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LNBH221

STMicroelectronics

LNBH221 by STMicroelectronics

LNBH221 by STMicroelectronics is a dual switching controller designed for automotive applications, operating b/w -40 °C to 125 °C. It features a nominal voltage of 12V, max output current of 0.75A, and utilizes pulse width modulation for efficient power management. Its compact size (11mm x 15.9mm) makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,929 parts In-Stock

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4,929

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Digiode

USA . 3,463 parts In-Stock

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3,463

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Anansix

USA . 346 parts In-Stock

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346

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,182 parts In-Stock

1+ parts

$15.980

100+ parts

-

1k+ parts

$14.382

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1,182

$15.980

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$14.382

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MKK Technologies

India . 206 parts In-Stock

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$30.050

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206

$30.050

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DigiPath Technology Company

USA . 206 parts In-Stock

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$30.050

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206

$30.050

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Parana Technologies

USA . 1,740 parts In-Stock

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$19.107

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1,740

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$19.107

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Corphita

USA . 771 parts In-Stock

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771

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Overview

Unlock exceptional efficiency and reliability with the LNBH221 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robust automotive applications, this dual switching controller excels in performance across temperature extremes, ensuring your designs thrive. Experience enhanced power management and reduced energy consumption, all while benefiting from ST's commitment to quality and cutting-edge technology. Elevate your projects with a component that delivers unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and thermal resistance, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient space utilization on printed circuit boards.

Nominal Supply Voltage (Vsup): 12 V

Designed for a standard 12V supply, making it compatible with a wide range of applications.

Power Supplies (V): 12

Supports a 12V power supply, ensuring reliable performance in automotive and industrial settings.

No. of Terminals: 36

A higher number of terminals offer versatility in connectivity options for different configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style supports efficient heat dissipation and compact design, essential for high-performance applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating ensures reliability in demanding environments.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 to 125 °C) makes this product ideal for automotive and harsh environmental applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible component placement in circuits, improving design options.

Maximum Seated Height: 3.6 mm

The low profile reduces the overall height on the PCB, allowing for space-saving designs.

Width: 11 mm

Compact width contributes to more efficient board designs and enables higher component density.

Other IC type: DUAL SWITCHING CONTROLLER

Being a dual switching controller enhances functionality and increases application versatility.

Nominal Input Voltage: 12 V

Designed for a nominal input voltage of 12V, it simplifies integration into systems with standard voltage outputs.

Length: 15.9 mm

Length contributes to a compact design, facilitating effective use in space-constrained applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade certification ensures that the device meets stringent reliability and safety standards.

Maximum Supply Current (Isup): 40 mA

Capable of handling a maximum supply current of 40 mA, making it efficient for low-power applications.

Maximum Output Current: 0.75 A

With a maximum output current of 0.75A, this regulator is suitable for powering various loads effectively.

Technology: BIPOLAR

Bipolar technology provides fast switching capabilities and good efficiency.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy mounting and soldering on PCBs, improving assembly efficiency.

Control Technique: PULSE WIDTH MODULATION

Pulse Width Modulation (PWM) control technique ensures efficient voltage regulation and reduces noise.

Switcher Config: SINGLE

Single switcher configuration makes it simpler and more cost-effective for many applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compatibility with modern SMT equipment and designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring proper handling during assembly.

Minimum Input Voltage: 8 V

A lower minimum input voltage of 8V enhances versatility in various input voltage scenarios.

Nominal Output Voltage: 18 V

The nominal output voltage of 18V allows it to meet the requirements of many powered devices.

Maximum Input Voltage: 15 V

The maximum input voltage of 15V provides headroom for voltage transients, ensuring stable operation.

Technical Specifications

Switching Regulators & Controllers LNBH221 attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

15 V

Minimum Input Voltage:

8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.75 A

Nominal Output Voltage:

18 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

40 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Switcher Config:

SINGLE

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

11 mm

Trade Compliance

LNBH221 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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