers versatility for different system designs.

No. of Terminals: 8

An 8-terminal configuration ensures a simple integration into various circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch design leads to improved electrical performance and allows for high-density applications.

Maximum Operating Temperature: 85 °C

With a max operating temperature of 85 °C, this EEPROM is suitable for industrial applications with higher thermal environments.

Organization: 32KX8

A 32Kx8 organization offers a good balance of storage capacity and access speed for various applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes it suitable for extreme environmental conditions, enhancing its reliability.

I2C Control Byte: 1010DDDR

Utilizing I2C communication allows for easy integration and compatibility with a wide range of controllers.

Terminal Position: BOTTOM

Bottom terminal positioning helps in achieving a low profile design, enhancing space efficiency on PCBs.

Write Protection: HARDWARE

Hardware write protection ensures data integrity, preventing accidental erasure or overwrites in critical applications.

Maximum Seated Height: 0.65 mm

A low seated height enables compact packaging and design, ideal for portable devices and space-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

A max clock frequency of 400 kHz allows for reasonably quick data transfers effective in real-time applications.

Width: 1.785 mm

The narrow width contributes to high-density designs without compromising performance.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum of 1.8V improves energy efficiency, making it suitable for battery-powered devices.

Length: 1.97 mm

A compact length complements its small form factor, ideal for applications where board space is limited.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures reliability in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high speed and density, crucial for modern applications.

Parallel or Serial: SERIAL

Serial communication simplifies connections and allows for longer distance data transmission while maintaining signal integrity.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability and allows for better thermal performance.

Maximum Supply Current: 5 mA

At a maximum supply current of 5 mA, this EEPROM is energy efficient, ideal for power-sensitive applications.

No. of Words: 32768 words

With 32,768 words of storage, it offers substantial data handling capabilities for various applications.

Memory Width: 8

An 8-bit memory width aligns with common data sizes, supporting various digital operations seamlessly.

Minimum Data Retention Time: 40

Minimum data retention time of 40 years ensures durability and reliability of stored information over time.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine layouts, accommodating more components within limited space.

No. of Words Code: 32K

32K words of storage makes it suitable for different applications where moderate data storage is necessary.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V allows flexibility in design, catering to various circuit requirements.

Endurance: 1000000 Write/Erase Cycles

High endurance of 1,000,000 write/erase cycles ensures that it can withstand frequent data updating, ideal for dynamic applications.

Serial Bus Type: I2C

I2C as the serial bus type fosters easy multi-device connections, enhancing versatility in system design.

Maximum Write Cycle Time (tWC): 5 ms

Quick maximum write cycle time of 5 ms improves overall system responsiveness, crucial for real-time applications.

Memory Density: 262144 bit

A memory density of 262,144 bits denotes its substantial storage capability, making it suitable for data-heavy applications.

Memory IC Type: EEPROM

As an EEPROM, this IC allows for non-volatile memory storage, retaining data even when power is removed.

Maximum Standby Current: 0.000001 Amp

Extremely low maximum standby current ensures minimal energy consumption during idle times, enhancing battery life in portable applications.

Technical Specifications

EEPROM M24256-BRCS6TP/A attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

1

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PBGA-B8

Length:

1.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X5,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.785 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24256-BRCS6TP/A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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