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E-L6569D

STMicroelectronics

E-L6569D by STMicroelectronics

E-L6569D by STMicroelectronics is a high-side MOSFET driver designed for automotive applications. It operates b/w 10-16.6 V, with a peak output current of 0.275 A and a temperature range of -40 °C to 125°C. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,867 parts In-Stock

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9,867

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Digiode

USA . 3,015 parts In-Stock

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3,015

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Anansix

USA . 807 parts In-Stock

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807

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Distributors (Availability)

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Microchip USA

USA . 319 parts In-Stock

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$2.500

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319

$2.500

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AZTECH Wire

Italy . 997 parts In-Stock

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$12.220

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997

$12.220

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IDEA Electronic Components Group

UK . 1,880 parts In-Stock

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$12.594

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$11.334

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1,880

$12.594

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$11.334

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MKK Technologies

India . 602 parts In-Stock

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$23.682

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602

$23.682

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DigiPath Technology Company

USA . 602 parts In-Stock

1+ parts

$23.682

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602

$23.682

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Native Components

USA . 771 parts In-Stock

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$28.843

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771

$28.843

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Northwest PG Solutions

USA . 31 parts In-Stock

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$31.727

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$28.554

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31

$31.727

$28.554

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Component Stockers USA

USA . 414 parts In-Stock

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$99.990

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414

$99.990

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Corphita

USA . 1,116 parts In-Stock

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Parana Technologies

USA . 799 parts In-Stock

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$15.058

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799

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$15.058

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Vigor

Singapore . 377 parts In-Stock

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377

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Overview

Unlock the potential of your designs with STMicroelectronics' E-L6569D MOSFET Gate Driver. Renowned for its exceptional reliability and advanced technology, STMicroelectronics delivers a high-performance solution that excels in automotive applications. With superior thermal management and robust supply voltage capabilities, the E-L6569D ensures efficient operation even under extreme conditions, offering you peace of mind and maximizing your project's success. Elevate your innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy integration into compact circuit designs, saving space and improving performance.

Maximum Supply Voltage: 16.6 V

With a high maximum supply voltage, this driver can support a range of applications in automotive and industrial settings.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB layout and ensures efficient use of space in circuit board design.

No. of Terminals: 8

Having 8 terminals provides flexibility in wiring configurations and functionality, accommodating various designs.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements on PCBs, which is crucial for compact electronic devices.

Minimum Supply Voltage: 10 V

This low minimum supply voltage allows for compatibility with a broader range of power supplies, enhancing design versatility.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in demanding environments, particularly in automotive applications.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures ensures performance stability in harsh environments, making this driver suitable for automotive and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility for soldering onto PCBs.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for low-profile designs within electronic modules.

Width: 3.9 mm

The compact width aids in efficient use of surface area on PCBs, contributing to space-saving designs.

High Side Driver: YES

As a high-side driver, it is ideal for controlling loads in various applications, providing versatility and control.

Length: 4.9 mm

Its short length helps optimize PCB real estate, benefitting compact product designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this driver meets strict industry standards for safety and durability.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better mechanical stability on PCBs.

Nominal Supply Voltage: 12 V

The nominal supply voltage aligns with automotive standards, enhancing compatibility with standard vehicle power systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables compatibility with various PCB designs and facilitates easier routing.

Nominal Output Peak Current Limit: 0.275 A

This current limit provides sufficient driving capability for controlling MOSFETs, ensuring effective performance in switching applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

As a half-bridge driver, it efficiently manages the operation of MOSFETs, making it ideal for motor control and power conversion applications.

Technical Specifications

MOSFET Gate Drivers E-L6569D attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.275 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

16.6 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

E-L6569D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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