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LD3985G18R

STMicroelectronics

LD3985G18R by STMicroelectronics

LD3985G18R from STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 1.8 V and a max output current of 150 mA. It features low dropout voltage (0.06 V) and operates in temperatures from -40 °C to 125 °C, ideal for compact electronic applications. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,196 parts In-Stock

1+ parts

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4,196

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Anansix

USA . 2,224 parts In-Stock

1+ parts

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100+ parts

-

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2,224

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Digiode

USA . 677 parts In-Stock

1+ parts

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677

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 344 parts In-Stock

1+ parts

$0.592

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$0.592

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-

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IDEA Electronic Components Group

UK . 1,622 parts In-Stock

1+ parts

$9.039

100+ parts

-

1k+ parts

$8.135

10k+ parts

-

1,622

$9.039

-

$8.135

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MKK Technologies

India . 1,700 parts In-Stock

1+ parts

$16.997

100+ parts

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1,700

$16.997

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DigiPath Technology Company

USA . 1,700 parts In-Stock

1+ parts

$16.997

100+ parts

-

1k+ parts

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1,700

$16.997

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-

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AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$20.630

100+ parts

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687

$20.630

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Corphita

USA . 4,524 parts In-Stock

1+ parts

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4,524

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Parana Technologies

USA . 2,285 parts In-Stock

1+ parts

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100+ parts

$10.808

1k+ parts

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2,285

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$10.808

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Vigor

Singapore . 1,100 parts In-Stock

1+ parts

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100+ parts

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1,100

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Overview

Elevate your designs with the LD3985G18R from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality LDO regulator offers unmatched stability and efficiency, perfect for powering sensitive applications across consumer electronics, automotive, and industrial sectors. With its ultra-low dropout voltage and robust temperature range, you can count on reliable performance. Experience the advantage of superior design and reliability that STMicroelectronics delivers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against moisture, making it suitable for various applications.

Maximum Dropout Voltage: 1.1 V

A low maximum dropout voltage indicates efficient performance, allowing for better regulation even at lower input-output differential voltages.

Surface Mount: YES

Being surface mount compatible simplifies the PCB assembly process and reduces the needed board space, ideal for compact designs.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature makes this LDO suitable for use in demanding environments without risking damage.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS processes, providing high performance in terms of speed and low power consumption.

Package Shape: RECTANGULAR

The rectangular shape allows for more efficient layout on circuit boards, optimizing space and routing.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and better mechanical strength, ensuring lasting connections.

Operating Temperature (TJ-Min): -40 °C

With a wide operating temperature range, this product can perform reliably in extreme cold conditions.

Packing Method: TR

Tape and reel packing enables automated handling and efficient placement in high-volume manufacturing.

Minimum Output Voltage: 1.725 V

A specified minimum output voltage ensures reliable operation without risking output dropout.

Maximum Voltage Tolerance: 4%

With a voltage tolerance of 4%, this LDO ensures stable performance within operational parameters, reducing the risk of circuit failure.

Nominal Output Voltage: 1.8 V

The nominal output voltage of 1.8 V is a commonly used level for many digital circuits, making this LDO versatile.

No. of Terminals: 5

Having 5 terminals provides sufficient connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline package style optimizes space and allows for high-density circuit designs.

Adjustability: FIXED

Fixed output voltage eliminates the need for external components to adjust the output, simplifying design considerations.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch is well-suited for modern PCB designs, allowing for high-density layout.

Maximum Line Regulation: 0.0063%

Exceptional line regulation ensures that output voltage remains stable despite variations in input voltage, crucial for sensitive electronics.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive output LDO makes this part ideal for powering low-voltage logic circuits, ensuring stable performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and corrosion resistance, resulting in improved reliability.

Terminal Position: DUAL

Dual terminal position allows for flexible layouts and easier implementation in various PCB designs.

Maximum Output Voltage: 1.875 V

A reasonable maximum output voltage expands the application range, providing the ability to design both low-power analog and digital circuits.

Maximum Seated Height: 1.1 mm

A low seated height ensures the component is suitable for thin and low-profile applications.

Width: 1.6 mm

A compact width aids in space-saving designs, allowing for denser assemblies.

Minimum Input Voltage: 2.5 V

The minimum input voltage of 2.5 V allows for a broad range of input power sources, enhancing versatility.

Maximum Output Current: 0.15 A

An output current capability of 0.15 A meets the needs of many low-power devices, providing sufficient current without overheating.

Maximum Time At Peak Reflow Temperature: 30s

A maximum reflow time of 30 seconds ensures compatibility with lead-free solder processes, making it suitable for modern manufacturing.

Peak Reflow Temperature: 260 °C

This high reflow temperature increases the robustness of the product during assembly, preventing damage during the soldering process.

Nominal Dropout Voltage: 0.06 V

A low nominal dropout voltage enhances the efficiency of the regulator in low-input/output applications, maximizing battery life.

Length: 2.9 mm

A short length contributes to the compact profile, making it suitable for space-constrained designs.

Maximum Input Voltage: 6 V

The ability to handle inputs up to 6 V provides flexibility in system design, accommodating various power supply options.

Maximum Input Voltage Absolute: 6 V

A clearly defined absolute maximum voltage ensures reliable operation and protects against potential overvoltage situations.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD3985G18R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.06 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Maximum Line Regulation:

.0063 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

1.875 V

Minimum Output Voltage-1:

1.725 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

4 %

Width:

1.6 mm

Trade Compliance

LD3985G18R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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