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L6997DTR

STMicroelectronics

L6997DTR by STMicroelectronics

L6997DTR by STMicroelectronics is a compact switching regulator with a voltage-mode control technique, ideal for efficient power management. It operates within 3-5.5 V input range and features a small outline package (4.4 mm x 6.5 mm). With a max temp of 85 °C, it's perfect for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,608

-

-

-

-

Vyrian

USA . 1,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,687

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-

-

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Digiode

USA . 1,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,473

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,228 parts In-Stock

1+ parts

$2.695

100+ parts

-

1k+ parts

$2.425

10k+ parts

-

2,228

$2.695

-

$2.425

-

MKK Technologies

India . 2,278 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

10k+ parts

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2,278

$5.067

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DigiPath Technology Company

USA . 2,278 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

10k+ parts

-

2,278

$5.067

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-

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Parana Technologies

USA . 2,311 parts In-Stock

1+ parts

-

100+ parts

$3.222

1k+ parts

-

10k+ parts

-

2,311

-

$3.222

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Corphita

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,234

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Overview

Experience exceptional efficiency and reliability with the L6997DTR from STMicroelectronics, a leader in innovative semiconductor solutions. This compact switching regulator offers superior performance across diverse applications, from consumer electronics to industrial automation. Its precision voltage control ensures optimal power management, translating into lower energy costs and enhanced device longevity. Choose L6997DTR for quality you can trust and a competitive edge that enhances your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliable performance and longevity in various environments.

Surface Mount: YES

Surface mount feature facilitates compact design and easy integration into modern PCBs.

Package Shape: RECTANGULAR

Rectangular shape optimizes space usage on the circuit board and allows for efficient layout.

No. of Terminals: 20

A higher number of terminals enables greater functionality and connectivity options in applications.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and shrink pitch design contribute to a reduced footprint, ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

Withstands higher temperatures, making it suitable for demanding applications and enhancing reliability.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for stable regulation, improving overall system performance and response time.

Minimum Operating Temperature: 0 °C

Operational capability from 0 °C ensures functionality in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and ensures strong electrical connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in layout and improves ease of handling during manufacturing.

Maximum Seated Height: 1.2 mm

Low seated height supports designs requiring low-profile components without compromising performance.

Width: 4.4 mm

Narrow width is advantageous for high-density applications, saving valuable PCB space.

Other IC Type: SWITCHING CONTROLLER

A switching controller provides efficient power conversion, leading to lower heat generation and better energy efficiency.

Nominal Input Voltage: 3.3 V

Nominal input voltage of 3.3V is ideal for a wide range of digital applications and logic devices.

Length: 6.5 mm

Compact length allows integration into space-limited designs without sacrificing performance.

Terminal Form: GULL WING

Gull wing terminals are designed for reliable soldering and provide ease of inspection after assembly.

Control Technique: PULSE WIDTH MODULATION

PWM control technique delivers precise output voltage regulation and improved efficiency in power management.

Switcher Config: PUSH-PULL

Push-pull configuration enhances power handling capabilities, making it suitable for a variety of power supply applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density placement while maintaining manufacturability.

Minimum Input Voltage: 3 V

Supports a wide input range starting at 3V, making it versatile for various applications.

Maximum Input Voltage: 5.5 V

A maximum input voltage of 5.5V ensures compatibility with most standard power sources, enhancing usability.

Technical Specifications

Switching Regulators & Controllers L6997DTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

CAN ALSO OPERATE IN PFM MODE

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

L6997DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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