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KD1084AD2M18R

STMicroelectronics

KD1084AD2M18R by STMicroelectronics

KD1084AD2M18R by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 1.8 V and a max output current of 5 A. It operates efficiently in temperatures from -40 °C to 125 °C, featuring a low dropout voltage of 1.3 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,532 parts In-Stock

1+ parts

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2,532

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Vyrian

USA . 1,432 parts In-Stock

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1,432

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Digiode

USA . 127 parts In-Stock

1+ parts

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127

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$7.616

100+ parts

-

1k+ parts

$6.854

10k+ parts

-

789

$7.616

-

$6.854

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MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$14.321

100+ parts

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2,332

$14.321

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$14.321

100+ parts

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2,332

$14.321

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Corphita

USA . 3,773 parts In-Stock

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3,773

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Parana Technologies

USA . 118 parts In-Stock

1+ parts

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100+ parts

$9.106

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118

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$9.106

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Overview

Experience reliable power regulation with the KD1084AD2M18R from STMicroelectronics. Designed for efficiency, this fixed positive LDO regulator ensures stable performance in a compact package, perfect for various applications from consumer electronics to industrial automation. With ST's renowned commitment to quality and innovation, you can trust that this regulator not only meets but exceeds your expectations, delivering exceptional value and reliability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliability and longevity in various applications.

Maximum Dropout Voltage-1: 1.5 V

A low dropout voltage allows for efficient regulation with minimal voltage loss, making it suitable for battery-powered applications.

Surface Mount: YES

Surface mount design facilitates easier integration in compact spaces and enhances manufacturing efficiency.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature ensures stability and reliability in demanding environments.

Technology: BIPOLAR

Bipolar technology provides robust performance and stability for high-accuracy voltage regulation.

Package Shape: RECTANGULAR

Rectangular package shape is versatile for PCB layout and space optimization.

Terminal Form: GULL WING

Gull wing terminals simplify mounting and enhance soldering reliability.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range enables use in extreme environmental conditions, ensuring reliable operation.

Packing Method: TR

Tape and reel packing method allows for automated handling and efficient assembly processes.

Minimum Output Voltage-1: 1.764 V

Provides a stable minimum output voltage that meets the requirements of various electronic devices.

Maximum Voltage Tolerance: 2 %

Tight voltage tolerance ensures accuracy and reliability in sensitive applications.

Nominal Output Voltage-1: 1.8 V

Standard output voltage compatible with many devices, providing versatility in applications.

No. of Terminals: 3

Three terminals allow for simplified connectivity for input, output, and ground.

Package Style (Meter): SMALL OUTLINE

Compact size ideal for space-constrained designs without compromising performance.

Adjustability: FIXED

Fixed output design simplifies circuit design and reduces the need for additional components.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates compatibility with a wide range of PCBs and components.

Maximum Line Regulation: 0.006 %

Excellent line regulation ensures stable output even with varying input voltages, ideal for precision applications.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator ensures a consistent output voltage, essential for powering sensitive electronics.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and ensures durability in electrical connections.

Terminal Position: SINGLE

Single terminal position allows for straightforward routing on PCBs.

Maximum Output Voltage-1: 1.836 V

High maximum output voltage provides flexibility in the selection of output ranges for various applications.

Maximum Seated Height: 4.6 mm

Compact seated height helps in maintaining a low profile on PCBs, catering to modern design requirements.

Width: 9.15 mm

Narrow width allows for high-density designs, optimizing PCB space usage.

Maximum Load Regulation: 0.02 %

Exceptional load regulation ensures steady performance under varying load conditions.

Minimum Input Voltage: 3.4 V

Low minimum input voltage requirement enhances adaptability for various power sources.

Maximum Output Current-1: 5 A

High output current capability supports demanding applications and improves versatility.

Nominal Dropout Voltage-1: 1.3 V

Low nominal dropout voltage further improves efficiency, especially important in battery-operated devices.

Length: 10.2 mm

Compact length aids in fitting within narrow spaces on circuit boards.

Maximum Input Voltage: 10 V

High maximum input voltage increases compatibility with a variety of power sources.

Maximum Input Voltage Absolute: 12 V

Robust input voltage tolerance allows for greater flexibility in design without fear of damage.

Technical Specifications

Fixed Regulators - Positive Single Output LDO KD1084AD2M18R attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

1.5 V

Nominal Dropout Voltage-1:

1.3 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

10 V

Minimum Input Voltage:

3.4 V

JESD-30 Code:

R-PSSO-G3

JESD-609 Code:

e0

Length:

10.2 mm

Maximum Line Regulation:

.006 %

Maximum Load Regulation:

.02 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

5 A

Maximum Output Voltage-1:

1.836 V

Minimum Output Voltage-1:

1.764 V

Nominal Output Voltage-1:

1.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.55TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

4.6 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Maximum Voltage Tolerance:

2 %

Width:

9.15 mm

Trade Compliance

KD1084AD2M18R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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