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L9733TR

STMicroelectronics

L9733TR by STMicroelectronics

L9733TR by STMicroelectronics is a robust peripheral driver designed for automotive applications, operating b/w -40 °C and 125 °C. It features built-in overcurrent and thermal protections, with a max supply voltage of 5.5V. This compact device supports efficient signal buffering/inverting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,845

-

-

-

-

Anansix

USA . 771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

771

-

-

-

-

Vyrian

USA . 663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

663

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,196 parts In-Stock

1+ parts

$12.642

100+ parts

-

1k+ parts

$11.378

10k+ parts

-

1,196

$12.642

-

$11.378

-

MKK Technologies

India . 2,287 parts In-Stock

1+ parts

$23.772

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

$23.772

-

-

-

DigiPath Technology Company

USA . 2,287 parts In-Stock

1+ parts

$23.772

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

$23.772

-

-

-

Corphita

USA . 2,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,399

-

-

-

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Parana Technologies

USA . 202 parts In-Stock

1+ parts

-

100+ parts

$15.115

1k+ parts

-

10k+ parts

-

202

-

$15.115

-

-

Overview

Elevate your designs with the L9733TR from STMicroelectronics, a trusted name in innovation and quality. This robust peripheral driver excels in automotive applications, delivering remarkable performance with built-in overcurrent and thermal protections. Enjoy peace of mind knowing your projects are backed by a leader committed to excellence. With its compact design and reliable operation across extreme temperatures, the L9733TR ensures efficiency and longevity in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures durability and protection against environmental factors, making the product reliable in various operating conditions.

Surface Mount: YES

Surface mount technology offers a compact design, ideal for applications where space is limited on the PCB.

Maximum Supply Voltage: 5.5 V

This specification allows for flexibility in power supply options, making it suitable for a wide range of electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, contributing to efficient layout and design.

Built-in Protections: OVER CURRENT; THERMAL

With over current and thermal protections, this driver ensures safe operation and prolongs the lifespan of the device.

No. of Terminals: 28

A higher number of terminals allows for versatile connections and functionalities, enhancing the utility of the driver.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it well-suited for modern electronic applications that require compact solutions.

Minimum Supply Voltage: 4.5 V

This range allows the device to work effectively with standard supply voltages, providing compatibility with common systems.

Maximum Operating Temperature: 125 °C

An extended maximum operating temperature ensures reliability in high-temperature environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function in low temperatures expands its applicability in various climates and conditions.

Terminal Position: DUAL

Dual terminal positioning provides increased connection options, enhancing the versatility of the driver in different circuit layouts.

Maximum Seated Height: 2.65 mm

A low seated height allows the driver to fit into low-profile designs, which is crucial for space-constrained applications.

Width: 7.5 mm

A compact width aids in minimizing PCB space usage, facilitating complex designs with multiple components.

Length: 17.9 mm

The length is calibrated for efficient layout and integration into standard electronic circuits.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, this assures durability and performance in harsh automotive environments.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and improve mechanical stability, essential for reliable connections.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage enhances compatibility with various peripherals and systems, ensuring a broad range of applications.

Turn-on Time: 20 us

A quick turn-on time enhances responsiveness in real-time applications, making it suitable for high-speed devices.

Terminal Pitch: 1.27 mm

A pitch of 1.27 mm is standard for many devices, facilitating easy integration onto PCBs.

Turn-off Time: 100 us

An efficient turn-off time helps in preventing undesired signal continuance, optimizing performance in digital circuits.

Output Current Flow Direction: SOURCE

As a source, this driver can actively drive outputs high, which is beneficial for interfacing with a variety of peripheral devices effectively.

Technical Specifications

Peripheral Drivers L9733TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

100 us

Turn-on Time:

20 us

Width:

7.5 mm

Trade Compliance

L9733TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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