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L3240B

STMicroelectronics

L3240B by STMicroelectronics

STMicroelectronics L3240B is a Telephone Line IC with 8 terminals, operating at -20 to 70 °C. It has a supply voltage of 26V and uses bipolar technology. The package style is in-line, made of plastic/epoxy, suitable for commercial temperature grade applications.

Median Price

$0.369

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,340 parts In-Stock

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3,340

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Goldney Electronics S.L.

Spain . 2,650 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,093 parts In-Stock

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2,093

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Component Sense

UK . 1,353 parts In-Stock

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-

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$0.369

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$0.250

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$0.250

1,353

-

$0.369

$0.250

$0.250

Anansix

USA . 527 parts In-Stock

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527

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ECAB

Sweden . 340 parts In-Stock

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340

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Vyrian

USA . 223 parts In-Stock

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223

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Corel Iberica Componentes, S.L.

Spain . 91 parts In-Stock

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J2 Sourcing AB

Sweden . 48 parts In-Stock

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48

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Sinequanon

UK . 7 parts In-Stock

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7

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$9.528

100+ parts

-

1k+ parts

$8.576

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966

$9.528

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$8.576

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MKK Technologies

India . 1,666 parts In-Stock

1+ parts

$17.918

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1,666

$17.918

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$17.918

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$17.918

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,521 parts In-Stock

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2,521

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Assy Fe

Spain . 91 parts In-Stock

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91

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Parana Technologies

USA . 88 parts In-Stock

1+ parts

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$11.393

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88

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$11.393

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Overview

Upgrade your telephone line systems with the cutting-edge L3240B by STMicroelectronics. Known for their superior quality and reliability, STMicroelectronics delivers top-of-the-line Telephone Line ICs that are perfect for a variety of applications. The L3240B offers unmatched value, providing customers with enhanced performance and efficiency. Say goodbye to connectivity issues and hello to seamless communication with the L3240B from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation properties and can withstand a wide range of temperatures, making it a durable choice for electronic components.

Power Supplies (V): 26

Operating at a voltage of 26V allows for compatibility with a wide range of telephone line systems, ensuring reliable performance.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the IC to various components in the telephone line system, allowing for customization and scalability.

Maximum Operating Temperature: 70 °C

Being able to operate at temperatures up to 70 °C ensures reliability and stability in diverse environmental conditions, making it suitable for different applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise signal processing capabilities, making it ideal for efficient communication in telephone line systems.

Technical Specifications

Telephone Line ICs L3240B attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

26

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

26 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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