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LD29300P2MR

STMicroelectronics

LD29300P2MR by STMicroelectronics

LD29300P2MR by STMicroelectronics is an adjustable positive LDO regulator with a max output of 13.3V and 3A current. It operates b/w -40 °C to 125 °C, ensuring reliability in various applications. Ideal for compact designs, it features a small outline package with gull-wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,837 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,837

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-

-

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Anansix

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,822

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Digiode

USA . 125 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$7.054

100+ parts

-

1k+ parts

$6.348

10k+ parts

-

2,033

$7.054

-

$6.348

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MKK Technologies

India . 363 parts In-Stock

1+ parts

$13.264

100+ parts

-

1k+ parts

-

10k+ parts

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363

$13.264

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DigiPath Technology Company

USA . 363 parts In-Stock

1+ parts

$13.264

100+ parts

-

1k+ parts

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10k+ parts

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363

$13.264

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Parana Technologies

USA . 1,516 parts In-Stock

1+ parts

-

100+ parts

$8.434

1k+ parts

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10k+ parts

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1,516

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$8.434

-

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Corphita

USA . 1,091 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,091

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Overview

Unlock exceptional performance with the LD29300P2MR from STMicroelectronics, a leader in innovative semiconductor solutions. This adjustable LDO regulator seamlessly delivers reliable power across diverse applications, from consumer electronics to industrial systems. With its robust design and temperature resilience, it ensures stable operation even in challenging conditions. Experience unmatched quality and efficiency that elevate your projects to new heights—choose LD29300P2MR for superior power management!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mounting allows for a smaller footprint on PCBs, increasing design flexibility and space efficiency.

Operating Temperature (TJ-Max): 125 °C

A maximum operating temperature of 125 °C allows for reliable performance in high-temperature environments.

Technology: BIPOLAR

Bipolar technology enhances the performance characteristics, providing better stability and efficiency.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient PCB layout and optimizes space utilization.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the mechanical strength of the connection.

Operating Temperature (TJ-Min): -40 °C

Operating down to -40 °C makes this LDO suitable for use in extreme cold environments.

Packing Method: TR

Tape and reel packaging simplifies automated assembly processes, enhancing production efficiency.

Minimum Output Voltage-1: 1.23 V

A low minimum output voltage allows for a wider range of applications, including low-power devices.

No. of Terminals: 5

Five terminals provide multiple connection options, adding versatility to the integration process.

Maximum Line Regulation (%/V): 0.048

This low line regulation indicates excellent performance under varying input voltage conditions.

Package Style (Meter): SMALL OUTLINE

The small outline style is perfect for compact applications where space is critical.

Adjustability: ADJUSTABLE

Adjustability allows users to fine-tune the output voltage to meet specific circuit requirements.

Maximum Load Regulation (%): 1 %

With a maximum load regulation of 1%, the product ensures stable output across varying loads.

Terminal Pitch: 1.7 mm

A terminal pitch of 1.7 mm facilitates compatibility with a wide range of PCB designs and layouts.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Designed as a positive single output LDO, this regulator provides the necessary voltage regulation effectively.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and enhances the long-term reliability of the connections.

Terminal Position: SINGLE

A single terminal position simplifies component placement and minimizes design complexity.

Maximum Output Voltage-1: 13.3 V

The capability of providing an output voltage up to 13.3 V makes it suitable for diverse applications.

Maximum Output Current-1: 3 A

A maximum output current of 3 A allows this regulator to support demanding applications without overheating.

Peak Reflow Temperature °C: 245

The high peak reflow temperature indicates compatibility with standard soldering processes and materials.

Nominal Dropout Voltage-1: 1.27 V

A nominal dropout voltage of 1.27 V ensures efficient operation even under low-input voltage conditions.

Maximum Seated Height: 5.03 mm

A maximum seated height of 5.03 mm allows for compact designs, crucial in space-constrained applications.

Width: 9.15 mm

The compact width of 9.15 mm enables integration into smaller PCB layouts while maintaining functionality.

Length: 10.2 mm

With a length of 10.2 mm, this LDO regulator is suitable for various applications where space is a premium.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LD29300P2MR attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

ADJUSTABLE

Nominal Dropout Voltage-1:

1.27 V

JESD-30 Code:

R-PSSO-G5

JESD-609 Code:

e3

Length:

10.2 mm

Maximum Line Regulation (%/V):

.048

Maximum Load Regulation (%):

1 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

3 A

Maximum Output Voltage-1:

13.3 V

Minimum Output Voltage-1:

1.23 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

245

Qualification Status:

Not Qualified

Maximum Seated Height:

5.03 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Width:

9.15 mm

Trade Compliance

LD29300P2MR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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