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LE33ABZ-AP

STMicroelectronics

LE33ABZ-AP by STMicroelectronics

LE33ABZ-AP by STMicroelectronics is a fixed positive LDO regulator with a nominal output of 3.3 V and a max load current of 0.1 A. It operates b/w -40 °C to 125 °C, featuring low dropout voltage (0.2 V) and excellent line regulation (0.015%). Ideal for powering sensitive electronics in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,041 parts In-Stock

1+ parts

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3,041

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Anansix

USA . 2,010 parts In-Stock

1+ parts

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2,010

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Vyrian

USA . 748 parts In-Stock

1+ parts

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748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,244 parts In-Stock

1+ parts

$8.250

100+ parts

-

1k+ parts

$7.425

10k+ parts

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2,244

$8.250

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$7.425

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MKK Technologies

India . 2,090 parts In-Stock

1+ parts

$15.513

100+ parts

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2,090

$15.513

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DigiPath Technology Company

USA . 2,090 parts In-Stock

1+ parts

$15.513

100+ parts

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2,090

$15.513

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Parana Technologies

USA . 1,234 parts In-Stock

1+ parts

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$9.864

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1,234

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$9.864

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Corphita

USA . 826 parts In-Stock

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826

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Overview

Experience unparalleled reliability with the LE33ABZ-AP from STMicroelectronics, a leader in innovative semiconductor solutions. This fixed positive LDO regulator ensures stable performance across diverse applications, from consumer electronics to industrial devices. With its robust design, it operates seamlessly in extreme temperatures, delivering consistent output and minimal dropout voltage. Trust STMicroelectronics for quality that drives efficiency and longevity in your projects. Elevate your designs today!

Feature Benefit Bullets

Maximum Dropout Voltage: 1.5 V

A low dropout voltage allows the regulator to maintain output voltage efficiently even when the input voltage is close to the output voltage, ensuring better performance in battery-operated applications.

Operating Temperature (TJ-Max): 125 °C

This high maximum operating temperature enhances reliability, making the regulator suitable for applications in demanding thermal environments.

Technology: BIPOLAR

Bipolar technology offers good performance in terms of noise levels and transient response, beneficial for precision applications.

Package Shape: ROUND

The round package shape often allows for better fit in compact designs while providing adequate cooling.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stable mounting and good heat dissipation, making this regulator easy to integrate into various PCBs.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range ensures reliable performance in harsh conditions, suitable for outdoor or industrial applications.

Packing Method: AMMO PACK

The ammo pack configuration facilitates convenient handling and assembly during manufacturing, streamlining the production process.

Minimum Output Voltage: 3.234 V

The minimum output voltage ensures usability in applications requiring a specified voltage range and provides flexibility in design.

Maximum Voltage Tolerance: 2%

A tight voltage tolerance ensures that the output voltage remains stable under varying load conditions, improving overall system reliability.

Nominal Output Voltage: 3.3 V

The 3.3V nominal output voltage is a standard voltage level, making this regulator compatible with a wide array of modern electronics.

No. of Terminals: 3

Having only three terminals simplifies the circuit design, making it easier for engineers to integrate into their projects.

Package Style (Meter): CYLINDRICAL

The cylindrical package style design optimizes space usage, which is particularly advantageous for compact electronic devices.

Adjustability: FIXED

Fixed output makes for straightforward design and reliability since there's no need for an external resistor to set the output voltage.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for good spacing in board layouts, making it suitable for high-density applications.

Maximum Line Regulation: 0.015%

Excellent line regulation ensures that output voltage remains stable despite variations in input voltage, contributing to overall performance stability.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator is ideal for applications requiring a simple, reliable power supply with low dropout characteristics.

Terminal Finish: TIN

A tin terminal finish helps improve solderability and provides good protection against corrosion during assembly.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better placement flexibility on PCB, aiding in efficient layout designs.

Maximum Output Voltage: 3.366 V

The maximum output voltage provides a defined upper limit which is essential for ensuring components receive the appropriate power levels.

Maximum Load Regulation: 0.015%

Strong load regulation means that changes in load don't significantly affect the output voltage, enhancing reliability in variable load conditions.

Minimum Input Voltage: 4 V

A low minimum input voltage allows compatibility with a variety of power sources, including batteries.

Maximum Output Current: 0.1 A

With a maximum output current of 0.1 A, this regulator can handle light to moderate loads effectively, making it versatile for many applications.

Nominal Dropout Voltage: 0.2 V

A nominal dropout voltage of only 0.2 V ensures efficient operation and extended battery life in portable devices.

Maximum Input Voltage: 18 V

This high maximum input voltage allows the regulator to be used in high voltage applications without risk of damage.

Maximum Input Voltage Absolute: 20 V

The absolute maximum input voltage offers additional safety margin, making it robust against unexpected voltage spikes.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LE33ABZ-AP attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

4 V

JESD-30 Code:

O-XBCY-T3

JESD-609 Code:

e3

Maximum Line Regulation:

.015 %

Maximum Load Regulation:

.015 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Packing Method:

AMMO PACK

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

2 %

Trade Compliance

LE33ABZ-AP Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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