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LK112SM32TR

STMicroelectronics

LK112SM32TR by STMicroelectronics

LK112SM32TR by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 3.2 V and a max output current of 0.2 A. It operates in temperatures from -40 °C to 125°C, featuring a low dropout voltage of just 0.35 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,868 parts In-Stock

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6,868

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Digiode

USA . 1,972 parts In-Stock

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1,972

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Anansix

USA . 251 parts In-Stock

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251

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,154 parts In-Stock

1+ parts

$5.086

100+ parts

-

1k+ parts

$4.577

10k+ parts

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1,154

$5.086

-

$4.577

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Microchip USA

USA . 467 parts In-Stock

1+ parts

$6.020

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467

$6.020

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MKK Technologies

India . 2,192 parts In-Stock

1+ parts

$9.563

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2,192

$9.563

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DigiPath Technology Company

USA . 2,192 parts In-Stock

1+ parts

$9.563

100+ parts

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2,192

$9.563

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AZTECH Wire

Italy . 1,057 parts In-Stock

1+ parts

$20.650

100+ parts

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1,057

$20.650

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Component Stockers USA

USA . 745 parts In-Stock

1+ parts

$99.990

100+ parts

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745

$99.990

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Vigor

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

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Corphita

USA . 2,420 parts In-Stock

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2,420

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Parana Technologies

USA . 509 parts In-Stock

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$6.081

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509

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$6.081

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Overview

Elevate your designs with the LK112SM32TR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality fixed regulator ensures stable performance across various applications, delivering reliable power management for everything from consumer electronics to industrial systems. With its compact design and exceptional thermal resilience, this LDO enhances efficiency while simplifying integration. Experience peace of mind with a product built on ST's legacy of excellence—your projects deserve nothing less.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum Dropout Voltage: 1.5 V

A low dropout voltage allows for efficient operation, ensuring that the output voltage remains stable even with a minimal difference between input and output voltages.

Surface Mount: YES

Surface mount technology facilitates easy integration into modern compact circuit designs, reducing assembly time and costs.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can function in demanding environments without risk of failure.

Technology: BIPOLAR

Utilizing bipolar technology provides excellent performance in terms of noise and regulation, making it reliable for precision applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it suitable for compact designs.

Terminal Form: GULL WING

Gull wing terminals provide good solder joints and ease of handling during assembly, ensuring reliable connections.

Operating Temperature (TJ-Min): -40 °C

A wide operating temperature range ensures reliable performance in both extreme cold and hot environments, enhancing versatility.

Packing Method: TR

Tape and reel packaging provides convenience for automated assembly processes, improving production efficiency.

Minimum Output Voltage: 3.14 V

A precise minimum output voltage specification supports specific application requirements, ensuring compatibility with various devices.

Maximum Voltage Tolerance: 1.9 %

Low voltage tolerance guarantees stable performance and reliable operation even in fluctuating conditions.

Nominal Output Voltage: 3.2 V

The nominal output voltage is ideal for many electronic devices, providing a stable and reliable power source.

No. of Terminals: 5

Five terminals enhance connectivity options while maintaining a compact footprint, suitable for diverse circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile, shrink pitch design enables it to fit in tight spaces without sacrificing performance, ideal for compact electronics.

Adjustability: FIXED

Fixed output voltage simplifies design considerations and provides consistent power delivery, reducing the need for additional components.

Terminal Pitch: 0.95 mm

A small terminal pitch allows for denser component placement on the PCB, optimizing space for more functionality.

Maximum Line Regulation: 0.04 %

High line regulation performance ensures that output voltage remains stable regardless of variations in input voltage, critical for sensitive applications.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

As a fixed positive single output LDO, it is specifically designed for applications with stable voltage requirements, ensuring reliability.

Terminal Finish: TIN

A tin finish on terminals offers corrosion resistance, enhancing the longevity and reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design and improves integration into various layouts.

Maximum Output Voltage: 3.26 V

A maximum output voltage of 3.26 V ensures it can meet the power needs of various load conditions effectively.

Maximum Seated Height: 1.45 mm

A low seated height is advantageous for maintaining a slim profile in electronics, especially in compact devices.

Width: 1.625 mm

A narrow width enables space-efficient designs, making it easy to incorporate into crowded PCBs.

Maximum Load Regulation: 0.09 %

Outstanding load regulation ensures that the voltage output stays consistent across varying loads, critical for stable performance.

Minimum Input Voltage: 4.2 V

A minimum input voltage of 4.2 V allows for operation in battery-driven applications while ensuring optimal efficiency.

Maximum Output Current: 0.2 A

The capability to provide 0.2 A output current makes it suitable for powering a variety of low to medium power devices.

Nominal Dropout Voltage: 0.35 V

A nominal dropout voltage of 0.35 V indicates efficient performance, allowing the device to function correctly even with reduced input voltage.

Length: 2.9 mm

A compact length contributes to overall space-saving in circuit designs, making it ideal for miniaturized applications.

Maximum Input Voltage: 9.2 V

Supports a maximum input voltage of 9.2 V, offering flexibility for various input power sources.

Maximum Input Voltage Absolute: 16 V

The absolute maximum input voltage of 16 V ensures that the regulator can handle voltage spikes without damage, enhancing reliability.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LK112SM32TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.35 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

9.2 V

Minimum Input Voltage:

4.2 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.04 %

Maximum Load Regulation:

.09 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.2 A

Maximum Output Voltage-1:

3.26 V

Minimum Output Voltage-1:

3.14 V

Nominal Output Voltage-1:

3.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

1.625 mm

Trade Compliance

LK112SM32TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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