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L9660

STMicroelectronics

L9660 by STMicroelectronics

STMicroelectronics L9660 is an interface IC with 64 terminals, operating b/w -40 to 95 °C. It has a supply voltage range of 4.9V to 5.1V and comes in a low profile flatpack package suitable for industrial applications requiring fine pitch connections.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cogito LLC

Ukraine . 9,660 parts In-Stock

1+ parts

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9,660

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Vyrian

USA . 4,134 parts In-Stock

1+ parts

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4,134

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Anansix

USA . 2,633 parts In-Stock

1+ parts

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2,633

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Digiode

USA . 1,383 parts In-Stock

1+ parts

-

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1,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 305 parts In-Stock

1+ parts

$2.704

100+ parts

-

1k+ parts

$2.433

10k+ parts

-

305

$2.704

-

$2.433

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MKK Technologies

India . 1,606 parts In-Stock

1+ parts

$5.084

100+ parts

-

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1,606

$5.084

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-

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DigiPath Technology Company

USA . 1,606 parts In-Stock

1+ parts

$5.084

100+ parts

-

1k+ parts

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1,606

$5.084

-

-

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AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$16.760

100+ parts

-

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414

$16.760

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-

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Microchip USA

USA . 3,031 parts In-Stock

1+ parts

$28.528

100+ parts

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3,031

$28.528

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RC Electronics

USA . 18,000 parts In-Stock

1+ parts

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18,000

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Corphita

USA . 1,829 parts In-Stock

1+ parts

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1,829

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Parana Technologies

USA . 1,023 parts In-Stock

1+ parts

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100+ parts

$3.233

1k+ parts

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1,023

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$3.233

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Kepictronics

USA . 100 parts In-Stock

1+ parts

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100

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Overview

Elevate your electronic devices to the next level with the L9660 by STMicroelectronics. Crafted with precision and expertise, this innovative Other Function Interface IC offers unparalleled quality and reliability. From industrial applications to consumer electronics, this Interface Circuit is designed to deliver seamless performance and efficiency. Take advantage of its advanced features and maximize the potential of your products. Trust STMicroelectronics to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and thermal characteristics, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 5.1 V

A high maximum supply voltage tolerance ensures compatibility with various power sources, providing flexibility in system design.

Package Shape: SQUARE

The square shape allows for efficient use of PCB real estate, making the product suitable for compact electronic devices.

No. of Terminals: 64

Having a high number of terminals allows for a greater number of connections and functionality, making the product versatile in application.

Minimum Supply Voltage: 4.9 V

A low minimum supply voltage ensures reliable operation even in low-power scenarios, enhancing the product's overall performance.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing its durability and reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in various climates and environments, enhancing its versatility.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of connections, optimizing the PCB layout and improving overall system performance.

Maximum Seated Height: 1.6 mm

A low maximum seated height enables the product to be used in compact electronic designs, saving space and reducing overall product size.

Width: 10 mm

The compact width of the product makes it suitable for use in space-constrained applications, providing flexibility in design and integration.

Length: 10 mm

The short length of the product contributes to its compact form factor, making it ideal for use in small electronic devices where space is limited.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges, the product can withstand tough operating conditions and is suitable for a wide range of industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable performance and longevity of the product.

Nominal Supply Voltage: 5 V

Having a standard nominal supply voltage allows for easy integration into existing systems and simplifies power management requirements.

Terminal Pitch: 0.5 mm

With a fine terminal pitch, the product allows for high-density mounting on the PCB, enabling more compact and efficient electronic designs.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, the product facilitates communication and data exchange between different components in a system, enhancing overall system functionality.

Technical Specifications

Other Function Interface ICs L9660 attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.1 V

Minimum Supply Voltage:

4.9 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

L9660 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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