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L9805E

STMicroelectronics

L9805E by STMicroelectronics

L9805E by STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 18V and operates at up to 16 MHz. It features ADC and PWM channels, making it ideal for embedded applications. Its compact flatpack design ensures efficient space utilization in devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,560 parts In-Stock

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6,560

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Anansix

USA . 1,061 parts In-Stock

1+ parts

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1,061

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Pegasus Components GmbH

Germany . 242 parts In-Stock

1+ parts

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242

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Digiode

USA . 230 parts In-Stock

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230

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$8.660

100+ parts

-

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-

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-

2,500

$8.660

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-

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AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$21.400

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-

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644

$21.400

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IDEA Electronic Components Group

UK . 2,151 parts In-Stock

1+ parts

$59.471

100+ parts

-

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$53.524

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2,151

$59.471

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$53.524

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MKK Technologies

India . 165 parts In-Stock

1+ parts

$111.831

100+ parts

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165

$111.831

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DigiPath Technology Company

USA . 165 parts In-Stock

1+ parts

$111.831

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165

$111.831

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QUARKTWIN TECHNOLOGY LTD

USA . 22,037 parts In-Stock

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22,037

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Corphita

USA . 4,268 parts In-Stock

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4,268

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Microchip USA

USA . 2,770 parts In-Stock

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2,770

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Parana Technologies

USA . 2,205 parts In-Stock

1+ parts

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100+ parts

$71.106

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2,205

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$71.106

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Overview

Elevate your projects with the L9805E microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this compact powerhouse offers seamless integration into a variety of applications—from industrial automation to consumer electronics. With robust performance and energy efficiency, the L9805E ensures reliable operation while simplifying design processes. Trust in STMicroelectronics for cutting-edge technology that drives value in every solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing, making it easier to integrate into modern electronic devices.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, the microcontroller can operate in demanding applications without the risk of damage.

Package Shape: SQUARE

The square package shape enhances space efficiency on PCBs (Printed Circuit Boards), allowing for more compact designs.

Bit Size: 8

An 8-bit architecture is ideal for low-power applications and simple control tasks, making it suitable for various embedded systems.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with a variety of sensors and peripherals, enhancing system flexibility.

Package Style (Meter): FLATPACK

Flatpack style facilitates easier assembly and offers a lower profile, beneficial for space-constrained designs.

Minimum Supply Voltage: 6.4 V

A minimum supply voltage of 6.4V allows for flexibility in power source selection while maintaining efficient performance.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals, essential for applications involving sensors and real-world data.

Terminal Position: QUAD

Quad terminal positioning provides stable mounting and simplifies PCB layout considerations for designers.

Maximum Seated Height: 3.15 mm

A low seated height contributes to a compact form factor, allowing it to fit into tighter spaces in electronic designs.

Width: 14 mm

A width of 14 mm allows for efficient space utilization in printed circuit board layouts.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing speed for most basic applications without excessive power consumption.

Length: 14 mm

The 14 mm length promotes a small footprint on PCB designs, making it ideal for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this IC integrates processing capabilities with peripheral features, enabling complex functionalities in a single package.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, which is advantageous for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance the reliability of connections on PCBs.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V is commonly used in many applications, indicating compatibility with standard power supplies.

PWM Channels: YES

The presence of PWM channels allows for efficient control of motors and other devices, enhancing versatility for different applications.

ROM Programmability: EEPROM

EEPROM programmability provides non-volatile storage for user data and settings, allowing for easier updates and configuration changes.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact design while maintaining reliable connectivity, suitable for dense PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard handling precautions, which is manageable in typical manufacturing processes.

Speed: 8 rpm

A speed of 8 rpm is suitable for low-speed applications like sensors or actuators, making this microcontroller versatile for various tasks.

No. of I/O Lines: 10

Ten I/O lines offer adequate connectivity for connecting various peripherals and expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers L9805E attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

64

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

ROM Programmability:

EEPROM

Maximum Seated Height:

3.15 mm

Speed:

8 rpm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

6.4 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

L9805E Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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