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LM336ZT

STMicroelectronics

LM336ZT by STMicroelectronics

LM336ZT by STMicroelectronics is a bipolar voltage reference with an adjustable output ranging from 2.44V to 2.54V. It operates b/w -25 °C and 85 °C, with a max supply current of 10mA. Ideal for precision applications requiring stable voltage references in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,428 parts In-Stock

1+ parts

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5,428

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Anansix

USA . 2,048 parts In-Stock

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2,048

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Digiode

USA . 1,602 parts In-Stock

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1,602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 326 parts In-Stock

1+ parts

$0.758

100+ parts

-

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326

$0.758

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$17.871

100+ parts

-

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$16.084

10k+ parts

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1,245

$17.871

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$16.084

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AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$19.210

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666

$19.210

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MKK Technologies

India . 831 parts In-Stock

1+ parts

$33.605

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831

$33.605

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DigiPath Technology Company

USA . 831 parts In-Stock

1+ parts

$33.605

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831

$33.605

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Corphita

USA . 3,055 parts In-Stock

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3,055

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Vigor

Singapore . 1,921 parts In-Stock

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1,921

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

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$21.368

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645

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$21.368

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Overview

Unlock precision with the LM336ZT from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile voltage reference is designed to enhance your applications with reliable performance and exceptional stability, ensuring optimal results in any environment. From automotive to industrial uses, experience the benefits of its adjustable output and robust temperature range, delivering unmatched quality that meets your project's demands efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Trim or Adjustable Output: YES

The adjustable output feature allows users to customize the output voltage for specific applications, providing flexibility and versatility.

Package Shape: ROUND

The round package shape facilitates easier integration in compact spaces, benefiting designs with limited real estate.

No. of Terminals: 3

Having three terminals enables additional functionality, such as easier connection and stable operation, which enhances circuit performance.

Package Style (Meter): CYLINDRICAL

The cylindrical package style can improve thermal management, allowing for better heat dissipation and reliability during operation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can perform reliably in higher temperature environments commonly found in industrial applications.

Minimum Output Voltage: 2.44 V

The minimum output voltage of 2.44 V ensures compatibility with a range of electronic components that require low voltage inputs.

Minimum Operating Temperature: -25 °C

This voltage reference operates at a minimum temperature of -25 °C, making it suitable for use in colder environments without performance issues.

Terminal Finish: TIN

The tin terminal finish enhances solderability and corrosion resistance, ensuring reliable connections in various mounting conditions.

Maximum Output Voltage: 2.54 V

With a maximum output voltage of 2.54 V, this voltage reference fulfills the needs of circuits that require precise voltage levels.

Terminal Position: BOTTOM

Bottom terminal positioning allows for effective circuit board layout and can optimize space in dense designs.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

As a two-terminal voltage reference, this product simplifies design requirements while providing stable voltage output, ensuring ease of use.

Maximum Supply Current (Isup): 10 mA

The ability to handle a maximum supply current of 10 mA indicates that the product can support moderate load demands without compromising performance.

Technology: BIPOLAR

Bipolar technology typically offers lower noise and better performance compared to other types, enhancing the overall reliability of the voltage reference.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides strong mechanical support and is easy to work with during assembly and soldering.

Maximum Voltage Tolerance: 4%

A voltage tolerance of 4% ensures that the device delivers consistent performance, making it suitable for applications that demand precision.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with a wide range of PCBs, making integration straightforward in various designs.

Max Voltage Temp Coef: 43.811 ppm/°C

A maximum voltage temperature coefficient of only 43.811 ppm/°C indicates excellent stability across temperature variations, enhancing accuracy in diverse environments.

Nominal Output Voltage: 2.49 V

The nominal output voltage of 2.49 V provides a reliable reference point, meeting the requirements for a variety of electronic circuits.

Technical Specifications

Voltage References LM336ZT attributes and parameters. Explore more Voltage References devices from STMicroelectronics

Specs

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Voltage:

2.54 V

Minimum Output Voltage:

2.44 V

Nominal Output Voltage:

2.49 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Voltage References

Maximum Supply Current (Isup):

10 mA

Surface Mount:

NO

Technology:

BIPOLAR

Max Voltage Temp Coef:

43.811 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

4 %

Trade Compliance

LM336ZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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