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L6232B

STMicroelectronics

L6232B by STMicroelectronics

L6232B by STMicroelectronics is a CMOS brushless DC motor controller designed for efficient motion control. It operates with a nominal voltage of 12V, supports up to 3.5A output current, and features a compact 28-terminal chip carrier package. Ideal for applications in robotics and automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Anansix

USA . 2,832 parts In-Stock

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Vyrian

USA . 2,268 parts In-Stock

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2,268

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Q Components

USA . 982 parts In-Stock

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Digiode

USA . 840 parts In-Stock

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Prism Electronics

USA . 16 parts In-Stock

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IDEA Electronic Components Group

UK . 2,002 parts In-Stock

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$16.842

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$15.157

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$16.842

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$15.157

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MKK Technologies

India . 36 parts In-Stock

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$31.669

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36

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DigiPath Technology Company

USA . 36 parts In-Stock

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$31.669

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36

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Kepictronics

USA . 20,302 parts In-Stock

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Corphita

USA . 1,963 parts In-Stock

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Parana Technologies

USA . 837 parts In-Stock

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$20.137

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Perfect Parts

USA . 18 parts In-Stock

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A-Plus Industry Inc.

USA . 17 parts In-Stock

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Overview

Elevate your motion control projects with the L6232B from STMicroelectronics, a trusted leader in innovation. This robust brushless DC motor controller ensures precision and reliability, designed for applications where performance matters. With its compact, surface-mount design, it seamlessly integrates into your systems, delivering exceptional efficiency and power management. Choose L6232B to unlock unparalleled quality and enhance your product's capabilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and reliability in various operating environments, making it suitable for a wide range of applications.

Surface Mount: YES

Having surface mount capability allows for easier integration into modern PCB designs, conserving space and enabling automated assembly processes.

Package Shape: SQUARE

The square package shape optimizes space usage on PCBs and allows for efficient thermal management and signal integrity.

Nominal Supply Voltage (Vsup): 12 V

A nominal supply voltage of 12 V is standard for many applications, ensuring wide compatibility with existing power supplies and minimizing the need for additional voltage regulation.

Power Supplies (V): 12

This specification aligns with the nominal supply voltage, confirming the product's usability with standard power supply systems.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for various inputs and outputs, allowing for versatile applications in motion control.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal and electrical performance, suitable for demanding applications.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and is compatible with various manufacturing processes, although it may need to be considered for regulations regarding lead content.

Terminal Position: QUAD

The quad terminal positioning allows for straightforward layout design on PCBs, facilitating easier connections and improving routing efficiency.

Maximum Seated Height: 4.57 mm

The relatively low maximum seated height allows for a compact design, useful in space-constrained applications.

Width (mm): 11.5062 mm

This width is ideal for high-density designs, enabling effective packing of components on a PCB.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Designed specifically for brushless DC motor control, making it an excellent choice for applications requiring precise motor performance.

Minimum Supply Voltage (Vsup): 10.5 V

A minimum supply voltage of 10.5 V ensures compatibility with a wide range of power supply scenarios, enhancing its versatility.

Length: 11.5062 mm

The compact length aids in fitting the IC in space-restricted designs while still providing the necessary performance.

Maximum Supply Current (Isup): 6 mA

With a maximum supply current of only 6 mA, this IC is energy efficient, making it suitable for battery-operated devices.

Maximum Output Current: 3.5 A

The capability to output 3.5 A allows for robust performance, suitable for powering high-current brushless DC motors in various applications.

Technology: CMOS

CMOS technology provides high noise immunity and low power consumption, making this IC reliable and suitable for portable devices.

Terminal Form: J BEND

J-bend terminals facilitate easier mounting and soldering processes, ensuring a stable connection on the PCB.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch enables compatibility with many PCB designs, making integration straightforward.

Maximum Supply Voltage (Vsup): 13.5 V

A maximum supply voltage of 13.5 V provides flexibility for various power supply levels, accommodating different operational scenarios.

Technical Specifications

Motion Control ICs L6232B attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Output Current:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

10.5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

11.5062 mm

Trade Compliance

L6232B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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