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FDA2100BLV-T

STMicroelectronics

FDA2100BLV-T by STMicroelectronics

FDA2100BLV-T by STMicroelectronics is a Class D audio amplifier designed for high-performance audio applications. It features a compact 10mm x 10mm flatpack design, operates b/w 6V and 35V, and supports dual channels. Ideal for automotive and consumer electronics, it meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,220

-

-

-

-

Digiode

USA . 2,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,046

-

-

-

-

Anansix

USA . 174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

174

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 657 parts In-Stock

1+ parts

$0.368

100+ parts

-

1k+ parts

-

10k+ parts

$0.353

657

$0.368

-

-

$0.353

Northwest PG Solutions

USA . 207 parts In-Stock

1+ parts

$0.405

100+ parts

-

1k+ parts

-

10k+ parts

$0.357

207

$0.405

-

-

$0.357

IDEA Electronic Components Group

UK . 778 parts In-Stock

1+ parts

$0.603

100+ parts

-

1k+ parts

$0.542

10k+ parts

-

778

$0.603

-

$0.542

-

MKK Technologies

India . 1,354 parts In-Stock

1+ parts

$1.133

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$1.133

-

-

-

DigiPath Technology Company

USA . 1,354 parts In-Stock

1+ parts

$1.133

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$1.133

-

-

-

Ampacity Inc.

Singapore . 1,298 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

$6.800

-

-

-

AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$18.510

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$18.510

-

-

-

Microchip USA

USA . 3,034 parts In-Stock

1+ parts

$29.984

100+ parts

-

1k+ parts

-

10k+ parts

-

3,034

$29.984

-

-

-

Parana Technologies

USA . 928 parts In-Stock

1+ parts

-

100+ parts

$0.720

1k+ parts

-

10k+ parts

-

928

-

$0.720

-

-

Vigor

Singapore . 146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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146

-

-

-

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Corphita

USA . 129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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129

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Overview

Elevate your audio experience with the FDA2100BLV-T from STMicroelectronics, renowned for its superior quality and cutting-edge technology. This Class D audio amplifier delivers powerful performance while ensuring energy efficiency, perfect for automotive and consumer electronics applications. With AEC-Q100 screening, you can trust its reliability in demanding environments. Choose STMicroelectronics for innovation that enhances sound quality and amplifies your product's value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and resistance to environmental conditions, making this amplifier reliable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, enabling compact designs in consumer electronics and automotive applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and performance in automotive applications, making it a suitable choice for the automotive industry.

Package Shape: SQUARE

The square package shape promotes efficient thermal management and easy integration into circuit designs.

General IC Type: CLASS D AUDIO AMPLIFIER

Class D technology provides high efficiency and low heat generation, ensuring optimal power usage and cooler operation in audio applications.

No. of Terminals: 64

A higher number of terminals allows for greater connectivity options and more features, catering to complex design requirements.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The flatpack and thin profile design facilitates efficient heat dissipation and allows for high-density layouts in electronic devices.

Terminal Position: QUAD

Quad terminal positioning contributes to versatile mounting options, enhancing soldering reliability and ease of integration.

Maximum Seated Height: 1.2 mm

A low maximum seated height allows for more compact designs, which is critical for modern portable devices.

Width: 10 mm

A standard width of 10 mm fits well within various circuit board layouts, promoting design compatibility.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage enhances compatibility with a range of power supply systems, making it versatile for different applications.

Length: 10 mm

With a uniform length of 10 mm, this amplifier can be easily integrated into standard PCBs, facilitating design standardization.

No. of Channels: 2

Dual-channel operation supports stereo audio applications, offering richer sound experiences for consumers.

Technology: BCDMOS

BCDMOS technology enhances performance and efficiency, significantly improving audio quality and driving capabilities.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder joints and facilitate easier manual handling during assembly processes.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch allows for dense packing of components, maximizing the functionality of compact circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for practical handling and assembly processes with standard precautions.

Maximum Supply Voltage (Vsup): 35 V

A high maximum supply voltage offers flexibility in design, accommodating various power supply options and enabling robust performance.

Technical Specifications

Audio & Video Amplifiers FDA2100BLV-T attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

FDA2100BLV-T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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