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L6258A

STMicroelectronics

L6258A by STMicroelectronics

L6258A by STMicroelectronics is a versatile motion control IC designed for efficient operation with a 5.42V power supply. It features a compact square package with 44 terminals and utilizes BCDMOS technology. Ideal for applications in robotics and automation, it ensures reliable performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,921 parts In-Stock

1+ parts

-

100+ parts

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4,921

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-

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Anansix

USA . 2,496 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,496

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-

-

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Vyrian

USA . 924 parts In-Stock

1+ parts

-

100+ parts

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924

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

$2.403

10k+ parts

-

54

$2.670

-

$2.403

-

MKK Technologies

India . 264 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

-

10k+ parts

-

264

$5.020

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-

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DigiPath Technology Company

USA . 264 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

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10k+ parts

-

264

$5.020

-

-

-

Corphita

USA . 3,048 parts In-Stock

1+ parts

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3,048

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Parana Technologies

USA . 943 parts In-Stock

1+ parts

-

100+ parts

$3.192

1k+ parts

-

10k+ parts

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943

-

$3.192

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-

Overview

Unlock unparalleled motion control with the L6258A from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficiency and reliability, this robust IC excels in diverse applications, from robotics to industrial automation. Its compact design ensures seamless integration into your projects, while ST's commitment to quality guarantees long-lasting performance. Experience enhanced precision and control—transform your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and protects against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits, optimizing space utilization.

Package Shape: SQUARE

The square package shape offers efficient space usage on PCBs, allowing for higher density layouts and improved production efficiency.

Power Supplies (V): 5.42

Operating at a common voltage of 5.42V makes this IC compatible with a wide range of electronic systems, simplifying design requirements.

No. of Terminals: 44

With 44 terminals, this IC can support a variety of functions and connectivity options, enhancing versatility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for easier handling and reduces the risk of damage during assembly, ensuring reliable performance.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and conductivity, which is essential for consistent electrical performance.

Terminal Position: QUAD

With quad terminal positioning, the IC enables straightforward layout on PCBs, facilitating easier routing and design flexibility.

Technology: BCDMOS

BCD technology combines both analog and digital capabilities in a single chip, providing high efficiency and performance for motion control applications.

Terminal Form: J BEND

J bend terminal forms help in easy insertion into PCBs and provide robust mechanical support, enhancing reliability in electronic assemblies.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between space-saving and ease of soldering, suitable for compact designs without sacrificing performance.

Technical Specifications

Motion Control ICs L6258A attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

No. of Terminals:

44

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,42

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

L6258A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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