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LD39015XG08R

STMicroelectronics

LD39015XG08R by STMicroelectronics

LD39015XG08R from STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 0.8 V and a max output current of 150 mA. It operates efficiently in temperatures ranging from -40 °C to 125°C, featuring a low dropout voltage of just 0.1 V. Ideal for compact applications, it comes in a small outline package with no lead terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,853 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,927 parts In-Stock

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2,927

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Bristol Electronics

USA . 2,927 parts In-Stock

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2,927

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Dan-Mar Components

USA . 2,927 parts In-Stock

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2,927

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Digiode

USA . 2,863 parts In-Stock

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Anansix

USA . 628 parts In-Stock

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IDEA Electronic Components Group

UK . 924 parts In-Stock

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$7.241

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$6.517

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924

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Microchip USA

USA . 466 parts In-Stock

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$8.459

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466

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AZTECH Wire

Italy . 1,156 parts In-Stock

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$13.470

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$13.470

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MKK Technologies

India . 1,662 parts In-Stock

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$13.617

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DigiPath Technology Company

USA . 1,662 parts In-Stock

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$13.617

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Perfect Parts

USA . 6,720 parts In-Stock

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Vigor

Singapore . 1,105 parts In-Stock

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Parana Technologies

USA . 912 parts In-Stock

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Corphita

USA . 762 parts In-Stock

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Overview

Unlock reliable performance with the LD39015XG08R from STMicroelectronics, a leader in cutting-edge semiconductor solutions! This compact LDO regulator ensures optimal voltage stability even in demanding environments. With its low dropout voltage and robust thermal performance, it's perfect for powering precision devices in consumer electronics, IoT applications, and automotive systems. Choose LD39015XG08R for efficiency, durability, and peace of mind—your trusted partner in innovation!

Feature Benefit Bullets

Maximum Dropout Voltage: 1.1 V

A low dropout voltage ensures that the regulator works efficiently even with small differences between input and output voltage, making it suitable for battery-powered applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact circuit designs, enabling more efficient use of PCB space.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this LDO can function effectively in demanding environments without risk of overheating.

Technology: BICMOS

BICMOS technology provides the advantages of both bipolar and CMOS processes, resulting in low noise and high performance.

Package Shape: RECTANGULAR

The rectangular shape facilitates better pcb layout and design flexibility, ensuring efficient use of space.

Terminal Form: NO LEAD

No lead design reduces the size of the package and contributes to improved soldering reliability for surface mount applications.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range allows for versatility in various environmental conditions, making it ideal for automotive and industrial uses.

Packing Method: TR

Tape and reel packaging ensures efficient handling and ease of automated assembly processes.

Minimum Output Voltage: 0.776 V

A low minimum output voltage expands application scope, allowing compatibility with low voltage systems.

Maximum Voltage Tolerance: 3.75%

This output voltage tolerance ensures reliable operation even in variable input conditions, enhancing system stability.

Nominal Output Voltage: 0.8 V

Stable nominal output voltage caters to a wide range of electronic devices, providing consistent power supply.

No. of Terminals: 6

The six terminals offer ample connectivity options for various applications, simplifying circuit design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

A compact and thin profile allows for space-saving designs in modern electronics, perfect for portable devices.

Adjustability: FIXED

A fixed output provides simplicity in design and reduces the need for additional external components.

Terminal Pitch: 0.5 mm

A fine terminal pitch enhances the ability to embed the device in densely packed circuit boards.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

The fixed positive output is ideal for applications that require a constant voltage without the need for adjustment.

Terminal Position: DUAL

Dual terminal positioning can assist in better heat dissipation and provides a more straightforward design for circuit layouts.

Maximum Output Voltage: 0.824 V

The maximum output voltage ensures that the regulator can accommodate a variety of load requirements.

Maximum Seated Height: 0.6 mm

A low seated height contributes to the compactness of the device, allowing for more compact assembly in electronic products.

Width: 1.2 mm

This small width allows for better integration in tight spaces, ideal for portable and miniaturized devices.

Minimum Input Voltage: 1.5 V

A low minimum input voltage facilitates operation in battery-powered scenarios where input voltages can be limited.

Maximum Output Current: 0.15 A

Supporting up to 150 mA output current means it can drive low-power devices effectively without risk of overload.

Nominal Dropout Voltage: 0.08 V

A nominal dropout voltage of only 80 mV maximizes efficiency by allowing operation through extended periods of low input voltage.

Length: 1.66 mm

Short length enhances versatility in circuit design, making it easier to fit into various layouts.

Maximum Input Voltage: 5.5 V

Able to handle input voltages up to 5.5 V ensures that it can work effectively in a broad range of applications.

Maximum Input Voltage Absolute: 7 V

A robust maximum absolute input voltage protects the regulator from overvoltage conditions, enhancing operational safety.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD39015XG08R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.08 V

Maximum Input Voltage Absolute:

7 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.5 V

JESD-30 Code:

R-XDSO-N6

Length:

1.66 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

6

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Voltage-1:

.824 V

Minimum Output Voltage-1:

.776 V

Nominal Output Voltage-1:

.8 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

FL6,.047,20

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

1.2 mm

Trade Compliance

LD39015XG08R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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