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LED7706

STMicroelectronics

LED7706 by STMicroelectronics

LED7706 by STMicroelectronics is a versatile graphics display driver with a max supply voltage of 36V and operates b/w 4.5V to 12V. It features multiplexed display capability and supports up to 6 segments, ideal for compact applications. Its thin profile design ensures efficient heat dissipation in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 14,400 parts In-Stock

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14,400

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Vyrian

USA . 7,299 parts In-Stock

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7,299

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Digiode

USA . 1,811 parts In-Stock

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1,811

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ComSIT Distribution GmbH

Germany . 609 parts In-Stock

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609

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ComSIT USA

USA . 609 parts In-Stock

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609

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Ashlea Components Ltd

UK . 195 parts In-Stock

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195

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Anansix

USA . 151 parts In-Stock

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151

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J2 Sourcing AB

Sweden . 52 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 662 parts In-Stock

1+ parts

$3.982

100+ parts

-

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$3.584

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662

$3.982

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$3.584

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MKK Technologies

India . 1,580 parts In-Stock

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$7.487

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1,580

$7.487

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DigiPath Technology Company

USA . 1,580 parts In-Stock

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$7.487

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1,580

$7.487

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AZTECH Wire

Italy . 52 parts In-Stock

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$15.420

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52

$15.420

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Ampacity Inc.

Singapore . 249 parts In-Stock

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$45.500

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$45.500

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Microchip USA

USA . 2,504 parts In-Stock

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$62.814

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Corphita

USA . 4,729 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,703 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,135 parts In-Stock

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Perfect Parts

USA . 1,100 parts In-Stock

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Kepictronics

USA . 1,018 parts In-Stock

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1,018

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Parana Technologies

USA . 476 parts In-Stock

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$4.761

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476

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$4.761

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Overview

Transform your display designs with the LED7706 from STMicroelectronics, a leading innovator in advanced semiconductor solutions. This sleek, surface-mount graphics display driver ensures top-notch performance and reliability across diverse applications—from appliances to automotive displays. Experience enhanced visual clarity and energy efficiency, all while benefiting from ST's renowned quality and support. Elevate your projects with the LED7706 and captivate your audience effortlessly!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller device footprint, making it ideal for compact designs.

Maximum Supply Voltage: 36 V

The high maximum supply voltage supports a broad range of applications and permits flexibility in circuit design.

Package Shape: SQUARE

A square package shape provides efficient use of space on the PCB, optimizing layout and performance.

Power Supplies (V): 12

Designed to operate at a nominal voltage of 12V, this driver is compatible with standard power supply systems.

No. of Terminals: 24

A total of 24 terminals allows for extensive connectivity options, enhancing application versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile with heat sink capabilities enables better thermal management and integration into slim designs.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage increases usability in battery-operated or low-voltage applications.

Maximum Operating Temperature: 85 °C

Operating at higher temperatures ensures reliability under demanding conditions typical of various environments.

Minimum Operating Temperature: 0 °C

This specification guarantees functionality in colder climates, increasing the range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin provides excellent solderability and resistance to corrosion, improving longevity and performance.

Terminal Position: QUAD

Quad positioning facilitates easier PCB layout and connection scheme, leading to higher design efficiency.

Maximum Seated Height: 1 mm

A low seated height is beneficial for height-sensitive applications, allowing for compact device designs.

Width: 4 mm

The compact width aids in minimizing the overall PCB size, which is advantageous for space-constrained applications.

Maximum Time At Peak Reflow Temperature: 40 s

A lower maximum time at peak reflow temperature minimizes the risk of overheating and damaging sensitive components.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature allows for compatibility with lead-free solder processes, complying with modern standards.

Length: 4 mm

The length dimension supports dense PCB designs, making this driver suitable for a variety of compact electronic applications.

Multiplexed Display Capability: YES

Multiplexed display capability is essential for efficiently driving multiple segments without increasing component count.

Terminal Form: NO LEAD

No-lead terminals reduce the size of the component footprint and improve manufacturability and reliability.

Nominal Supply Voltage: 12 V

The specified nominal voltage reinforces its suitability for standard electronic configurations and designs.

No. of Segments: 6

Having the capability to drive up to 6 segments enhances its functionality for multi-digit displays and applications.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for tighter packing of components, which is ideal for high-density boards.

Minimum fmax: 0.22 MHz

This frequency supports a variety of display types and ensures smooth operation, enhancing user experience.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates adequate resistance to moisture, important for long-term reliability in varied environmental conditions.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, it is tailored for specific applications, providing optimized performance and functionality.

Technical Specifications

Graphics Display Drivers LED7706 attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

YES

No. of Functions:

1

No. of Segments:

6

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Minimum fmax:

.22 MHz

Trade Compliance

LED7706 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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