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L9177TR

STMicroelectronics

L9177TR by STMicroelectronics

L9177TR by STMicroelectronics is an AEC-Q100 compliant interface IC with a supply voltage range of 6V to 18V. It features a small outline package with 46 terminals and operates in automotive temperature grades (-40 °C to 125°C). Ideal for automotive applications requiring high reliability and performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,363 parts In-Stock

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11,363

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Chip Stock

USA . 3,993 parts In-Stock

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3,993

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Anansix

USA . 1,616 parts In-Stock

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1,616

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Digiode

USA . 1,192 parts In-Stock

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1,192

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Distributors (Availability)

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

$7.000

100+ parts

-

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2,500

$7.000

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AZTECH Wire

Italy . 904 parts In-Stock

1+ parts

$8.580

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904

$8.580

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$9.627

100+ parts

-

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$8.664

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1,289

$9.627

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$8.664

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MKK Technologies

India . 1,756 parts In-Stock

1+ parts

$18.103

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1,756

$18.103

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DigiPath Technology Company

USA . 1,756 parts In-Stock

1+ parts

$18.103

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1,756

$18.103

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Microchip USA

USA . 1,719 parts In-Stock

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$22.912

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1,719

$22.912

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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RC Electronics

USA . 5,117 parts In-Stock

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Corphita

USA . 4,198 parts In-Stock

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Lixinc

USA . 2,685 parts In-Stock

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2,685

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Parana Technologies

USA . 1,955 parts In-Stock

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$11.510

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1,955

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$11.510

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Perfect Parts

USA . 672 parts In-Stock

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672

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Overview

Unlock the full potential of your automotive applications with the high-quality L9177TR from STMicroelectronics. Designed with precision and reliability in mind, this small outline interface circuit offers a wide operating temperature range and maximum supply voltage of 18V, making it ideal for demanding automotive environments. With 46 terminals and a compact design, this product is versatile and easy to integrate into various systems. Trust STMicroelectronics to provide you with innovative solutions that deliver value and performance every time. Choose the L9177TR for a seamless and efficient interface experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and reliability for the IC, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this IC can handle a wide range of input voltages, making it versatile for different power requirements.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality for automotive applications, meeting industry requirements.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the circuit board and easy integration into electronic systems.

No. of Terminals: 46

Having a high number of terminals enables the IC to interface with multiple components and circuits, expanding its functionality and application possibilities.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design make the IC compact and space-saving, suitable for applications where size constraints are important.

Minimum Supply Voltage: 6 V

The low minimum supply voltage allows the IC to operate efficiently even with lower power sources, providing flexibility in power requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and operate reliably in challenging temperature settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function effectively in cold environments without performance degradation.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, ensuring stable connections and longevity for the IC.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and connection options, making installation and integration of the IC easier.

Maximum Seated Height: 3.6 mm

The compact seated height enables the IC to be used in slim and space-limited designs, ensuring efficient use of PCB real estate.

Width: 11 mm

The moderate width of the IC allows for easy handling and installation on the circuit board, providing convenience during production.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering of the IC during production, resulting in reliable connections and consistent performance.

Peak Reflow Temperature °C: 245

The high peak reflow temperature indicates the IC's ability to withstand soldering processes without damage, ensuring manufacturing efficiency.

Length: 15.9 mm

The moderate length of the IC allows for easy placement and routing on the circuit board, optimizing layout design and space utilization.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the IC can withstand the temperature fluctuations and demands of automotive applications, providing reliable performance.

Terminal Form: GULL WING

The gull wing terminal form offers good mechanical strength and secure attachment to the PCB, enhancing the reliability and longevity of the IC.

Nominal Supply Voltage: 12 V

The specified nominal supply voltage indicates the standard operating voltage for the IC, making it compatible with common power sources and systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and space-efficient layout on the PCB, enabling compact and streamlined electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has a moderate sensitivity to moisture, ensuring proper handling and storage to maintain performance and reliability.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit, this IC facilitates communication and data transfer between various components, making it essential for system integration and connectivity.

Technical Specifications

Other Function Interface ICs L9177TR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G46

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

46

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Screening Level:

AEC-Q100

Maximum Seated Height:

3.6 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

6 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

L9177TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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