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L9362

STMicroelectronics

L9362 by STMicroelectronics

L9362 by STMicroelectronics is a robust peripheral driver designed for automotive applications, featuring built-in protections against transient, overcurrent, and thermal issues. It operates within a supply voltage range of 4.5-5.5 V and supports up to 3 A output current. With a compact SO package and dual terminal design, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,610 parts In-Stock

1+ parts

-

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8,610

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-

-

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Digiode

USA . 2,908 parts In-Stock

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2,908

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Anansix

USA . 2,619 parts In-Stock

1+ parts

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2,619

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ACDS - Activité Composants Distribution Service

France . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 141 parts In-Stock

1+ parts

$8.465

100+ parts

-

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-

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141

$8.465

-

-

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IDEA Electronic Components Group

UK . 1,648 parts In-Stock

1+ parts

$13.044

100+ parts

-

1k+ parts

$11.739

10k+ parts

-

1,648

$13.044

-

$11.739

-

AZTECH Wire

Italy . 943 parts In-Stock

1+ parts

$15.140

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$15.140

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$16.067

100+ parts

$14.621

1k+ parts

$13.175

10k+ parts

-

2,500

$16.067

$14.621

$13.175

-

MKK Technologies

India . 2,084 parts In-Stock

1+ parts

$24.528

100+ parts

-

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2,084

$24.528

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DigiPath Technology Company

USA . 2,084 parts In-Stock

1+ parts

$24.528

100+ parts

-

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-

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2,084

$24.528

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-

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Component Stockers USA

USA . 225 parts In-Stock

1+ parts

$99.990

100+ parts

-

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225

$99.990

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RC Electronics

USA . 9,965 parts In-Stock

1+ parts

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9,965

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A-Z Elektronik GmbH

Germany . 6,608 parts In-Stock

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6,608

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,630 parts In-Stock

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4,630

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Alle Elektronik GmbH

Germany . 4,405 parts In-Stock

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4,405

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Vigor

Singapore . 1,127 parts In-Stock

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1,127

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Parana Technologies

USA . 870 parts In-Stock

1+ parts

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100+ parts

$15.596

1k+ parts

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870

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$15.596

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Kepictronics

USA . 227 parts In-Stock

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227

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Overview

Elevate your designs with the L9362 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust peripheral driver delivers uncompromised quality and exceptional reliability for automotive applications, ensuring peak performance even in extreme conditions. With built-in protections against transient events, overcurrent, and thermal issues, the L9362 guarantees safety and longevity, making it an invaluable choice for engineers seeking efficiency and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy not only provides durability but also makes the product lightweight and cost-effective for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making integration into modern electronic devices easier.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V enhances compatibility with standard power sources, ensuring reliable performance in electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and contributes to better thermal management, essential for high-performance applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protection features safeguard the device and connected components, enhancing reliability and longevity in demanding environments.

Power Supplies (V): 5

Operating at 5 V makes this driver versatile for various peripherals, ensuring compatibility with commonly used power supply systems.

No. of Terminals: 36

With 36 terminals, this product supports complex connections, providing flexibility in peripheral control and interfacing.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline design allows for high-density placement on PCBs, ideal for compact electronic devices without sacrificing functionality.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures the driver can function effectively in a range of environments with varying voltage levels.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is suitable for automotive applications and other high-temperature environments.

Minimum Operating Temperature: -40 °C

A -40 °C minimum operating temperature ensures reliability in extreme cold conditions, making it suitable for outdoor and harsh applications.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and protects the terminals from oxidation during storage and use, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positions provide flexible layout options on PCBs, enhancing design versatility for various applications.

Maximum Seated Height: 3.6 mm

A low seated height allows for a slim profile, making it suitable for space-constrained designs while maintaining excellent performance.

Width: 11 mm

With a width of 11 mm, the product can fit into tight spaces on PCBs, making it a perfect fit for compact electronic systems.

Length: 15.9 mm

The 15.9 mm length allows for efficient use of board space while providing necessary connectivity without overcrowding.

Temperature Grade: AUTOMOTIVE

Being rated for automotive applications indicates high reliability and robustness, making it ideal for automotive peripherals and systems.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and provide a solid mechanical connection to the PCB, ensuring long-term durability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply of 5 V matches many standard electronic components, ensuring compatibility across various systems.

Turn-on Time: 10 us

A fast turn-on time of 10 µs allows for quick response in applications where speed is critical, improving overall system performance.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for denser mounting of components, which is beneficial for modern, compact PCB layouts.

Driver No. of Bits: 4

A 4-bit driver allows for multiple control options, making it suitable for a variety of applications that require versatility in data handling.

Nominal Output Peak Current Limit: 3 A

The ability to handle a nominal output peak current of 3 A provides significant power management capabilities for driving various peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface type indicates flexibility in operation, allowing it to adapt to different signal types in system designs.

Turn-off Time: 10 us

A 10 µs turn-off time ensures efficient signal handling, crucial for maintaining system accuracy in rapidly switching applications.

Output Current Flow Direction: SINK

Supporting current sinking capability enables this driver to interface efficiently with various components, essential for effective control.

Technical Specifications

Peripheral Drivers L9362 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Turn-off Time:

10 us

Turn-on Time:

10 us

Width:

11 mm

Trade Compliance

L9362 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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