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L9660TR

STMicroelectronics

L9660TR by STMicroelectronics

L9660TR by STMicroelectronics is a 64-terminal interface IC with a supply voltage range of 4.9V to 5.1V. It features a low profile flatpack package style and operates in industrial temperature conditions (-40 °C to 95°C). Ideal for applications requiring fine pitch terminals, such as industrial automation and communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,803 parts In-Stock

1+ parts

-

100+ parts

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5,803

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Digiode

USA . 4,217 parts In-Stock

1+ parts

-

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4,217

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Anansix

USA . 2,625 parts In-Stock

1+ parts

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2,625

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Astute Electronics Inc

. 1,000 parts In-Stock

1+ parts

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 193 parts In-Stock

1+ parts

$3.431

100+ parts

-

1k+ parts

$3.088

10k+ parts

-

193

$3.431

-

$3.088

-

MKK Technologies

India . 1,943 parts In-Stock

1+ parts

$6.451

100+ parts

-

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10k+ parts

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1,943

$6.451

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DigiPath Technology Company

USA . 1,943 parts In-Stock

1+ parts

$6.451

100+ parts

-

1k+ parts

-

10k+ parts

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1,943

$6.451

-

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AZTECH Wire

Italy . 171 parts In-Stock

1+ parts

$15.470

100+ parts

-

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171

$15.470

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Microchip USA

USA . 2,401 parts In-Stock

1+ parts

$28.528

100+ parts

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2,401

$28.528

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Eastek

USA . 77,000 parts In-Stock

1+ parts

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77,000

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RC Electronics

USA . 8,084 parts In-Stock

1+ parts

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8,084

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,367 parts In-Stock

1+ parts

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$4.102

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2,367

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$4.102

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Corphita

USA . 1,191 parts In-Stock

1+ parts

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1,191

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Futuretech Components

Singapore . 662 parts In-Stock

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662

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Kepictronics

USA . 268 parts In-Stock

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268

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Overview

Elevate your product designs with the L9660TR by STMicroelectronics. As a renowned manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This interface IC is versatile, offering a wide range of applications in various industries. With its low profile and fine pitch package style, this product provides exceptional value to customers seeking high performance and efficiency. Trust in the L9660TR to meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto a PCB, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 5.1 V

The high maximum supply voltage allows for flexibility in design and compatibility with a wide range of applications.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for space-constrained applications.

No. of Terminals: 64

Having 64 terminals allows for versatile connectivity options and functionality, making the product suitable for various interface requirements.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a low profile design with fine pitch terminals, enabling high-density mounting and efficient signal routing.

Minimum Supply Voltage: 4.9 V

The low minimum supply voltage ensures stable operation and power efficiency, enhancing the product's performance.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature range allows the product to operate in harsh environments without compromising performance.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures reliable operation in extreme cold conditions, increasing the product's versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and improved solderability, ensuring long-term reliability and ease of assembly.

Terminal Position: QUAD

Quad terminal positioning facilitates secure and stable connections, enhancing the product's overall performance and signal integrity.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact and streamlined design, making the product ideal for space-sensitive applications.

Width: 10 mm

The compact width of 10mm enables easy integration into a variety of electronic devices, enhancing design flexibility.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the reflow soldering process without damage, ensuring reliable assembly.

Length: 10 mm

The small length of 10mm allows for space-saving integration into electronic assemblies, contributing to a more efficient overall design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, enhancing the product's durability and reliability.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a commonly used standard, ensuring compatibility with a wide range of electronic systems and devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and efficient signal routing, enabling compact and space-saving designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product is capable of withstanding moderate levels of moisture exposure during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type IC, the product enables seamless communication between different electronic components and systems, enhancing overall connectivity.

Technical Specifications

Other Function Interface ICs L9660TR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.1 V

Minimum Supply Voltage:

4.9 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

L9660TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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