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L6995S

STMicroelectronics

L6995S by STMicroelectronics

L6995S by STMicroelectronics is a compact switching regulator designed for efficient voltage control. It operates within a 4.5-5.5V input range, features a dual terminal configuration, and supports PWM control. Ideal for space-constrained applications, it ensures reliable performance up to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,537 parts In-Stock

1+ parts

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2,537

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Digiode

USA . 1,013 parts In-Stock

1+ parts

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1,013

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Anansix

USA . 726 parts In-Stock

1+ parts

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726

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 532 parts In-Stock

1+ parts

$22.227

100+ parts

-

1k+ parts

$20.004

10k+ parts

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532

$22.227

-

$20.004

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MKK Technologies

India . 239 parts In-Stock

1+ parts

$41.797

100+ parts

-

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239

$41.797

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DigiPath Technology Company

USA . 239 parts In-Stock

1+ parts

$41.797

100+ parts

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239

$41.797

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Corphita

USA . 3,520 parts In-Stock

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3,520

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 1,481 parts In-Stock

1+ parts

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100+ parts

$26.576

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1,481

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$26.576

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Overview

Unlock superior performance and reliability with the L6995S from STMicroelectronics, a leader in cutting-edge technology. Designed for efficiency, this compact switching regulator enhances power management in diverse applications—from consumer electronics to industrial automation. Benefit from outstanding thermal performance and a streamlined design that saves space without compromising quality. Elevate your projects with the trusted innovation of STMicroelectronics and experience unparalleled value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a durable and lightweight package, enhancing thermal resistance and overall reliability.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables automated assembly processes.

Package Shape: RECTANGULAR

A rectangular shape is optimal for efficient layouts on circuit boards, facilitating better integration with other components.

No. of Terminals: 20

With 20 terminals, this product provides ample connection points, allowing for versatile functionality and complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile promote space efficiency in compact designs, making it ideal for modern electronics.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability and functionality in various temperature-sensitive applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control helps maintain stable output voltage, which is crucial for powering sensitive electronic components.

Minimum Operating Temperature: 0 °C

Operating as low as 0 °C makes this product suitable for a wide range of environments, including cooler applications.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and conduction, ensuring strong and reliable electrical connections.

Terminal Position: DUAL

The dual terminal position configuration enhances mounting options, increasing flexibility during the design phase.

Maximum Seated Height: 1.2 mm

A low seated height allows for a compact design, effectively contributing to the slim profile of the finished product.

Width: 4.4 mm

A narrow width enhances space-saving capabilities, accommodating tighter layouts in electronic devices.

Other IC type: SWITCHING CONTROLLER

Being a switching controller allows for higher efficiency in power conversion compared to linear regulators, reducing energy losses.

Nominal Input Voltage: 5 V

Designed for a nominal 5V input makes it compatible with standard digital circuits and consumer electronics.

Length: 6.5 mm

A compact length aids in achieving dense component arrangements on PCBs, critical for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering, enhancing connection durability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation enables efficient power regulation, minimizing power loss and improving overall system efficiency.

Switcher Config: PUSH-PULL

The push-pull configuration allows for balanced load distribution and improved efficiency in power delivery.

Terminal Pitch: 0.65 mm

A tight terminal pitch enables high-density layouts, which is essential for compact device designs.

Minimum Input Voltage: 4.5 V

The capability to operate at a minimum input voltage of 4.5V broadens its applicability in various power environments.

Maximum Input Voltage: 5.5 V

Supporting a maximum input voltage of 5.5V grants flexibility in applications that may occasionally exceed the nominal voltage.

Technical Specifications

Switching Regulators & Controllers L6995S attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

L6995S Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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