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LK112M32TR

STMicroelectronics

LK112M32TR by STMicroelectronics

LK112M32TR from STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 3.2 V and a max output current of 150 mA. It operates efficiently in temperatures ranging from -40 °C to 125°C, featuring a low dropout voltage of just 0.35 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,472 parts In-Stock

1+ parts

-

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4,472

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Digiode

USA . 1,964 parts In-Stock

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1,964

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Anansix

USA . 1,171 parts In-Stock

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1,171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$3.041

100+ parts

$2.767

1k+ parts

$2.494

10k+ parts

-

2,500

$3.041

$2.767

$2.494

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IDEA Electronic Components Group

UK . 2,180 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

$3.171

10k+ parts

-

2,180

$3.524

-

$3.171

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MKK Technologies

India . 682 parts In-Stock

1+ parts

$6.626

100+ parts

-

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682

$6.626

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

$6.626

100+ parts

-

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10k+ parts

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682

$6.626

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AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$11.650

100+ parts

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827

$11.650

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QUARKTWIN TECHNOLOGY LTD

USA . 20,280 parts In-Stock

1+ parts

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20,280

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Vigor

Singapore . 4,838 parts In-Stock

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4,838

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Microchip USA

USA . 4,567 parts In-Stock

1+ parts

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4,567

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Corphita

USA . 1,341 parts In-Stock

1+ parts

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1,341

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Parana Technologies

USA . 1,102 parts In-Stock

1+ parts

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100+ parts

$4.213

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1,102

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$4.213

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Overview

Unlock the potential of your designs with the LK112M32TR from STMicroelectronics—your trusted partner in cutting-edge technology. This high-performance LDO regulator ensures reliable voltage regulation across diverse applications, from consumer electronics to automotive systems. With its robust thermal performance and compact design, it delivers exceptional efficiency and stability, empowering you to create innovative solutions that stand out. Experience quality you can depend on and elevate your projects with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection, making the component suitable for various environmental conditions.

Maximum Dropout Voltage: 0.35 V

A low dropout voltage allows for efficient operation, enabling better performance in battery-powered applications where input voltage may be close to output voltage.

Surface Mount: YES

Surface mount technology facilitates compact designs, making this LDO ideal for space-constrained applications and enabling automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this LDO is suitable for high-temperature environments and ensures reliable performance under stress.

Technology: BIPOLAR

Bipolar technology offers superior performance characteristics, including low noise and fast transient response, making this LDO a reliable choice for sensitive applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts, enhancing design flexibility.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering quality and mechanical stability, ensuring a robust connection to the PCB.

Operating Temperature (TJ-Min): -40 °C

The wide temperature range from -40 °C to 125 °C ensures this LDO can operate reliably in varied and harsh environments.

Packing Method: TR

Tray packing (TR) allows for safe handling and storage of multiple units, making it convenient for assembly and supply chain management.

Minimum Output Voltage: 3.14 V

Providing a minimum output voltage of 3.14 V is ideal for powering a variety of devices that require stable voltage for optimal operation.

Maximum Voltage Tolerance: 1.9 %

A voltage tolerance of 1.9% ensures a consistent output voltage, which is crucial for applications that require precise voltage regulation.

Nominal Output Voltage: 3.2 V

The nominal output voltage of 3.2 V is suitable for a range of applications, providing an efficient power supply for various electronic devices.

No. of Terminals: 5

With five terminals, the LDO provides flexible connection options that can accommodate different circuit designs and configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style allows for high-density designs, making it ideal for modern compact electronics.

Adjustability: FIXED

Being a fixed-output LDO simplifies the design process, eliminating the need for external components to set the output voltage.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm enables compatibility with various layout standards and efficient PCB design for compact applications.

Maximum Line Regulation: 0.04 %

Exceptional line regulation of 0.04% enhances voltage stability despite fluctuations in input voltage, ensuring reliable performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

As a fixed positive single output LDO regulator, it provides simplicity and reliability for a wide range of power supply needs.

Terminal Finish: TIN

Tin terminal finish ensures good solderability and enhances the longevity of the connections in various environmental conditions.

Terminal Position: DUAL

The dual terminal position facilitates easier PCB layout design, allowing for better space distribution and connection options.

Maximum Output Voltage: 3.26 V

A maximum output voltage of 3.26 V provides versatility for different applications requiring slightly higher voltage levels.

Maximum Seated Height: 1.45 mm

The low seated height is advantageous for applications where height restrictions are a concern, supporting compact device designs.

Width: 1.625 mm

The small width allows for efficient use of space on PCBs, accommodating high-density designs.

Maximum Load Regulation: 0.09 %

With a low load regulation value of 0.09%, the LDO maintains a stable output voltage even with varying load conditions.

Minimum Input Voltage: 4.2 V

A minimum input voltage of 4.2 V allows compatibility with a broad range of input power sources, including battery applications.

Maximum Output Current: 0.15 A

The capability to supply up to 0.15 A of output current makes it suitable for various low to medium power applications.

Nominal Dropout Voltage: 0.17 V

A nominal dropout voltage of 0.17 V ensures efficient operation, especially in battery-powered circuits where minimizing power loss is vital.

Length: 2.9 mm

The compact length allows for flexible PCB layouts, making it suitable for modern electronic designs.

Maximum Input Voltage: 9.2 V

The ability to handle input voltages up to 9.2 V makes this LDO versatile for various power supply scenarios.

Maximum Input Voltage Absolute: 16 V

A maximum absolute input voltage of 16 V provides an extra margin of safety, accommodating voltage spikes and ensuring reliable operation.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LK112M32TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.35 V

Nominal Dropout Voltage-1:

.17 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

9.2 V

Minimum Input Voltage:

4.2 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Maximum Line Regulation:

.04 %

Maximum Load Regulation:

.09 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

3.26 V

Minimum Output Voltage-1:

3.14 V

Nominal Output Voltage-1:

3.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

Width:

1.625 mm

Trade Compliance

LK112M32TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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