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HDMIULC6-4F3

STMicroelectronics

HDMIULC6-4F3 by STMicroelectronics

HDMIULC6-4F3 by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust protection in electronic circuits. It features a max reverse power dissipation of 70W, breakdown voltage range of 6-9V, and operates up to 125 °C. Ideal for safeguarding sensitive components from voltage spikes in various applications.

Median Price

$0.281

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,686 parts In-Stock

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$0.281

3,686

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$0.281

Distributors (In-Stock)

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Vyrian

USA . 2,589 parts In-Stock

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$0.284

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2,589

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Anansix

USA . 1,903 parts In-Stock

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1,903

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Digiode

USA . 627 parts In-Stock

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627

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A&K Electronics

USA . 366 parts In-Stock

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366

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Bristol Electronics

USA . 366 parts In-Stock

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366

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Rotakorn

Sweden . 325 parts In-Stock

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325

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Distributors (Availability)

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.081

100+ parts

$0.074

1k+ parts

$0.066

10k+ parts

-

350

$0.081

$0.074

$0.066

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IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$0.144

100+ parts

-

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$0.129

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1,723

$0.144

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$0.129

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MKK Technologies

India . 922 parts In-Stock

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$0.270

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922

$0.270

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DigiPath Technology Company

USA . 922 parts In-Stock

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$0.270

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922

$0.270

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Native Components

USA . 652 parts In-Stock

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$1.054

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652

$1.054

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Northwest PG Solutions

USA . 59 parts In-Stock

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$1.159

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59

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Perfect Parts

USA . 26,992 parts In-Stock

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Kepictronics

USA . 5,495 parts In-Stock

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Corphita

USA . 4,837 parts In-Stock

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Assy Fe

Spain . 3,600 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,950 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,300 parts In-Stock

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Parana Technologies

USA . 996 parts In-Stock

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$0.172

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996

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$0.172

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Overview

Elevate your electronic designs with the HDMIULC6-4F3 from STMicroelectronics, a leader in innovation and quality. This superior transient suppression device ensures robust protection for sensitive components, enhancing reliability in various applications. With its compact surface-mount design and exceptional thermal performance, it delivers peace of mind against voltage spikes. Trust in STMicroelectronics’ legacy to safeguard your projects and maximize their longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and longevity of the device under various environmental conditions.

Config: SINGLE

Single configuration simplifies integration and minimizes board space, making it ideal for compact designs.

Surface Mount: YES

Surface mount capability allows for efficient assembly and improves automated manufacturing processes.

Maximum Non Repetitive Peak Reverse Power Dissipation: 70 W

This high power dissipation capability helps protect circuits from transient voltage spikes effectively.

Nominal Breakdown Voltage: 7.5 V

The nominal breakdown voltage is well-suited for protecting low-voltage components from overvoltage conditions.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easier placement on PCB layouts, optimizing space utilization.

No. of Terminals: 10

Ten terminals provide flexibility for connections, enabling versatile circuit designs and configurations.

Package Style (Meter): GRID ARRAY

Grid array packaging allows for efficient heat dissipation and robust mounting options on the PCB.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding thermal environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish enhances solderability and reduces oxidation, improving overall device reliability.

Terminal Position: BOTTOM

Bottom terminal positioning helps in better connectivity and minimizes inductance, which is important for transient suppression.

Minimum Breakdown Voltage: 6 V

The minimum breakdown voltage allows for effective clamping in low-voltage applications, preventing damage to sensitive components.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard reflow soldering processes in PCB manufacturing.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature tolerance guarantees that the device can withstand the soldering process without damage.

Maximum Breakdown Voltage: 9 V

This ensures reliable operation in scenarios where voltage may spike up to 9 V, providing excellent protection performance.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a Transient Voltage Suppressor diode, it is specifically designed to respond quickly to voltage transients, safeguarding electronic components.

Technology: AVALANCHE

The avalanche technology ensures rapid response times and effectiveness in clamping voltage spikes.

Terminal Form: BALL

Ball terminal form provides secure connections and is beneficial for high-density PCB layouts.

Polarity: UNIDIRECTIONAL

Unidirectional design is effective in protecting circuits from over-voltage spikes in one direction, simplifying design considerations.

Diode Element Material: SILICON

Silicon as a diode element material contributes to high reliability and stable performance under varying electrical conditions.

Technical Specifications

Transient Suppression Devices HDMIULC6-4F3 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Additional Features:

LOW CAPACITANCE

Maximum Breakdown Voltage:

9 V

Minimum Breakdown Voltage:

6 V

Nominal Breakdown Voltage:

7.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBGA-B10

JESD-609 Code:

e1

Maximum Non Repetitive Peak Reverse Power Dissipation:

70 W

No. of Elements:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HDMIULC6-4F3 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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