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LD29080PT

STMicroelectronics

LD29080PT by STMicroelectronics

LD29080PT from STMicroelectronics is an adjustable positive LDO regulator with a max output current of 0.8 A and a dropout voltage of just 0.7 V. It operates in temperatures ranging from -40 °C to 125 °C, making it ideal for various applications. Its compact SO package ensures efficient surface mounting in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,467 parts In-Stock

1+ parts

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2,467

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Anansix

USA . 1,440 parts In-Stock

1+ parts

-

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1k+ parts

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1,440

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Vyrian

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

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1,350

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Cogito LLC

Ukraine . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 650 parts In-Stock

1+ parts

$8.591

100+ parts

-

1k+ parts

$7.732

10k+ parts

-

650

$8.591

-

$7.732

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MKK Technologies

India . 202 parts In-Stock

1+ parts

$16.155

100+ parts

-

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202

$16.155

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DigiPath Technology Company

USA . 202 parts In-Stock

1+ parts

$16.155

100+ parts

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202

$16.155

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Corphita

USA . 3,297 parts In-Stock

1+ parts

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3,297

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Parana Technologies

USA . 1,983 parts In-Stock

1+ parts

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100+ parts

$10.272

1k+ parts

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1,983

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$10.272

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Overview

Elevate your designs with the LD29080PT from STMicroelectronics, a leader in innovation and reliability. This adjustable LDO regulator delivers consistent performance with a compact footprint, making it ideal for a wide range of applications—from consumer electronics to industrial automation. Experience enhanced efficiency and durability across varying temperatures while benefiting from ST's commitment to quality and advanced technology. Choose LD29080PT for unmatched value in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions, making this product well-suited for a range of applications.

Maximum Dropout Voltage: 1.7 V

A low dropout voltage allows the LDO regulator to efficiently maintain a stable output voltage even when the input voltage is near the output voltage, enhancing its performance in power-sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and higher density in PCB layouts, making this regulator ideal for space-constrained applications.

Operating Temperature (TJ-Max): 125 °C

With a maximum operating temperature of 125 °C, this LDO can function reliably in high-temperature environments, ensuring robust performance under demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape provides effective mounting and space optimization on printed circuit boards, facilitating easier integration into various electronic designs.

Terminal Form: GULL WING

Gull wing terminals offer a reliable surface mount connection with good soldering characteristics, which is critical for maintaining strong electrical connections over time.

Operating Temperature (TJ-Min): -40 °C

The capability to operate at low temperatures down to -40 °C ensures that the regulator can be used in a wide variety of environments, including extreme conditions.

No. of Terminals: 4

With 4 terminals, this LDO regulator provides essential connectivity while still being compact, allowing for straightforward integration into circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes for a sleek design and reduces the overall form factor of the final product, which is essential for modern electronics.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is a standard size in many applications, ensuring compatibility with a wide range of PCB layouts and enhancing assembly efficiency.

Regulator Type: ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

Being an adjustable LDO allows for versatile output voltage settings, providing flexibility in design and compatibility with various load requirements.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and helps prevent oxidation, ensuring reliable long-term performance and connectivity.

Terminal Position: SINGLE

Single terminal positioning simplifies the PCB layout and minimizes the circuit complexity, making it easier to design effective and efficient electronic systems.

Maximum Seated Height: 2.63 mm

A low seated height allows for a slim profile, contributing to a compact design and making it suitable for low-profile applications.

Width: 6.1 mm

A width of 6.1 mm helps ensure that the component can fit into tight spaces, enhancing layout options in electronic designs.

Maximum Output Current: 0.8 A

With a maximum output current of 0.8 A, this LDO regulator can handle a variety of loads efficiently, making it a solid choice for several applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand up to 30 seconds at peak reflow temperature ensures reliability during the soldering process, preventing damage during PCB manufacturing.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is compatible with most soldering processes, ensuring that the regulator can be integrated into modern electronic assemblies without issues.

Length: 6.5 mm

A length of 6.5 mm contributes to a compact form factor, allowing more design freedom in space-restricted applications, thereby enhancing versatility.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LD29080PT attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.7 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

LD29080PT Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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