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HDMIULC6-2P6

STMicroelectronics

HDMIULC6-2P6 by STMicroelectronics

HDMIULC6-2P6 by STMicroelectronics is a surface-mount transient suppression device with a breakdown voltage of 6V and max clamping voltage of 17V. It operates up to 125 °C, making it ideal for protecting sensitive electronics in compact designs. Its unidirectional avalanche technology ensures reliable performance in various applications.

Median Price

$0.319

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 2 parts In-Stock

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$0.319

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2

$0.319

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Chip1Stop

Japan . 2 parts In-Stock

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Digiode

USA . 3,077 parts In-Stock

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$0.294

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3,077

$0.294

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Vyrian

USA . 10,699 parts In-Stock

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10,699

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Chip Stock

USA . 9,450 parts In-Stock

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9,450

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Anansix

USA . 1,428 parts In-Stock

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IDEA Electronic Components Group

UK . 592 parts In-Stock

1+ parts

$0.178

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$0.161

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592

$0.178

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$0.161

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Corphita

USA . 4,324 parts In-Stock

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$0.279

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4,324

$0.279

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MKK Technologies

India . 1,815 parts In-Stock

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$0.336

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1,815

$0.336

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DigiPath Technology Company

USA . 1,815 parts In-Stock

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$0.336

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1,815

$0.336

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Benley Electronics

USA . 1 parts In-Stock

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$1.750

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1

$1.750

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AZTECH Wire

Italy . 514 parts In-Stock

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$8.080

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Perfect Parts

USA . 57,662 parts In-Stock

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Kepictronics

USA . 39,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Northwest PG Solutions

USA . 2,215 parts In-Stock

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Parana Technologies

USA . 1,950 parts In-Stock

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$0.213

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$0.213

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Native Components

USA . 508 parts In-Stock

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508

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience unmatched reliability with the HDMIULC6-2P6 from STMicroelectronics, a leader in innovative transient suppression solutions. This high-performance device ensures your sensitive electronics are protected against voltage spikes, enhancing device longevity and performance. Ideal for consumer electronics, automotive systems, and industrial applications, it combines superior materials with cutting-edge technology to deliver peace of mind and superior value for your projects. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and reliability in various environmental conditions.

Config: SINGLE

A single configuration simplifies integration into circuits, making it easier to design and implement.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly processes, optimizing PCB space.

Nominal Breakdown Voltage: 6 V

The low nominal breakdown voltage is ideal for protecting sensitive electronic components from voltage spikes.

Package Shape: SQUARE

The square package shape enhances layout flexibility on PCBs, making it easier to integrate into various designs.

No. of Terminals: 6

Having six terminals enables versatile applications and facilitates complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this device can perform reliably in demanding thermal environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures excellent conductivity and resistance to corrosion, prolonging device life.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in wiring and layout options, easing design constraints.

Maximum Time At Peak Reflow Temperature: 30 s

The specified time at peak reflow temperature allows for efficient soldering without damaging the component.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C is suitable for high-temperature soldering processes, ensuring strong connections.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

This diode type is specifically designed to protect circuits from transient voltage spikes, enhancing circuit safety.

Technology: AVALANCHE

Avalanche technology provides reliable voltage clamping capabilities, protecting sensitive components effectively.

Terminal Form: FLAT

Flat terminals ensure low-profile mounting and better thermal performance, leading to enhanced circuit reliability.

Polarity: UNIDIRECTIONAL

The unidirectional polarity makes this device well-suited for direct current applications, simplifying protection schemes.

Maximum Clamping Voltage: 17 V

The maximum clamping voltage protects downstream components by limiting voltage spikes to safe levels.

Diode Element Material: SILICON

Silicon as the diode element material provides high efficiency and reliability in transient voltage suppression.

Technical Specifications

Transient Suppression Devices HDMIULC6-2P6 attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Additional Features:

HIGH RELIABILITY

Nominal Breakdown Voltage:

6 V

Maximum Clamping Voltage:

17 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

S-PDSO-F6

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HDMIULC6-2P6 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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