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LD29150DT33

STMicroelectronics

LD29150DT33 by STMicroelectronics

LD29150DT33 from STMicroelectronics is a fixed positive LDO regulator with a nominal output of 3.3 V and max current of 1.5 A. It features a low dropout voltage of 0.4 V and operates in temperatures from -40 °C to 125 °C, ideal for compact electronic applications. Its gull-wing package ensures easy surface mounting for efficient design integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,518 parts In-Stock

1+ parts

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8,518

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Digiode

USA . 2,621 parts In-Stock

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2,621

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Anansix

USA . 874 parts In-Stock

1+ parts

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874

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$6.824

100+ parts

-

1k+ parts

$6.141

10k+ parts

-

2,028

$6.824

-

$6.141

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MKK Technologies

India . 280 parts In-Stock

1+ parts

$12.831

100+ parts

-

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280

$12.831

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DigiPath Technology Company

USA . 280 parts In-Stock

1+ parts

$12.831

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-

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280

$12.831

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Microchip USA

USA . 475 parts In-Stock

1+ parts

$19.488

100+ parts

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475

$19.488

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AZTECH Wire

Italy . 54 parts In-Stock

1+ parts

$20.730

100+ parts

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54

$20.730

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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25,000

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Corphita

USA . 4,366 parts In-Stock

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4,366

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Kepictronics

USA . 4,285 parts In-Stock

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4,285

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Vigor

Singapore . 3,975 parts In-Stock

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3,975

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Parana Technologies

USA . 255 parts In-Stock

1+ parts

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100+ parts

$8.159

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255

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$8.159

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Overview

Elevate your designs with the LD29150DT33 from STMicroelectronics, a leader in high-quality semiconductor solutions. This reliable LDO regulator ensures stable performance even in challenging conditions, making it perfect for automotive, industrial, and consumer electronics applications. With exceptional line and load regulation, coupled with a compact surface-mount design, it delivers efficiency and precision that empower engineers to create robust, cutting-edge devices. Choose LD29150DT33 for unparalleled value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this LDO a reliable choice in various applications.

Maximum Dropout Voltage: 0.7 V

A lower dropout voltage allows for better efficiency in battery-powered applications, ensuring the LDO operates effectively even with minimal input voltage.

Surface Mount: YES

Surface mount technology simplifies assembly and reduces PCB space, allowing for compact design in electronic projects.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature ensures stability and performance in demanding environments, suitable for industrial applications.

Technology: BIPOLAR

Bipolar technology provides lower noise and better performance for analog applications, making the LDO a solid choice for sensitive circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration onto PCBs, optimizing layout design for space-constrained applications.

Terminal Form: GULL WING

Gull wing terminals improve soldering reliability and ease of inspection, contributing to a higher quality of the final assembly.

Operating Temperature (TJ-Min): -40 °C

Withstand extreme low temperatures, making this LDO suitable for applications in cold environments, such as outdoor equipment.

Minimum Output Voltage: 3.234 V

A specified minimum output voltage helps in maintaining consistent performance across various load conditions.

Maximum Voltage Tolerance: 2 %

Excellent voltage tolerance ensures stable output, crucial for maintaining the integrity of sensitive electronic circuits.

Nominal Output Voltage: 3.3 V

Common output voltage suitable for powering a wide range of devices, making it a versatile choice in electronics.

No. of Terminals: 2

The simple two-terminal design facilitates easy integration into circuits, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, providing flexibility in design.

Adjustability: FIXED

Fixed output provides reliability and simplifies design, as there’s no need for external adjustable components.

Terminal Pitch: 2.28 mm

The terminal pitch facilitates ease of routing on PCBs, enhancing design efficiency and manufacturability.

Maximum Line Regulation: 0.0165 %

Exceptional line regulation ensures output voltage remains stable despite variations in input voltage, ensuring reliable performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

The fixed positive output configuration makes it ideal for steady voltage applications, minimizing design complexity.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability and enhances the longevity of connections on the PCB.

Terminal Position: SINGLE

Single terminal position leads to easier PCB layout and soldering, enhancing manufacturing efficiency.

Maximum Output Voltage: 3.366 V

With a maximum output voltage above the nominal, it allows for a buffer in applications that may require higher transient loads.

Maximum Seated Height: 2.63 mm

A low profile seated height is ideal for compact designs where board space is at a premium.

Width: 6.1 mm

Narrow dimensions make it easy to place multiple LDOs on a PCB, allowing for more flexible circuit design.

Maximum Load Regulation: 0.033 %

Low load regulation ensures stable voltage output under fluctuating load conditions, providing high reliability for sensitive applications.

Minimum Input Voltage: 4.3 V

A minimum input voltage that is reasonably low offers versatility in different application scenarios, accommodating various power supplies.

Maximum Output Current: 1.5 A

Capable of delivering up to 1.5 A output current, this LDO is suitable for a variety of power supply applications.

Maximum Time At Peak Reflow Temperature: 30 s

Compatibility with standard reflow soldering processes contributes to easy assembly in automated production environments.

Peak Reflow Temperature: 260 °C

High peak reflow temperature tolerance ensures reliability and robustness in the soldering process.

Nominal Dropout Voltage: 0.4 V

A low nominal dropout voltage is advantageous for battery-powered devices, allowing longer run times and improved efficiency.

Length: 6.5 mm

Compact dimensions allow for efficient use of board space, which is crucial for modern electronic designs.

Maximum Input Voltage: 13 V

The ability to handle up to 13 V input makes it versatile enough to cater to various power supply sources.

Maximum Input Voltage Absolute: 30 V

A high absolute input voltage rating provides a safety margin for applications with potential voltage spikes, ensuring device protection.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LD29150DT33 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

13 V

Minimum Input Voltage:

4.3 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.0165 %

Maximum Load Regulation:

.033 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

1.5 A

Maximum Output Voltage-1:

3.366 V

Minimum Output Voltage-1:

3.234 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

2 %

Width:

6.1 mm

Trade Compliance

LD29150DT33 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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