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L5957PD

STMicroelectronics

L5957PD by STMicroelectronics

L5957PD by STMicroelectronics is a fixed positive multiple output LDO regulator with a max dropout voltage of 1.5V and operates from -55 °C to 150°C. It delivers up to 0.8A across four outputs, making it ideal for power management in compact electronics. Its surface mount design ensures efficient thermal performance in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,541 parts In-Stock

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3,541

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Digiode

USA . 3,289 parts In-Stock

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3,289

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Anansix

USA . 218 parts In-Stock

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218

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Chip Stock

USA . 165 parts In-Stock

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165

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,816 parts In-Stock

1+ parts

$2.770

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1,816

$2.770

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IDEA Electronic Components Group

UK . 86 parts In-Stock

1+ parts

$3.159

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-

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$2.843

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86

$3.159

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$2.843

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MKK Technologies

India . 435 parts In-Stock

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$5.941

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435

$5.941

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DigiPath Technology Company

USA . 435 parts In-Stock

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$5.941

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435

$5.941

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AZTECH Wire

Italy . 901 parts In-Stock

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$11.630

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901

$11.630

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Microchip USA

USA . 5,566 parts In-Stock

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5,566

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A-Z Elektronik GmbH

Germany . 4,515 parts In-Stock

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4,515

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Alle Elektronik GmbH

Germany . 3,010 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 554 parts In-Stock

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554

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Corphita

USA . 96 parts In-Stock

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Parana Technologies

USA . 60 parts In-Stock

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$3.777

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60

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$3.777

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Overview

Unlock the potential of your designs with the L5957PD from STMicroelectronics! Renowned for its reliability, this fixed positive multiple output LDO regulator delivers exceptional performance across various applications, from automotive to industrial. With a compact design and robust thermal management, it ensures stable voltage regulation even in demanding environments. Elevate your projects with quality you can trust and experience the advantages of seamless integration and efficiency that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and robustness, making the regulator suitable for various applications.

Maximum Dropout Voltage-2: 1.5 V

A lower dropout voltage helps maintain stable output performance even with minimal voltage headroom.

Maximum Dropout Voltage-1: 0.6 V

This exceptionally low dropout voltage is advantageous for battery-operated devices, extending battery life.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, enhancing production efficiency.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature ensures reliable performance in demanding environments.

Minimum Output Voltage-2: 4.75 V

Allows regulation for applications needing slightly lower voltages, offering versatility.

Technology: BIPOLAR

Bipolar technology allows for efficient operation and stable output under varying load conditions.

Nominal Output Voltage-2: 5 V

A standard nominal output voltage suitable for various digital and analog circuits.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and integration into circuit boards.

Terminal Form: GULL WING

Gull wing terminals ensure good solderability and mechanical stability.

Operating Temperature (TJ-Min): -55 °C

Wide operating temperature range makes it ideal for military and aerospace applications.

Packing Method: TRAY

Tray packing allows for easy handling and minimizes damage during transport.

Minimum Output Voltage-1: 8 V

Enables regulation of higher voltage outputs, suitable for powering high-performance components.

Maximum Voltage Tolerance: 6 %

A tolerance of 6% ensures reliable performance even under less-than-ideal conditions.

Nominal Output Voltage-1: 8.5 V

Provides a targeted nominal voltage for specific devices, enhancing power delivery accuracy.

No. of Terminals: 20

A larger number of terminals allows for multiple outputs and complex circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact design with heat sinking capability allows for efficient thermal management in various applications.

Adjustability: FIXED

Fixed output simplifies the design process for applications requiring specific voltage levels.

Terminal Pitch: 1.27 mm

Standard terminal pitch improves compatibility with existing PCB layouts.

Maximum Line Regulation: 0.05 %

Exceptional line regulation ensures minimal output voltage variation with differing input voltages.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

The fixed positive multiple output design meets diverse requirements efficiently in one component.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability while preventing oxidation for reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit layout options.

Maximum Output Voltage-1: 9 V

Allows for powering devices that require slightly higher voltage levels, which expands application capabilities.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, aiding manufacturers in handling and storage considerations.

Maximum Seated Height: 3.5 mm

Low height profile is beneficial for space-constrained applications.

Width: 11 mm

Compact width allows for integration in tight spaces within electronic designs.

Maximum Load Regulation: 0.1 %

Tight load regulation ensures consistent performance even with varying load conditions.

Maximum Output Voltage-2: 5.3 V

Provides additional output voltage option for varied application requirements.

Minimum Input Voltage: 9 V

Defines the lower limit for input voltage, ensuring stable regulator operation.

Maximum Output Current-1: 0.5 A

Allows for adequate current supply for many common electronic components.

No. of Outputs: 4

Supports multiple outputs enabling power for various subsystems within a design.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly processes without damaging the device.

Peak Reflow Temperature °C: 245

High peak temperature helps ensure proper solder joints in modern assembly processes.

Length: 15.9 mm

The compact length helps to minimize footprint on PCBs, enabling denser designs.

Maximum Input Voltage: 18 V

Supports high input voltages, accommodating a variety of power sources.

Maximum Input Voltage Absolute: 18 V

Specifies the absolute maximum input voltage, ensuring reliable protection against overvoltage.

Maximum Output Current-2: 0.8 A

Provides a higher current capacity for demanding applications, allowing for flexibility in design.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO L5957PD attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.6 V

Maximum Dropout Voltage-2:

1.5 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

18 V

Minimum Input Voltage:

9 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Maximum Line Regulation:

.05 %

Maximum Load Regulation:

.1 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

4

No. of Terminals:

20

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-55 Cel

Maximum Output Current-1:

.5 A

Maximum Output Current-2:

.8 A

Maximum Output Voltage-1:

9 V

Minimum Output Voltage-1:

8 V

Nominal Output Voltage-1:

8.5 V

Maximum Output Voltage-2:

5.3 V

Minimum Output Voltage-2:

4.75 V

Nominal Output Voltage-2:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TRAY

Peak Reflow Temperature (C):

245

Qualification Status:

Not Qualified

Maximum Seated Height:

3.5 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

6 %

Width:

11 mm

Trade Compliance

L5957PD Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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