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L9952GXP

STMicroelectronics

L9952GXP by STMicroelectronics

L9952GXP by STMicroelectronics is a versatile power management IC with a nominal voltage of 13.5 V and supports a range from 6 to 18 V. It features a compact design with 36 terminals in a small outline package, ideal for efficient power supply management in various applications. Its CMOS technology ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 10,500 parts In-Stock

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Vyrian

USA . 3,056 parts In-Stock

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3,056

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Anansix

USA . 1,886 parts In-Stock

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1,886

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Digiode

USA . 958 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$2.660

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$2.660

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IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$10.871

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-

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$9.784

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1,866

$10.871

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$9.784

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AZTECH Wire

Italy . 870 parts In-Stock

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$12.460

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870

$12.460

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Microchip USA

USA . 1,141 parts In-Stock

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$13.015

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$13.015

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MKK Technologies

India . 225 parts In-Stock

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$20.442

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$20.442

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DigiPath Technology Company

USA . 225 parts In-Stock

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$20.442

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$20.442

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A-Z Elektronik GmbH

Germany . 6,287 parts In-Stock

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RC Electronics

USA . 4,253 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,191 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 1,663 parts In-Stock

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$12.998

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$12.998

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 249 parts In-Stock

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Overview

Unlock the power of cutting-edge efficiency with the L9952GXP from STMicroelectronics. Renowned for their commitment to innovation and reliability, STMicroelectronics delivers an exceptional Power Management IC that streamlines your designs with unmatched performance. Ideal for automotive and industrial applications, this compact powerhouse ensures optimal energy management, reducing costs while enhancing system longevity. Elevate your projects with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protection against environmental stresses.

Surface Mount: YES

Surface mount capability allows for compact design and easier integration into modern PCB layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, making it suitable for high-density applications.

Nominal Supply Voltage (Vsup): 13.5 V

A nominal voltage of 13.5 V provides flexibility for a variety of power applications, enhancing versatility.

Power Supplies (V): 6/18

Supports a wide range of power supplies, allowing it to be used in diverse applications with varying voltage requirements.

No. of Terminals: 36

Having 36 terminals allows for multiple connections, facilitating complex circuit designs and functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The small outline package style with heat sink/slug configuration enhances thermal performance and space efficiency.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and resistance to oxidation, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in circuit design, enabling optimal layout options.

Maximum Seated Height: 2.47 mm

A low maximum seated height is advantageous for slim-profile designs, increasing application versatility.

Width: 7.5 mm

A compact width allows for efficient use of PCB space, essential for modern electronic devices.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, it is tailored for applications requiring efficient power regulation.

Minimum Supply Voltage (Vsup): 6 V

Supports a minimum voltage of 6 V, catering to lower voltage applications while ensuring operational reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, it is compatible with standard soldering processes, aiding in manufacturability.

Length: 10.3 mm

A manageable length aids in efficient layout designs, supporting both standard and compact applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high performance, ideal for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide excellent accessibility for soldering, improving reliability and robustness of connections.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher density connections, making it suitable for compact circuit designs.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates good handling and manufacturing processes, suitable for many environments.

Maximum Supply Voltage (Vsup): 18 V

The capability to handle a maximum voltage of 18 V enhances the range of applications in various electronic devices.

Technical Specifications

Power Management ICs L9952GXP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

6/18

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L9952GXP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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