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M24256-BHRMN6TP

STMicroelectronics

M24256-BHRMN6TP by STMicroelectronics

M24256-BHRMN6TP by STMicroelectronics is a 32Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w 1.8V to 5.5V, supports up to 1 MHz clock frequency, and features hardware write protection. Ideal for industrial applications requiring reliable data retention at extreme temperatures (-40 °C to 85°C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,165 parts In-Stock

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2,165

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Vyrian

USA . 1,927 parts In-Stock

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1,927

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Anansix

USA . 776 parts In-Stock

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776

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 548 parts In-Stock

1+ parts

$3.246

100+ parts

-

1k+ parts

$2.921

10k+ parts

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548

$3.246

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$2.921

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MKK Technologies

India . 1,049 parts In-Stock

1+ parts

$6.103

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1,049

$6.103

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DigiPath Technology Company

USA . 1,049 parts In-Stock

1+ parts

$6.103

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1,049

$6.103

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AZTECH Wire

Italy . 978 parts In-Stock

1+ parts

$18.900

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978

$18.900

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Microchip USA

USA . 336 parts In-Stock

1+ parts

$27.997

100+ parts

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336

$27.997

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Corphita

USA . 3,561 parts In-Stock

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3,561

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Parana Technologies

USA . 2,372 parts In-Stock

1+ parts

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$3.881

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2,372

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$3.881

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Overview

Unlock the potential of your projects with the M24256-BHRMN6TP EEPROM from STMicroelectronics. Renowned for unmatched quality and reliability, STMicroelectronics delivers a versatile memory solution that excels in industrial applications, offering robust data retention and exceptional endurance. With its compact design and power efficiency, this EEPROM empowers your devices to perform flawlessly even in extreme conditions, ensuring longevity and superior performance where it matters most.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and environmental resistance, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, which reduces manufacturing costs.

Package Shape: RECTANGULAR

A rectangular package shape optimizes space on PCB layouts, allowing for efficient circuit design.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speeds and system performance, making it ideal for high-speed applications.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5V is energy-efficient, helping to lower power consumption in battery-operated devices.

Power Supplies (V): 2/5

Supports a range of power supply options, providing flexibility for designers to integrate it into various systems.

No. of Terminals: 8

With 8 terminals, the product maintains a compact form factor while providing enough connection points for functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package allows for space-saving designs in applications with limited board area.

Maximum Operating Temperature: 85 °C

A maximum temperature rating of 85 °C makes this EEPROM suitable for industrial and high-temperature environments.

Organization: 32KX8

This memory organization offers a structured way to store data efficiently, providing 32K words with 8 bits each.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme environments, suitable for industrial applications.

I2C Control Byte: 1010DDDR

The I2C control byte structure allows for easy integration with standard I2C communication protocols.

Terminal Position: DUAL

Dual terminal position supports more versatile PCB designs and assembly options.

Write Protection: HARDWARE

Hardware write protection enhances data integrity by preventing accidental overwriting during operation.

Maximum Seated Height: 1.75 mm

With a low seated height, this EEPROM is ideal for space-constrained applications where height is a concern.

Maximum Clock Frequency (fCLK): 1 MHz

A maximum clock frequency of 1 MHz facilitates fast data communication, improving overall system performance.

Width: 3.9 mm

A compact width helps save board space, enabling designs in smaller form factors.

Minimum Supply Voltage (Vsup): 1.8 V

Supports a minimum supply voltage of 1.8V for broader voltage compatibility, catering to various applications.

Length: 4.9 mm

Short length enhances its suitability for compact electronic devices and applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in challenging operational conditions.

Technology: CMOS

CMOS technology provides high-density integration with low power consumption, ideal for modern applications.

Parallel or Serial: SERIAL

Serial interface reduces pin count and board space, allowing for simpler designs.

Terminal Form: GULL WING

Gull-wing terminals facilitate easier soldering and board assembly, enhancing manufacturing efficiency.

Maximum Supply Current: 5 mA

Low maximum supply current helps maintain overall energy efficiency in final applications.

No. of Words: 32768 words

This capacity effectively meets the needs for various medium-sized memory requirements in embedded systems.

Memory Width: 8

An 8-bit memory width supports standard data handling, optimizing compatibility with numerous systems.

Minimum Data Retention Time: 40 years

Long data retention time ensures that critical information is maintained over an extended period, reducing maintenance needs.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for easier soldering and compatibility with various PCB layouts.

No. of Words Code: 32K

The 32K word capacity is well-suited for applications requiring moderate data storage without unnecessary overhead.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage accommodates a wide range of systems, enhancing adaptability in various designs.

Endurance: 1000000 Write/Erase Cycles

High endurance rating provides assurance of reliability and longevity in data storage for frequent rewriting applications.

Serial Bus Type: I2C

The support for I2C bus type allows for easy integration with other I2C devices, enhancing versatility.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time increases overall system responsiveness, supporting real-time applications efficiently.

Memory Density: 262144 bit

A density of 262,144 bits provides sufficient memory for numerous applications without excess complexity.

Memory IC Type: EEPROM

As an EEPROM memory type, it provides the ability to retain information even without power, enhancing reliability.

Maximum Standby Current: 0.000002 Amp

Very low standby current significantly reduces power consumption in idle state, ideal for battery-operated devices.

Technical Specifications

EEPROM M24256-BHRMN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24256-BHRMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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