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HCF4056M013TR

STMicroelectronics

HCF4056M013TR by STMicroelectronics

HCF4056M013TR by STMicroelectronics is a 16-terminal CMOS decoder with latched input conditioning and configurable output polarity. It operates b/w -55 to 125 °C, with a supply voltage range of 3-20 V. Ideal for military-grade applications due to its small outline package style and moisture sensitivity level of 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

J2 Sourcing AB

Sweden . 5,850 parts In-Stock

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5,850

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Vyrian

USA . 4,039 parts In-Stock

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4,039

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Anansix

USA . 2,397 parts In-Stock

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2,397

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Digiode

USA . 1,152 parts In-Stock

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1,152

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LIBRA Elektronik GmbH

Germany . 350 parts In-Stock

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350

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 182 parts In-Stock

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$0.730

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182

$0.730

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Northwest PG Solutions

USA . 2,221 parts In-Stock

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$0.803

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2,221

$0.803

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AZTECH Wire

Italy . 437 parts In-Stock

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$12.470

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437

$12.470

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Microchip USA

USA . 258 parts In-Stock

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$15.846

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258

$15.846

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IDEA Electronic Components Group

UK . 2,348 parts In-Stock

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$25.749

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$23.174

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2,348

$25.749

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$23.174

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MKK Technologies

India . 1,123 parts In-Stock

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$48.419

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$48.419

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DigiPath Technology Company

USA . 1,123 parts In-Stock

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$48.419

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1,123

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Component Stockers USA

USA . 742 parts In-Stock

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$99.990

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742

$99.990

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Parana Technologies

USA . 2,298 parts In-Stock

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$30.787

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$30.787

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Perfect Parts

USA . 1,684 parts In-Stock

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Corphita

USA . 1,497 parts In-Stock

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Overview

Experience the reliability and innovation of STMicroelectronics with the HCF4056M013TR Decoder & Drivers. This versatile product offers seamless integration, exceptional performance, and a wide range of applications. With a focus on quality and efficiency, STMicroelectronics delivers cutting-edge technology that meets the needs of customers across various industries. Enhance your projects with the value and benefits this product brings, setting new standards in decoding and driving solutions. Elevate your designs with the HCF4056M013TR from STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Input Conditioning: LATCHED

Latched input conditioning ensures stable and reliable signal processing, reducing errors and improving overall performance.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easy to integrate into various circuit designs.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is common and widely available, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures fast and efficient signal transmission, reducing delays and improving response times.

No. of Terminals: 16

With 16 terminals, this decoder and driver offers flexibility in connection options for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact designs and tight layouts.

Propagation Delay (tpd): 1300 ns

The low propagation delay ensures quick signal processing and high-speed operation, crucial for time-sensitive applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high-temperature environments, ensuring reliability.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 °C to 125°C provides versatility for operation in both extreme cold and hot conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au terminal finish offers excellent corrosion resistance and ensures reliable electrical connections for long-term use.

Terminal Position: DUAL

Dual terminal positions provide flexibility in mounting options and allow for easy integration into different types of circuit layouts.

Maximum Seated Height: 1.75 mm

The low seated height makes this decoder and driver suitable for slim and compact electronic devices.

Width: 3.9 mm

The compact width of 3.9mm contributes to space-saving design and efficient PCB layout.

Output Polarity: CONFIGURABLE

Configurable output polarity allows for versatile use in various applications, providing flexibility in signal control.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V enables operation in low-power scenarios and extends battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during PCB assembly, preventing damage to the components.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures reliable soldering of the decoder and driver during PCB assembly.

Length: 9.9 mm

The length of 9.9mm contributes to the compact form factor of this product, suitable for space-constrained designs.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions and high-temperature environments.

Technology: CMOS

CMOS technology offers low power consumption, fast switching speeds, and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides secure and robust connections during PCB assembly, ensuring long-lasting performance.

Packing Method: TR

The tape and reel (TR) packing method facilitates automated assembly processes and protects the components during shipping and handling.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm allows for easy soldering and compatibility with standard PCB layout designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this product has a moderate moisture sensitivity, requiring standard precautions during storage and handling.

Maximum Supply Voltage (Vsup): 20 V

The maximum supply voltage of 20V provides compatibility with a wide range of power sources and ensures the decoder and driver's versatility in different applications.

Technical Specifications

Decoder & Drivers HCF4056M013TR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

LCD DISPLAY DRIVER

Family:

4000/14000/40000

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

CONFIGURABLE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCF4056M013TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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