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LM236ZAP

STMicroelectronics

LM236ZAP by STMicroelectronics

LM236ZAP by STMicroelectronics is a bipolar voltage reference with an adjustable output ranging from 2.44V to 2.54V, ideal for precision applications. It operates b/w -25 °C and 85°C and features a cylindrical package with three terminals. This component ensures reliable performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,570 parts In-Stock

1+ parts

-

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6,570

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Anansix

USA . 337 parts In-Stock

1+ parts

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337

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Digiode

USA . 263 parts In-Stock

1+ parts

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263

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 143 parts In-Stock

1+ parts

$1.119

100+ parts

-

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143

$1.119

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AZTECH Wire

Italy . 1,080 parts In-Stock

1+ parts

$16.990

100+ parts

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1,080

$16.990

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

1+ parts

$17.041

100+ parts

-

1k+ parts

$15.337

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1,901

$17.041

-

$15.337

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MKK Technologies

India . 1,519 parts In-Stock

1+ parts

$32.045

100+ parts

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1,519

$32.045

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DigiPath Technology Company

USA . 1,519 parts In-Stock

1+ parts

$32.045

100+ parts

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1,519

$32.045

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Component Stockers USA

USA . 619 parts In-Stock

1+ parts

$99.990

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619

$99.990

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Vigor

Singapore . 9,800 parts In-Stock

1+ parts

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9,800

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Corphita

USA . 3,218 parts In-Stock

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3,218

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Parana Technologies

USA . 994 parts In-Stock

1+ parts

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100+ parts

$20.375

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994

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$20.375

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Overview

Unlock precision and reliability with the LM236ZAP from STMicroelectronics, a trusted leader in innovative electronic solutions. This versatile voltage reference is designed to enhance your projects with adjustable output, ensuring optimal performance in various applications, from industrial to consumer electronics. With exceptional temperature stability and quality construction, the LM236ZAP delivers outstanding value, empowering your designs with trustworthiness and efficiency. Elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product reliable for long-term use.

Trim or Adjustable Output (V): YES

The adjustable output feature allows for customization in various applications, providing flexibility to meet specific voltage requirements.

Package Shape: ROUND

The round package shape is ideal for space-constrained designs, making it easier to integrate into compact circuit layouts.

No. of Terminals: 3

Having three terminals simplifies connections and offers versatility in how the device can be implemented in a circuit.

Package Style (Meter): CYLINDRICAL

Cylindrical package style contributes to ease of handling and mounting, especially in automated processes.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature enhances the product's reliability in high-temperature environments.

Minimum Output Voltage: 2.44 V

The low minimum output voltage is suitable for low-power applications, ensuring versatility across different use cases.

Minimum Operating Temperature: -25 °C

The wide range of operating temperatures ensures functionality in diverse environments, including extreme cold.

Terminal Finish: MATTE TIN/TIN SILVER COPPER

The high-quality terminal finish enhances solderability and reduces overall contact resistance, improving performance.

Maximum Output Voltage: 2.54 V

Availability of a maximum output voltage close to the nominal value ensures reliability and consistency in voltage reference applications.

Terminal Position: BOTTOM

Bottom terminal placement ensures a stable mounting and optimized space utilization in PCB layouts.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

This two-terminal configuration allows for simple designs, reducing complexity in circuit schematics.

Technology: BIPOLAR

Bipolar technology provides excellent performance in terms of accuracy and response time, making it suitable for precision applications.

Terminal Form: THROUGH-HOLE

Through-hole technology benefits from robust mechanical fastening and ease of soldering, increasing reliability in physical connections.

Maximum Voltage Tolerance: 2 %

A tight voltage tolerance ensures the reliability and stability of applications that depend on precise voltage levels.

Terminal Pitch: 1.27 mm

A compact terminal pitch allows for closer placement of components, facilitating better layout design in limited board space.

Max Voltage Temp Coef: 36.509 ppm/°C

A low voltage temperature coefficient indicates minimal drift with temperature changes, ensuring consistent performance across varying environments.

Nominal Output Voltage: 2.49 V

The nominal output voltage is well-suited for standard applications, providing a reliable reference point for circuit designs.

Technical Specifications

Voltage References LM236ZAP attributes and parameters. Explore more Voltage References devices from STMicroelectronics

Specs

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3/e1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Voltage:

2.54 V

Minimum Output Voltage:

2.44 V

Nominal Output Voltage:

2.49 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Voltage References

Surface Mount:

NO

Technology:

BIPOLAR

Max Voltage Temp Coef:

36.509 ppm/Cel

Temperature Grade:

Terminal Finish:

MATTE TIN/TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

2 %

Trade Compliance

LM236ZAP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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