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ITA6V5B1

STMicroelectronics

ITA6V5B1 by STMicroelectronics

ITA6V5B1 by STMicroelectronics is a bidirectional transient voltage suppressor diode with a max reverse power dissipation of 300 W. It features a compact SO package, operates up to 125 °C, and offers robust protection for sensitive electronics against voltage spikes. Ideal for surface mount applications, it ensures reliable performance in various circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 7,611 parts In-Stock

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Vyrian

USA . 4,976 parts In-Stock

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Digiode

USA . 3,797 parts In-Stock

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Anansix

USA . 1,838 parts In-Stock

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Rebound Electronics

UK . 526 parts In-Stock

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526

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LIBRA Elektronik GmbH

Germany . 237 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 133 parts In-Stock

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133

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Manotoh

Italy . 116 parts In-Stock

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Cyclops Electronics Ltd

UK . 25 parts In-Stock

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IDEA Electronic Components Group

UK . 1,523 parts In-Stock

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$0.086

100+ parts

-

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$0.077

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1,523

$0.086

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$0.077

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MKK Technologies

India . 339 parts In-Stock

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$0.161

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339

$0.161

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DigiPath Technology Company

USA . 339 parts In-Stock

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$0.161

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339

$0.161

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AZTECH Wire

Italy . 1,077 parts In-Stock

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$21.540

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$21.540

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Component Stockers USA

USA . 789 parts In-Stock

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$99.990

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Perfect Parts

USA . 53,213 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,866 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,653 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,577 parts In-Stock

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Metaverse IC Inc.

Canada . 2,375 parts In-Stock

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Parana Technologies

USA . 975 parts In-Stock

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$0.102

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Cyclops Electronics Ltd (Excess)

UK . 233 parts In-Stock

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Assy Fe

Spain . 120 parts In-Stock

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Kepictronics

USA . 115 parts In-Stock

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Overview

Enhance your designs with the ITA6V5B1 from STMicroelectronics, a trusted leader in semiconductor innovation. This advanced transient suppression device offers superior protection for your electronics, ensuring reliability and longevity even in demanding environments. With its compact surface mount design and robust performance metrics, it guarantees minimal downtime and maximum efficiency—ideal for automotive, consumer electronics, and industrial applications. Choose quality and peace of mind with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection against environmental stressors.

Config: COMMON CATHODE, 6 ELEMENTS

The common cathode configuration with 6 elements enhances transient suppression capabilities, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern circuit boards.

Maximum Non Repetitive Peak Reverse Power Dissipation: 300 W

A high dissipation capability enables effective handling of transient conditions without damage, ensuring enhanced durability.

Maximum Reverse Current: 10 uA

The minimal reverse current signifies lower leakage, improving overall efficiency and reducing power loss.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCB layouts, facilitating efficient designs.

No. of Terminals: 8

With 8 terminals, this device provides flexible connections and easy integration into various circuits.

Package Style (Meter): SMALL OUTLINE

The small outline form factor assists in saving board space while maintaining excellent performance.

Maximum Operating Temperature: 125 °C

A high operating temperature range ensures reliability in demanding environments, suitable for a range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish guarantees strong electrical connections and resistance to corrosion, contributing to longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates easier layout design and assembly in various electronic applications.

Minimum Breakdown Voltage: 6.5 V

A low breakdown voltage enhances its capability to protect sensitive circuits from over-voltage conditions.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor diode, it provides robust protection against voltage spikes, preserving circuit integrity.

Technology: AVALANCHE

Avalanche technology ensures rapid response to transient events, making it highly effective in voltage suppression.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and are widely compatible with automated assembly processes.

No. of Elements: 6

Having 6 elements ensures enhanced clamping capabilities, improving transient voltage protection for circuits.

Maximum Repetitive Peak Reverse Voltage: 5 V

The maximum repetitive reverse voltage rating of 5 V allows protection of low-voltage applications while maintaining performance.

Polarity: BIDIRECTIONAL

Bidirectional design provides effective protection regardless of the voltage direction, ensuring comprehensive safety.

Minimum Diode Capacitance: 750 pF

Higher diode capacitance aids in maintaining stability in response to transient signals, improving overall performance.

Maximum Clamping Voltage: 12 V

A maximum clamping voltage of 12 V ensures effective suppression of transient voltages, safeguarding connected circuitry.

Diode Element Material: SILICON

Silicon as the diode element material offers excellent electrical properties and reliability for transient suppression.

Technical Specifications

Transient Suppression Devices ITA6V5B1 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Minimum Breakdown Voltage:

6.5 V

Maximum Clamping Voltage:

12 V

Config:

COMMON CATHODE, 6 ELEMENTS

Minimum Diode Capacitance:

750 pF

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Maximum Non Repetitive Peak Reverse Power Dissipation:

300 W

No. of Elements:

6

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Polarity:

BIDIRECTIONAL

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

5 V

Maximum Reverse Current:

10 uA

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ITA6V5B1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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