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L6788A

STMicroelectronics

L6788A by STMicroelectronics

L6788A by STMicroelectronics is a versatile power management IC with a nominal voltage of 12V, supporting up to 3 channels. It features a max switching frequency of 800 kHz and comes in a compact square package. Ideal for efficient power supply applications, it ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,852 parts In-Stock

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Digiode

USA . 1,327 parts In-Stock

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1,327

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Anansix

USA . 328 parts In-Stock

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328

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Distributors (Availability)

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Microchip USA

USA . 2,126 parts In-Stock

1+ parts

$3.016

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2,126

$3.016

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AZTECH Wire

Italy . 203 parts In-Stock

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$10.500

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203

$10.500

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IDEA Electronic Components Group

UK . 2,112 parts In-Stock

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$21.695

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$19.526

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2,112

$21.695

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$19.526

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MKK Technologies

India . 618 parts In-Stock

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$40.797

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618

$40.797

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DigiPath Technology Company

USA . 618 parts In-Stock

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$40.797

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618

$40.797

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A-Z Elektronik GmbH

Germany . 5,993 parts In-Stock

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 3,995 parts In-Stock

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3,995

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Parana Technologies

USA . 2,143 parts In-Stock

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$25.940

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2,143

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$25.940

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Corphita

USA . 1,693 parts In-Stock

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Overview

Elevate your designs with the L6788A from STMicroelectronics, a leading name in power management solutions. This exceptional IC combines reliability and efficiency, ensuring your systems run smoothly under demanding conditions. Perfect for a variety of applications, its compact design and advanced features deliver unmatched performance. Choose the L6788A to experience reduced power consumption and increased longevity—transforming your projects into high-quality, energy-efficient masterpieces.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square design provides a compact footprint, facilitating layout efficiency in circuit design.

Nominal Supply Voltage (Vsup): 12 V

Operating at a standard nominal voltage makes it compatible with many common power systems.

No. of Terminals: 40

With 40 terminals, it offers ample connectivity for various functions and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design along with a heat sink improves thermal management and reduces thermal resistance.

Control Mode: VOLTAGE-MODE

Voltage-mode control enhances stability and responsiveness in power regulation applications.

Terminal Finish: MATTE TIN

Matte tin finish offers excellent solderability, reducing the risk of defects during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for more flexible and efficient routing on the PCB.

Maximum Seated Height: 1 mm

The extremely low seated height is ideal for space-constrained applications, enhancing device miniaturization.

Width: 6 mm

A standard width of 6 mm aids compatibility with other components, contributing to design uniformity.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it plays a critical role in enhancing overall system performance and reliability.

Minimum Supply Voltage (Vsup): 10.8 V

Operational capability at lower voltages provides flexibility for various applications and power requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures thorough soldering without damaging the components.

Peak Reflow Temperature °C: 260

The high peak temperature indicates compatibility with lead-free solder processes, meeting modern manufacturing standards.

Length: 6 mm

A standard length of 6 mm allows for consistent integration in various configurations and designs.

Maximum Switching Frequency: 800 kHz

A high switching frequency results in better efficiency and performance in dynamic applications.

No. of Channels: 3

With three channels, it enables the support of multiple outputs, optimizing power distribution in complex systems.

Terminal Form: NO LEAD

No-lead design minimizes footprints and improves the thermal performance due to greater heat dissipation.

Terminal Pitch: 0.5 mm

A tighter terminal pitch allows for denser assembly, enabling the design of more compact circuits.

Moisture Sensitivity Level (MSL): 3

MSL 3 certification indicates moderate moisture sensitivity, allowing for reasonable handling during assembly.

Maximum Supply Voltage (Vsup): 13.2 V

The ability to handle a maximum voltage of 13.2 V adds flexibility for various power applications.

Adjustable Threshold: YES

Adjustable thresholds provide customization options, making it adaptable to specific application requirements.

Technical Specifications

Power Management ICs L6788A attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

40

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Maximum Switching Frequency:

800 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

6 mm

Trade Compliance

L6788A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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